Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
ATS-1042-C2-R0 by Advanced Thermal Solutions is a 15mm high, 41mm wide, and 64mm long heat sink with pin fin array profile. It features anodized finish, flared construction, and omnidirectional fin orientation. Ideal for cooling applications in electronics to dissipate heat efficiently.
Median Price
$21.920
Lifecycle Status
Suppliers In-Stock
3
In-Stock Inventory
1k+
DigiKey
1+ parts
100+ parts
$17.164
1k+ parts
$15.752
10k+ parts
-
Nova Conductors
$12.810
Vyrian
AZTECH Wire
$5.539
Aranea Global
$12.554
$12.052
Continental Prestige Electronics
Argo Parts USA
Effective at dissipating heat from electronic components, ensuring efficient cooling.
Pin fin arrays provide increased surface area for better heat dissipation and cooling performance.
Compact size for easy installation in tight spaces without compromising cooling efficiency.
Anodized finish improves durability and corrosion resistance of the heat sink.
Optimal width to effectively cover the heat-generating component for efficient heat dissipation.
Flared construction enhances heat dissipation by facilitating better airflow and cooling.
Green color can be aesthetically pleasing and may indicate environmentally friendly materials or processes.
Omnidirectional fin orientation ensures heat is dissipated evenly in all directions, improving overall cooling performance.
Adequate length to cover the length of the heat-generating component for effective heat dissipation.
Heat Sinks ATS-1042-C2-R0 attributes and parameters. Explore more Heat Sinks devices from Advanced Thermal Solutions
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Advanced Thermal Solutions, Inc. (ATS) has been in business for more than 25 years as a leading-edge engineering and manufacturing company focused on the thermal management of electronics. Founded in 1989 as a consulting company, ATS has evolved into a complete thermal solutions provider and is world-renowned for its portfolio of more than 5,000 high- and ultra-performance heat sinks, its industry-leading liquid cooling solutions, the broadest off-the-shelf heat pipe line on the market, expert consulting and design services, research-quality test equipment, and leading-edge R&D. ATS has established its own manufacturing center in the U.S. and developed strategic partnerships with Asian manufacturers to provide its global customers with complete thermal solutions ready to tackle the industry’s toughest challenges. ATS is committed to providing the electronics industry with innovative, high-quality and cost-effective thermal management and packaging solutions. Our goal is to be our customers’ value-added supplier and success partner for all thermal and packaging needs - analysis, testing and final product.
EPCS4SI8N
Intel
EPCS4SI8N by Intel is a small outline flash memory with 512Kx8 organization, operating at 3.3V. It features a max clock frequency of 40MHz and endurance of 100k write/erase cycles. Ideal for industrial applications requiring configuration memory with serial interface and low standby current consumption.
M39029/56-351
Itt Cannon
CONNECTOR ACCESSORY; MIL Conformity: YES; Terminal Type: WIRE; IEC Conformity: NO; Alternate Contact Sources: ITT CANNON; Associated Military - Specifications: MIL-C-38999;
BAV99
Vishay Intertechnology
Vishay Intertechnology's BAV99 diode features a max forward voltage of 1.3V and a max output current of 0.15A, making it ideal for rectification applications. With a small outline package style and dual terminal position, this series-connected diode is designed for surface mount usage in various electronic circuits with an operating temperature range from -55°C to 150°C.
2N2222A
International Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SS14
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
AMS1117-3.3
Advanced Monolithic Systems
AMS1117-3.3 by Advanced Monolithic Systems is a fixed positive single output LDO regulator with 1A max output current, 3% voltage tolerance, and 1.3V dropout voltage. Ideal for applications requiring stable 3.3V supply in compact designs due to its small outline package and excellent load regulation of 0.025%.
LM358AN
Signetics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
ULN2803A
Allegro MicroSystems
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Maximum Operating Temperature: 85 Cel; Terminal Form: THROUGH-HOLE;
LM317T
Onsemi
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-PSFM-T3; Adjustability: ADJUSTABLE; Package Equivalence Code: SIP3,.1TB;
LL4148
Surge Components
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N7002
Silicon Standard
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): .225 W; Maximum Drain-Source On Resistance: 7.5 ohm; Transistor Element Material: SILICON;
DS18B20U+
Analog Devices
DS18B20U+ by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
1N4148WS
First Components International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138BKW,115
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Terminal Finish: TIN; No. of Terminals: 3; Additional Features: LOGIC LEVEL COMPATIBLE;
Kec
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Non Repetitive Peak Forward Current: 2 A; Config: SINGLE; Maximum Operating Temperature: 200 Cel;
Daco Semiconductor
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
LM358MX
Texas Instruments
LM358MX by Texas Instruments is a dual operational amplifier with a max input offset voltage of 9000 uV. It has a nominal voltage of 5V and a min voltage gain of 15000. This op amp is commonly used in applications requiring amplification and signal conditioning.
FK237SA220V
Fischer Elektronik & Kg
FK237SA220V by Fischer Elektronik & Kg is a black anodized aluminum heat sink measuring 12.7mm in height, 14.5mm in width, and 19.05mm in length. Primarily used on transistors for effective heat dissipation in electronic devices.
581002B02500G
Boyd
Boyd's 581002B02500G Heat Sink has a Thermal Resistance of 17.4 ohm, Height of 25.4mm, and is made of Aluminum. Ideal for ICs, this anodized black heat sink with longitudinal fin orientation efficiently dissipates heat in electronic devices.
573300D00010G
Boyd's 573300D00010G Heat Sink, with U profile, is 10.16mm high and 12.7mm wide. Constructed through extrusion, it has a SN/NI finish and comes in gray color. Ideal for applications requiring efficient heat dissipation in compact spaces due to its small dimensions and effective thermal properties.
7136DG
Aavid Thermalloy
HEAT SINK; Profile: U; Body Material: COPPER; Construction: CLIP; Fin Orientation: TRANSVERSE; Finish: TIN;
518-95AB
Ohmite Manufacturing
The Ohmite Manufacturing 518-95AB Heat Sink is an extruded aluminum device with dimensions of 61x57.9x24.1mm (LxWxH). It features an anodized black finish and is commonly used in electronic applications for thermal management due to its efficient heat dissipation capabilities.
625-25AB-T4E
WAKEFIELD-VETTE INC
625-25AB-T4E by Wakefield-vette is a heat sink with pin fin array profile, 6.4mm height, and anodized finish. Ideal for cooling applications in electronics due to its aluminum construction, omnidirectional fin orientation, and compact dimensions of 25x25 mm. Weighing only 5.45g, it offers efficient heat dissipation in various devices.
MA-302-55E
HEAT SINK;
7109DG
The Boyd 7109DG heat sink has a thermal resistance of 11 ohm, made of copper with TIN finish. With dimensions of 25.4mm x 11.43mm x 19.38mm, it's ideal for ICs due to its folded back fin orientation and efficient heat dissipation capabilities.
V7236C
Assmann Wsw Components
Heat Sinks;
658-35AB
Ohmite Manufacturing's 658-35AB heat sink features PIN FIN ARRAY profile, 8.9mm height, and anodized finish. Ideal for applications requiring efficient thermal dissipation in compact spaces like electronic devices or LED lighting systems.
FK24413D2PAK
FK24413D2PAK by Fischer Elektronik & Kg is a copper heat sink measuring 26x13x10mm and weighing 3.6g. Primarily used on ICs, it efficiently dissipates heat in electronic devices, ensuring optimal performance and reliability.
ATSEU-077D-C4-R0
Advanced Thermal Solutions
V7236A1
V-1100-SMD/A
PF750G
HEAT SINK; Profile: U; Body Material: COPPER; Thermal Resistance: 20.3 ohm; Width: 11 mm; Finish: TIN;
HS00110
TDK
The TDK HS00110 Heat Sink has a thermal resistance of 3.5 ohm and measures 38.1mm in height, 61mm in width, and 101.6mm in length. It is constructed with fin pin design for efficient heat dissipation and weighs 158g. Ideal for use on converters due to its omnidirectional fin orientation.
FK24408D2PAK
FK24408D2PAK by Fischer Elektronik & Kg is a copper heat sink measuring 26x8x10mm and weighing 2.2g. Primarily used on ICs, it efficiently dissipates heat to prevent overheating in electronic devices. Ideal for bulk packaging applications due to its compact size and lightweight design.
ATS-1146-C1-R0
ATS-1146-C1-R0 by Advanced Thermal Solutions is a 22.9mm tall, 59mm wide heat sink with gold anodized finish. Constructed from extruded chromate material, it features longitudinal fin orientation for efficient thermal dissipation. Ideal for applications requiring compact cooling solutions in electronic devices.
508700B00000G
Boyd's 508700B00000G Heat Sink has a Thermal Resistance of 27.2 ohm, Height of 4.83mm, and Length of 50.8mm. Ideal for cooling electronic components in compact spaces with its extruded aluminum construction and anodized finish.
DV-T263-201E
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ATS-1181-C1-R0
HEAT SINK; Body Material: CHROMATE; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL; Width: 59 mm; Additional Features: MAXIFLOW, DEVICE USED ON: HALF BRICK DC-DC CONVERTER;
ATS-1144-C1-R0
ATS-1138-C1-R0
ATS-1178-C1-R0
ATS-1143-C1-R0
ATS-1039-C1-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Color: GREEN; Finish: ANODIZED;
ATS-1039-C2-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Length: 53 mm; Finish: ANODIZED;
ATS-1042-C1-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FLARED; Fin Orientation: OMNIDIRECT; Length: 64 mm; Color: GREEN;
ATS-1106-C1-R0
ATS-1039-C3-R0
ATS-1040-C3-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FLARED; Fin Orientation: OMNIDIRECT; Finish: ANODIZED; Height: 25 mm;
ATS-1041-C1-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FLARED; Fin Orientation: OMNIDIRECT; Length: 57 mm; Width: 41 mm;
ATS-1041-C2-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FLARED; Fin Orientation: OMNIDIRECT; Finish: ANODIZED; Height: 10 mm;
ATS-1041-C3-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FLARED; Fin Orientation: OMNIDIRECT; Width: 41 mm; Length: 57 mm;
ATS-1042-C3-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FLARED; Fin Orientation: OMNIDIRECT; Length: 64 mm; Height: 15 mm;
ATS-1043-C1-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FLARED; Fin Orientation: OMNIDIRECT; Width: 41 mm; Height: 25 mm;
ATS-1043-C2-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FLARED; Fin Orientation: OMNIDIRECT; Height: 25 mm; Finish: ANODIZED;
ATS-1043-C3-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FLARED; Fin Orientation: OMNIDIRECT; Finish: ANODIZED; Length: 79 mm;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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