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374724B00032G

Boyd

374724B00032G by Boyd

Boyd's 374724B00032G Heat Sink features a PIN FIN ARRAY profile with 18mm height and 35mm width. Constructed from aluminum, it has an anodized finish and omnidirectional fin orientation. Ideal for thermal management in electronic devices requiring efficient heat dissipation.

Median Price

$3.201

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,201 parts In-Stock

1+ parts

$3.980

100+ parts

$3.119

1k+ parts

$2.819

10k+ parts

$2.717

1,201

$3.980

$3.119

$2.819

$2.717

Arrow

USA . 385 parts In-Stock

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$3.201

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385

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$3.201

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Verical

USA . 385 parts In-Stock

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$3.201

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385

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$3.201

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Semtec, LLC

USA . 40 parts In-Stock

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40

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LWI Electronics Inc

India . 2 parts In-Stock

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Perfect Parts

USA . 3,387 parts In-Stock

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3,387

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Abacus Technologies

USA . 672 parts In-Stock

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672

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Speed Components Ltd (Excess)

Israel . 100 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of Boyd's 374724B00032G heat sink. Designed with precision and expertise, this pin fin array heat sink offers exceptional thermal performance for a wide range of applications. Whether you're in need of cooling solutions for electronics, LED lighting, or power supplies, this anodized black aluminum heat sink has got you covered. Trust Boyd to deliver superior heat dissipation, durability, and efficiency, ensuring your devices stay cool and operating at their best. Upgrade to the 374724B00032G today and experience the difference!

Feature Benefit Bullets

Thermal Device Type: HEAT SINK

Heat sinks are essential for dissipating heat generated by electronic components, ensuring optimal performance and longevity.

Profile: PIN FIN ARRAY

Pin fin arrays offer increased surface area for better heat dissipation, making this heat sink more efficient at cooling.

Height: 18 mm

The compact height allows for easy installation in confined spaces without compromising cooling performance.

Finish: ANODIZED

Anodized finish provides corrosion resistance and a sleek appearance, enhancing the durability and aesthetics of the heat sink.

Width: 35 mm

Moderate width offers a balance between surface area and space constraints, making it a versatile option for various applications.

Construction: FIN

Fin construction allows for efficient heat transfer and airflow, contributing to the overall effectiveness of the heat sink.

Color: BLACK

Black coloration provides heat absorption properties and a visually appealing look that complements many electronic devices.

Fin Orientation: OMNIDIRECT

Omnidirectional fin orientation ensures heat is dissipated evenly in all directions, optimizing thermal management in diverse environments.

Body Material: ALUMINUM

Aluminum is lightweight, cost-effective, and has excellent thermal conductivity, making it an ideal material for heat sinks.

Length: 35 mm

The length accommodates various electronic components and allows for efficient heat dissipation across the entire surface of the heat sink.

Technical Specifications

Heat Sinks 374724B00032G attributes and parameters. Explore more Heat Sinks devices from Boyd

Device Specifications

Construction:

Fin

Profile:

Fin Orientation:

Physical Specifications

Height:

0.709 in (18 mm)

Width:

1.378 in (35 mm)

Length:

1.378 in (35 mm)

Material and Finish

Finish:

Anodized

Body Material Composition:

Color:

Black

Usage and Compatibility

Device Type:

Manufacturer Highlights

Boyd

Boyd is the world's leading innovator in sustainable engineered material and thermal solutions that make our customers’ products better, safer, faster, and more reliable. We develop and combine technologies to solve ambitious performance targets in our customers’ most critical applications. By implementing technologies and material science in novel ways to seal, protect, cool, and interface, Boyd has continually redefined the possible and championed customer success for over 90 years. Innovation demands for smaller, lighter, and faster technologies with intuitive new features compete with the need for more sustainable solutions. More smart functionality operating faster in tighter spaces with more sophisticated interfaces mean increased power density and more heat, electrical, and mechanical challenges. Adding further complexity, devices are used in unpredictable environments with harsh conditions and must be contaminant and waterproof, insulated against temperature extremes, and ruggedized. Not only are we determined to find solutions to these challenges, Boyd strives to simplify where possible and create the most wholistic, effective, and sustainable solutions.

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