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3-1542003-4

TE Connectivity

3-1542003-4 by TE Connectivity

TE Connectivity 3-1542003-4 Heat Sink, UL approved with 15W power rating. Aluminum body, radial fin orientation for IC devices. Clip profile for efficient heat dissipation in various applications.

Median Price

$13.490

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 150 parts In-Stock

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Vyrian

USA . 6,048 parts In-Stock

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VNN

France . 861 parts In-Stock

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Semicontronic

India . 418 parts In-Stock

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$6.000

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$5.850

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$5.820

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AZTECH Wire

Italy . 208 parts In-Stock

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$13.440

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Continental Prestige Electronics

USA . 1,246 parts In-Stock

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$13.220

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Netroflash

USA . 50 parts In-Stock

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$12.815

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$12.546

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Argo Parts USA

USA . 4,376 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,057 parts In-Stock

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Overview

Boost your electronics' performance with the TE Connectivity 3-1542003-4 Heat Sink. Crafted by industry leader TE Connectivity, this heat sink is designed to efficiently dissipate heat and improve the longevity of your devices. Perfect for IC applications, this UL-approved heat sink offers a sleek clip design and radial fin orientation, ensuring optimal thermal management. Say goodbye to overheating issues and hello to enhanced device performance with the TE Connectivity 3-1542003-4 Heat Sink.

Feature Benefit Bullets

Approvals (V): UL

Having UL approval ensures that the heat sink meets safety standards and regulations, giving customers peace of mind when using it.

Thermal Device Type: HEAT SINK

As a heat sink, this product is specifically designed to efficiently dissipate heat away from the IC, ensuring optimal performance and longevity of the electronic component.

Profile: CLIP

The clip profile makes it easy to attach and detach the heat sink from the IC, simplifying installation and maintenance processes.

Fin Orientation: RADIAL

Radial fin orientation allows for better airflow and heat dissipation compared to other orientations, making it more effective in cooling the IC.

Body Material: ALUMINUM

Aluminum is a lightweight and highly conductive material, making it efficient in transferring heat away from the IC and improving overall thermal performance.

Power (Rated): 15 W

With a rated power of 15 W, this heat sink is suitable for use on ICs with moderate power dissipation, providing effective cooling without being overkill.

Device Used On: IC

Designed for use on ICs, this heat sink is optimized to fit the specific requirements of electronic components, ensuring efficient heat dissipation and prolonging the life of the IC.

Technical Specifications

Heat Sinks 3-1542003-4 attributes and parameters. Explore more Heat Sinks devices from TE Connectivity

Device Specifications

Profile:

Fin Orientation:

Standards:

UL

Material and Finish

Body Material Composition:

Thermal Specifications

Rated Power:

15 W

Usage and Compatibility

Device Type:

Compatible Device:

IC

PCN

Manufacturer Highlights

TE Connectivity

TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Terrence R. Curtin

Executive VP, CFO

Heath A. Mitts

Senior VP, Principal Accounting Officer

Robert J. Ott

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