Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Boyd's 508700B00000G Heat Sink has a Thermal Resistance of 27.2 ohm, Height of 4.83mm, and Length of 50.8mm. Ideal for cooling electronic components in compact spaces with its extruded aluminum construction and anodized finish.
Median Price
$2.461
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$2.412
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$2.338
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Low thermal resistance allows for efficient heat dissipation, making this heat sink suitable for cooling high-power components.
Designed specifically for heat dissipation, ensuring optimal performance in managing thermal loads.
Low profile design makes this heat sink ideal for applications with limited space for thermal management solutions.
Anodized finish provides corrosion resistance and enhances the durability of the heat sink for long-term reliability.
Compact width allows for easy integration into various electronic devices without adding bulk.
Extruded construction offers superior thermal conductivity, improving the overall cooling efficiency of the heat sink.
Stylish black color adds a sleek aesthetic to the heat sink, making it an attractive choice for visible cooling solutions.
Longitudinal fin orientation enhances airflow through the heat sink, optimizing heat dissipation capabilities.
Lightweight aluminum construction provides a good balance of thermal performance and durability for effective heat management.
Adequate length allows for efficient heat transfer and dissipation, making this heat sink a reliable choice for cooling electronic components.
Heat Sinks 508700B00000G attributes and parameters. Explore more Heat Sinks devices from Boyd
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Boyd is the world's leading innovator in sustainable engineered material and thermal solutions that make our customers’ products better, safer, faster, and more reliable. We develop and combine technologies to solve ambitious performance targets in our customers’ most critical applications. By implementing technologies and material science in novel ways to seal, protect, cool, and interface, Boyd has continually redefined the possible and championed customer success for over 90 years. Innovation demands for smaller, lighter, and faster technologies with intuitive new features compete with the need for more sustainable solutions. More smart functionality operating faster in tighter spaces with more sophisticated interfaces mean increased power density and more heat, electrical, and mechanical challenges. Adding further complexity, devices are used in unpredictable environments with harsh conditions and must be contaminant and waterproof, insulated against temperature extremes, and ruggedized. Not only are we determined to find solutions to these challenges, Boyd strives to simplify where possible and create the most wholistic, effective, and sustainable solutions.
1N4148WS
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SBAV99LT1G
Onsemi
SBAV99LT1G by Onsemi is a rectifier diode with a max repetitive peak reverse voltage of 100V. It has a small outline package style and a fast max reverse recovery time of 0.006 us. It is commonly used in applications requiring low power dissipation and high operating temperatures.
LM358AN
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM358N
Harris Semiconductor
CRG0805F10K
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10000 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
1N4148
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LL4148
Hy Electronic
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAV99
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SPC TECHNOLOGY/ MULTICOMP
LM358M
Texas Instruments
LM358M by Texas Instruments is an Operational Amplifier with 2 functions, featuring a max input offset voltage of 9000 uV and a nominal voltage of 5 V. It is commonly used in applications requiring high common mode rejection ratio and low bias current, such as sensor interfaces and signal conditioning circuits.
LM317AEMP/NOPB
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: SOP; Terminal Form: GULL WING; Qualification Status: Not Qualified; Width: 3.56 mm;
Kec
FDC5614P
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
KSZ9031RNXIC
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
MMBT2907ALT1G
MMBT2907ALT1G by Onsemi is a PNP BJT transistor with 100 min hFE, 60V VCEO, and 200MHz fT. Ideal for switching applications, it has a small outline package with Gull Wing terminals and can handle up to 0.6A of collector current.
SDR0604-101KL
Bourns
SDR0604-101KL by Bourns is a surface mount fixed inductor with a nominal inductance of 100 uH. It is a general purpose inductor suitable for power applications, with a max rated current of 0.52 A and a self-resonance frequency of 9 MHz.
LM317TG
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Minimum Input-Output Voltage Differential: 3 V; Qualification Status: Not Qualified; No. of Functions: 1;
General Semiconductor
SMBJ18CA
General Instrument
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBR1560CT
MBR1560CT by General Instrument is a common cathode rectifier diode with a max forward voltage of 0.75V and max output current of 15A. It is used for efficiency applications, has a package shape of rectangular, and can operate in temperatures ranging from -65 to 150 °C.
HAL-F12T
TDK
HAL-F12T by TDK is a heat sink with thermal resistance of 0.97 ohm, ideal for converters. With dimensions 35x69.9x122 mm and weight of 280 g, it features omnidirectional fin orientation for efficient heat dissipation in various applications.
M-B012
Cincon Electronics
M-B012 by Cincon Electronics is a black anodized heat sink with dimensions 116.8mm x 61.8mm x 25.4mm (LxWxH). Its fin construction and aluminum alloy body make it ideal for cooling electronic components in various applications like power supplies and industrial equipment.
258
Wakefield Thermal Solutions
258 by Wakefield Thermal Solutions is a black anodized aluminum heat sink with U profile, measuring 12.7mm x 6.4mm x 8.6mm and weighing 0.82g. Ideal for cooling electronic components in compact devices due to its small size and lightweight design.
Y92B-P150
Omron
HEAT SINK;
ATS-1106-C1-R0
Advanced Thermal Solutions
ATSEU-077C-C1-R0
ATS-1178-C1-R0
FK245MI247V
Fischer Elektronik & Kg
PSD1-2CB
Cts
PSD1-2CB by Cts is a HEAT SINK with thermal resistance of 14.4Ω, ideal for TRANSISTOR cooling. With a SCREW profile and dimensions of 55.37mm x 12.7mm x 35.05mm, it efficiently dissipates heat in electronic devices.
ATS-54350W-C1-R0
SW50-4G
Aavid Thermalloy
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: RADIAL; Color: BLACK; Height: 50 mm;
V7477Z2
Assmann Wsw Components
Heat Sinks;
530613B00000G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: TRANSVERSE; Finish: ANODIZED;
CR101-75AE
Ohmite Manufacturing
The Ohmite CR101-75AE Heat Sink features a thermal resistance of 4.2 ohm, aluminum alloy construction, and a height of 50mm. Ideal for applications requiring efficient heat dissipation in compact spaces such as electronic devices or industrial equipment.
374424B00035G
HEAT SINK; Profile: PIN FIN ARRAY; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: OMNIDIRECT; Width: 27 mm;
568303B00000G
HEAT SINK; Height: 31.75 mm; Finish: ANODIZED; Length: 45.97 mm; Thermal Resistance: 5.4 ohm; Width: 45.97 mm;
ICKBGA35X35X10
ICKBGA35X35X10 by Fischer Elektronik & Kg is a 10mm high, 35mm wide, and 35mm long black anodized heat sink with fin construction. Specifically designed for ICs, it efficiently dissipates heat to prevent overheating in electronic devices. Ideal for applications requiring compact cooling solutions.
ATS-61300W-C1-R0
Boyd
Boyd 530613B00000G Heat Sink has Thermal Resistance of 16.7 ohm, U Profile, and Aluminum Body Material. Ideal for cooling electronic components in compact spaces with its dimensions of 25.4mm x 12.7mm x 29.97mm.
HS201DR
Sensata Technologies
HEAT SINK; Profile: SCREW; Body Material: ALUMINUM ALLOY; Device Used On: RELAY; Fin Orientation: LONGITUDINAL; Weight: 353 g;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
508700B00000G
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL; Finish: ANODIZED; Length: 50.8 mm;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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