Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Heat Sinks DA-T263-301E-TR attributes and parameters. Explore more Heat Sinks devices from Ohmite Manufacturing
Device Type:
measuring instruments.
1N4148
Weitron Technology
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb);
SMBJ18CA
Db Lectro
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN-2803A
Sprague Electric
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
EPCS4SI8N
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
Gulf Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 175 Cel; Maximum Reverse Recovery Time: .004 us; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V;
ULN2803A
Motorola
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Terminal Position: DUAL; JESD-30 Code: R-PDIP-T18;
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Config: SINGLE; No. of Phases: 1; No. of Elements: 1;
MBR0520LT1G
Onsemi
MBR0520LT1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, has a peak reflow temperature of 260°C, and a repetitive peak reverse voltage of 20V. This diode is ideal for applications requiring high-speed switching in compact electronic devices.
Dc Components
AH180-WG-7
Diodes Incorporated
AH180-WG-7 by Diodes Inc. is a magnetic field sensor with 1.5mT hysteresis, 0.30V output range, and 9mA max operating current. Ideal for applications requiring non-inverting analog voltage output in a compact rectangular package suitable for surface mount installations.
M39029/56-351
Itt Cannon
CONNECTOR ACCESSORY; MIL Conformity: YES; Terminal Type: WIRE; IEC Conformity: NO; Alternate Contact Sources: ITT CANNON; Associated Military - Specifications: MIL-C-38999;
2N2222A
National Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .5 A;
Sinyork
RECTIFIER DIODE; Surface Mount: NO; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Output Current: .15 A; Maximum Repetitive Peak Reverse Voltage: 100 V; No. of Phases: 1;
1N4148WS
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Jiangsu Jiejie Microelectronics
New England Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Ksl Microdevices
Taiwan Semiconductor
NE555D
NXP Semiconductors
SQUARE; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
FK237SA220H
Fischer Elektronik & Kg
FK237SA220H by Fischer Elektronik & Kg is a black anodized aluminum heat sink with dimensions 19.05mm x 14.5mm x 12.7mm (LxWxH). Designed for transistors, it efficiently dissipates heat in electronic devices, ensuring optimal performance and longevity.
FK24413DPAK
FK24413DPAK by Fischer Elektronik & Kg is a 10x13x23 mm copper heat sink weighing 3.3g, designed for ICs. It efficiently dissipates heat in electronic devices, ensuring optimal performance and reliability in various applications.
C247-025-1VE
Ohmite Manufacturing
7136DG
Boyd
Boyd's 7136DG Heat Sink features a Thermal Resistance of 19.7 ohm, U Profile, and Copper Body Material. Ideal for applications requiring efficient heat dissipation in compact spaces with its dimensions of 13.08mm W x 21.54mm H x 13.21mm L and transverse fin orientation.
680-5A
WAKEFIELD-VETTE INC
680-5A by Wakefield-vette is a black anodized aluminum heat sink with dimensions of 46mm x 46mm x 12.7mm and weight of 31.75g. Its omnidirectional fin orientation makes it suitable for cooling electronic components in various applications.
SW25-2G
Aavid Thermalloy
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: RADIAL; Color: BLACK; Length: 34.5 mm;
374724B60024G
374724B60024G by Boyd is a PIN FIN ARRAY HEAT SINK with dimensions of 35mm x 35mm x 18mm. Constructed from black anodized aluminum, it features omnidirectional fin orientation. Ideal for applications requiring efficient heat dissipation in compact spaces.
FK24413DPAKTR
FK24413DPAKTR by Fischer Elektronik & Kg is a 10x13x23mm copper heat sink weighing 3.3g, suitable for ICs. It comes in tape and reel packaging, ideal for thermal management applications due to its compact size and efficient heat dissipation capabilities.
658-35AB
Ohmite Manufacturing's 658-35AB heat sink features PIN FIN ARRAY profile, 8.9mm height, and anodized finish. Ideal for applications requiring efficient thermal dissipation in compact spaces like electronic devices or LED lighting systems.
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Weight: 6.7 g; Color: BLACK;
APA501-60-003
Astec America
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: LONGITUDINAL; Height: 22.9 mm; Width: 57.5 mm;
7106PD/TR
HEAT SINK; Body Material: COPPER; Finish: TIN; Packing Method: TAPE AND REEL; Height: 9.52 mm; Thermal Resistance: 15 ohm;
527-45AB
Ohmite Manufacturing's 527-45AB heat sink is 11.4mm tall, 57.9mm wide, and 61mm long with an anodized black finish. Constructed from extruded aluminum, it efficiently dissipates heat in electronic devices. Ideal for applications requiring compact cooling solutions.
ICKPGA17X17X12
581002B02500G
HEAT SINK; Body Material: ALUMINUM; Device Used On: IC; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL; Color: BLACK;
SK481000SA
SK481000SA by Fischer Elektronik & Kg is a 1000mm long, 20mm high black anodized heat sink with thermal resistance of 3.5 ohm. It is used on transistors for effective heat dissipation due to its extruded construction and longitudinal fin orientation.
FK24413D3PAKTR
FK24413D3PAKTR by Fischer Elektronik & Kg is a 10x13x31mm copper heat sink weighing 3.9g, suitable for ICs. Packed in tape and reel, it efficiently dissipates heat in electronic devices. Ideal for compact applications requiring effective thermal management.
HTS501-P
TE Connectivity
TE Connectivity's HTS501-P heat sink, with UL approval, features a 9.06mm height and 34.92mm diameter aluminum body for ICs up to 15W power rating. Its radial fin orientation and clip profile make it ideal for efficient heat dissipation in various electronic applications.
FA-T220-25E
The Ohmite FA-T220-25E heat sink, made of aluminum, measures 25.4mm in height, 25mm in width, and 41.6mm in length. With an anodized finish and weighing 17.5g, it is suitable for various thermal management applications due to its omnidirectional fin orientation.
518-95AB
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Finish: ANODIZED; Height: 24.1 mm; Width: 57.9 mm;
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DA-T263-101E-TR
DA-T263-101E-TR by Ohmite Manufacturing is a heat sink with dimensions of 10.16mm x 12.7mm x 25.91mm and a weight of 3.8g. It is made of anodized aluminum and is used on transistors for thermal management purposes.
DA-T263-101E
Ohmite DA-T263-101E is a 10.16mm tall, 12.7mm wide black anodized aluminum heat sink weighing 3.8g. With extruded construction and fin pin orientation, it's ideal for use on transistors to dissipate heat efficiently in electronic devices.
DA-T263-201E-TR
DA-T263-201E
DA-T268-101E-TR
DA-T268-101E
HEAT SINK; Body Material: ALUMINIUM ALLOY; Device Used On: TRANSISTOR; Finish: ANODIZED; Width: 12.7 mm; Length: 25.91 mm;
DA-T268-301E-TR
DA-T268-301E
HEAT SINK; Body Material: ALUMINIUM ALLOY; Device Used On: TRANSISTOR; Fin Orientation: LONGITUDINAL; Height: 11.6 mm; Length: 40.2 mm;
DA-T263-301E
DA-T263-401E-TR
HEAT SINK; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Construction: EXTRUDED; Fin Orientation: FIN PIN; Weight: 3.9 g;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
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12,000 In-Stock
Total price ≈ $80,197.29
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