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374424B60023G

Boyd

374424B60023G by Boyd

HEAT SINK; Profile: PIN FIN ARRAY; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: OMNIDIRECT; Length: 27 mm;

Median Price

$3.040

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 999 parts In-Stock

1+ parts

$3.040

100+ parts

-

1k+ parts

$2.700

10k+ parts

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999

$3.040

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$2.700

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Distributors (In-Stock)

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Velocity Electronics

USA . 1,080 parts In-Stock

1+ parts

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1,080

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Inventory MP

USA . 363 parts In-Stock

1+ parts

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363

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Bristol Electronics

USA . 363 parts In-Stock

1+ parts

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363

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Elcom Components

USA . 8 parts In-Stock

1+ parts

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8

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

GreenTree Electronics

Israel . 4,320 parts In-Stock

1+ parts

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4,320

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Abacus Technologies

USA . 864 parts In-Stock

1+ parts

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864

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Technical Specifications

Heat Sinks 374424B60023G attributes and parameters. Explore more Heat Sinks devices from Boyd

Device Specifications

Construction:

Fin

Profile:

Fin Orientation:

Physical Specifications

Height:

0.709 in (18 mm)

Width:

1.063 in (27 mm)

Length:

1.063 in (27 mm)

Material and Finish

Finish:

Anodized

Body Material Composition:

Color:

Black

Usage and Compatibility

Device Type:

Manufacturer Highlights

Boyd

Boyd is the world's leading innovator in sustainable engineered material and thermal solutions that make our customers’ products better, safer, faster, and more reliable. We develop and combine technologies to solve ambitious performance targets in our customers’ most critical applications. By implementing technologies and material science in novel ways to seal, protect, cool, and interface, Boyd has continually redefined the possible and championed customer success for over 90 years. Innovation demands for smaller, lighter, and faster technologies with intuitive new features compete with the need for more sustainable solutions. More smart functionality operating faster in tighter spaces with more sophisticated interfaces mean increased power density and more heat, electrical, and mechanical challenges. Adding further complexity, devices are used in unpredictable environments with harsh conditions and must be contaminant and waterproof, insulated against temperature extremes, and ruggedized. Not only are we determined to find solutions to these challenges, Boyd strives to simplify where possible and create the most wholistic, effective, and sustainable solutions.

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