Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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ATS-1039-C2-R0 by Advanced Thermal Solutions is a 15mm high, 40mm wide, and 53mm long heat sink with pin fin array profile. Anodized in green color, it features omnidirectional fin orientation for efficient thermal management. Ideal for applications requiring compact cooling solutions.
Median Price
$15.190
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Nova Conductors
$12.810
TME
$13.260
$10.850
Vyrian
AZTECH Wire
$11.256
Continental Prestige Electronics
$12.554
Netroflash
Argo Parts USA
Efficiently dissipates heat to keep the electronic components cool and running smoothly.
Provides increased surface area for better heat dissipation and improved cooling performance.
Compact size allows for easy installation in tight spaces while still effectively cooling the components.
Anodized finish offers corrosion resistance and durability, extending the lifespan of the heat sink.
Optimal width to effectively cover the component for efficient heat dissipation.
Fin construction provides a large surface area for heat transfer, enhancing cooling performance.
Green color adds a touch of aesthetics to the heat sink and can be visually appealing in electronic setups.
Omni-directional fin orientation ensures equal heat distribution, improving overall cooling efficiency.
Ideal length to cover the length of the component and maximize heat dissipation across a larger area.
Heat Sinks ATS-1039-C2-R0 attributes and parameters. Explore more Heat Sinks devices from Advanced Thermal Solutions
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Advanced Thermal Solutions, Inc. (ATS) has been in business for more than 25 years as a leading-edge engineering and manufacturing company focused on the thermal management of electronics. Founded in 1989 as a consulting company, ATS has evolved into a complete thermal solutions provider and is world-renowned for its portfolio of more than 5,000 high- and ultra-performance heat sinks, its industry-leading liquid cooling solutions, the broadest off-the-shelf heat pipe line on the market, expert consulting and design services, research-quality test equipment, and leading-edge R&D. ATS has established its own manufacturing center in the U.S. and developed strategic partnerships with Asian manufacturers to provide its global customers with complete thermal solutions ready to tackle the industry’s toughest challenges. ATS is committed to providing the electronics industry with innovative, high-quality and cost-effective thermal management and packaging solutions. Our goal is to be our customers’ value-added supplier and success partner for all thermal and packaging needs - analysis, testing and final product.
2N2222A
Continental Device India
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148WS
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBR0520LT1
Onsemi
MBR0520LT1 by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring low power consumption in compact electronic devices. This single-configured diode is surface mountable and has a max repetitive peak reverse voltage of 20V, ideal for small outline package designs.
NE555D
NXP Semiconductors
SQUARE; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
BSS138BK,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Peak Reflow Temperature (C): 260; Additional Features: LOGIC LEVEL COMPATIBLE; Maximum Operating Temperature: 150 Cel;
LM555CN
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
BSS138
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Operating Mode: ENHANCEMENT MODE;
M85049/85-08W02
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
OPA2277UA/2K5
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1N4148WT
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3 ohm; Minimum DS Breakdown Voltage: 50 V; Terminal Form: GULL WING;
1N4148
Sinyork
RECTIFIER DIODE; Surface Mount: NO; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Output Current: .15 A; Maximum Repetitive Peak Reverse Voltage: 100 V; No. of Phases: 1;
SMBJ18CA
General Instrument
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Rugao Dachang Electronic
BSS123,215
NXP Semiconductors' BSS123,215 is a N-CHANNEL FET for SWITCHING applications. Features include 100V DS Breakdown Voltage, 0.17A Drain Current, and 6 ohm On Resistance. With GULL WING terminals and ENHANCEMENT MODE operation, it's ideal for small outline packages in various electronic devices.
LM78L05ACMX/NOPB
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 8; Package Code: SOP; Terminal Form: GULL WING; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
LM317T
Tt Electronics Plc
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Qualification Status: Not Qualified; JESD-30 Code: R-PSFM-T3;
Texas Instruments
LM317T by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and max input-output voltage differential of 40V. Operating temperature ranges from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in electronic circuits. With a max output current of 1.5A, this through-hole package regulator is ideal for power supply designs where adjustable voltage levels are needed.
BSS138-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain Current (ID): .2 A; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 40; Minimum DS Breakdown Voltage: 60 V;
26923
Trenz Electronic
HEAT SINK; Profile: SCREW; Body Material: ALUMINIUM ALLOY; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL; Weight: 60 g;
V4330N
Assmann Wsw Components
V4330N by Assmann Wsw Components is a 12mm tall black anodized aluminum heat sink with thermal resistance of 12 ohm. Ideal for applications requiring efficient heat dissipation, such as in electronic devices or computer components due to its longitudinal fin orientation and compact size of 20x29 mm.
SA-LED-125E
Ohmite Manufacturing
HEAT SINK;
576802B04000G
Boyd
Boyd's 576802B04000G Heat Sink has a Thermal Resistance of 27.3 ohm, U Profile, and is made of Aluminum. It is designed for use on Transistors, with a Height of 19.05mm, Width of 12.7mm, and Length of 14.48mm.
507302B00000G
Boyd 507302B00000G Heat Sink has Thermal Resistance of 24 ohm, Height 9.65mm, and Width 19.05mm. Ideal for TRANSISTOR cooling applications due to FIN construction and ALUMINUM body material with ANODIZED finish.
SK68100SA
Fischer Elektronik & Kg
SK68100SA by Fischer Elektronik & Kg is a 100mm extruded heat sink with thermal resistance of 5.85 ohm. It features screw profile, anodized finish, and longitudinal fin orientation. Ideal for use on transistors to dissipate heat efficiently in electronic devices.
CR101-75AE
The Ohmite CR101-75AE Heat Sink features a thermal resistance of 4.2 ohm, aluminum alloy construction, and a height of 50mm. Ideal for applications requiring efficient heat dissipation in compact spaces such as electronic devices or industrial equipment.
WV-T220-101E
7G0011A
TDK
The TDK 7G0011A heat sink has a thermal resistance of 8.24Ω, with dimensions of 5.7mm x 37.4mm x 50mm and weight of 14.6g. It is designed for converters, featuring an omnidirectional fin orientation for efficient heat dissipation in various applications.
PF527G
Aavid Thermalloy
HEAT SINK; Body Material: ALUMINUM; Finish: ANODIZED; Height: 25 mm; Color: BLACK; Thermal Resistance: 7.4 ohm;
321527B00000G
Boyd 321527B00000G Heat Sink has Thermal Resistance of 35.2Ω, Height of 12.7mm, and Radial Fin Orientation. Ideal for cooling electronic components in compact spaces with high thermal demands.
Y92B-P100
Omron
DV-T263-201E
3-1542003-4
TE Connectivity
TE Connectivity 3-1542003-4 Heat Sink, UL approved with 15W power rating. Aluminum body, radial fin orientation for IC devices. Clip profile for efficient heat dissipation in various applications.
FA-T220-25E
The Ohmite FA-T220-25E heat sink, made of aluminum, measures 25.4mm in height, 25mm in width, and 41.6mm in length. With an anodized finish and weighing 17.5g, it is suitable for various thermal management applications due to its omnidirectional fin orientation.
APF40-40-13CB/A01
Cts
The Cts APF40-40-13CB/A01 is a 40x40mm black adhesive heat sink with thermal resistance of 9.9 ohm, ideal for ICs. Made of aluminum alloy, it has a height of 12.7mm and anodized finish, providing efficient heat dissipation in compact spaces.
FK231SA220
HEAT SINK; Body Material: ALUMINUM; Height: 9.5 mm; Length: 19 mm; Width: 13.5 mm;
7106D/TRG
HEAT SINK; Body Material: COPPER; Device Used On: IC; Height: 9.52 mm; Packing Method: TAPE AND REEL; Width: 14.99 mm;
WA-T247-101E
Ohmite's WA-T247-101E heat sink has thermal resistance of 11Ω, height 30.5mm, and length 23.1mm. Ideal for transistors, this extruded aluminum alloy clip-on heat sink with longitudinal fin orientation is anodized black and weighs 12g.
EV-T220-51E
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ATS-1181-C1-R0
Advanced Thermal Solutions
ATS-1146-C1-R0
HEAT SINK; Body Material: CHROMATE; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL; Width: 59 mm; Additional Features: MAXIFLOW, DEVICE USED ON: HALF BRICK DC-DC CONVERTER;
ATS-1144-C1-R0
ATS-1138-C1-R0
ATS-1178-C1-R0
ATS-1143-C1-R0
ATS-1039-C1-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Color: GREEN; Finish: ANODIZED;
ATS-1042-C1-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FLARED; Fin Orientation: OMNIDIRECT; Length: 64 mm; Color: GREEN;
ATS-1042-C2-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FLARED; Fin Orientation: OMNIDIRECT; Color: GREEN; Finish: ANODIZED;
ATS-1106-C1-R0
ATS-1038-C1-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Length: 47 mm; Height: 10 mm;
ATS-1038-C2-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Width: 40 mm; Color: GREEN;
ATS-1038-C3-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Length: 47 mm; Color: GREEN;
ATS-1039-C3-R0
ATS-1040-C1-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Finish: ANODIZED; Width: 40 mm;
ATS-1040-C2-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Width: 40 mm; Length: 65 mm;
ATS-1040-C3-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FLARED; Fin Orientation: OMNIDIRECT; Finish: ANODIZED; Height: 25 mm;
ATS-1042-C3-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FLARED; Fin Orientation: OMNIDIRECT; Length: 64 mm; Height: 15 mm;
Supply Digital Components
$106.00
$54.25
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12,000 In-Stock
Total price ≈ $80,197.29
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