Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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ICKBGA10X10X10 by Fischer Elektronik & Kg is a 10mm black anodized heat sink with fin construction. Ideal for ICs, it offers efficient thermal dissipation with dimensions of 10x10x10 mm. Perfect for compact electronic devices requiring effective heat management.
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$1.920
$1.590
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$2.157
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Element14
$2.199
$2.102
$2.058
$1.703
Farnell
$2.604
$1.493
Chip1Stop
$4.020
Verical
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$0.821
DigiKey
$0.850
TME
$2.000
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Nova Conductors
$2.227
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Bastille Electronics
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The thermal device type being a heat sink indicates that this product is specifically designed to efficiently dissipate heat from electronic components such as ICs, ensuring optimal performance and longevity.
The compact height of 10 mm allows for easy integration into various electronic devices without taking up too much space, making it ideal for applications where size constraints are a concern.
The black anodized finish not only enhances the aesthetic appeal of the heat sink but also improves its thermal performance by increasing heat dissipation through radiation, resulting in better cooling efficiency.
The narrow width of 10 mm enables the heat sink to be used in tight spaces or in close proximity to other components, offering versatile installation options for different electronic systems.
The fin construction of the heat sink provides a larger surface area for heat dissipation, allowing for more efficient cooling of the IC or other components it is used on, thereby preventing overheating and potential damage.
With a length of 10 mm, this heat sink is designed to provide effective thermal management for the specific electronic components it is intended for while maintaining a compact and space-saving form factor.
Being designed for use on ICs, this heat sink is tailored to meet the thermal requirements of integrated circuits, ensuring stable and reliable operation by keeping temperatures within safe limits, contributing to the overall performance and longevity of the device.
Heat Sinks ICKBGA10X10X10 attributes and parameters. Explore more Heat Sinks devices from Fischer Elektronik & Kg
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Device Type:
Compatible Device:
NDT2955
Onsemi
NDT2955 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 15A and EAS of 174mJ, suitable for ENHANCEMENT MODE operation. With a compact SMALL OUTLINE package and -55 to 150 °C operating range, it offers efficient power dissipation up to 3W.
BAT54SLT1G
BAT54SLT1G by Onsemi is a fast recovery Schottky diode with 2 elements in series connected configuration. It has a max reverse recovery time of 0.005 us and a max forward voltage of 0.8 V. Ideal for applications requiring high-speed rectification, it operates b/w -55 to 150 °C and can handle a max output current of 0.2 A.
M24308/2-1F
TE Connectivity
TE Connectivity's M24308/2-1F D-Sub Connector features 9 contacts, 2 rows, and a shell size of 1/E. With a rated current of 7.5A, it operates b/w -55°C to 125°C. Ideal for cable mounting applications, this connector has a steel shell with cadmium finish and uses crimp termination for female contact pins.
2N7002
Comchip Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; Operating Mode: ENHANCEMENT MODE;
261
Micronetics
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (Abs) (ID): 2.5 A;
1N4148
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148WS
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Promax-johnton
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
CRG0805F10K
TE Connectivity's CRG0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in various electronic circuits due to its compact size and high temperature rating.
LM107H/883
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Average Bias Current (IIB): .1 uA;
LM555CN
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
LM317T
Motorola
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; No. of Outputs: 1; Package Equivalence Code: SIP3,.1TB;
M85049/85-08W02
Amphenol
CIRCULAR CONN ACCESSORY; Shell Sizes: 8; 9; IEC Conformity: NO; MIL-Connector Accessory Name: BAND LOCK ADAPTER; MIL Conformity: YES; DIN Conformity: NO;
DS18B20U+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: SQUARE; Housing: PLASTIC; Minimum Supply Voltage: 3 V;
C1005X7R1E103K050BB
TDK
The TDK C1005X7R1E103K050BB is a ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 25V. It features X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications requiring compact size and stable performance in various electronic circuits.
2N2222A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
06035C103KAT2A
KYOCERA AVX
06035C103KAT2A by KYOCERA AVX is a SMT ceramic capacitor with 0.01uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and 10% tolerance. Ideal for applications requiring compact surface mount capacitors with stable performance in a wide temperature range.
BSS138LT3G
BSS138LT3G by Onsemi is a N-CHANNEL FET with a min DS breakdown voltage of 50V. It is used for switching applications and has a max drain current of 0.2A and max drain-source on resistance of 3.5 ohm.
BAV99
Vishay Intertechnology
Vishay Intertechnology's BAV99 diode features a max forward voltage of 1.3V and a max output current of 0.15A, making it ideal for rectification applications. With a small outline package style and dual terminal position, this series-connected diode is designed for surface mount usage in various electronic circuits with an operating temperature range from -55°C to 150°C.
HS151DR
Crydom
HEAT SINK;
ICKBGA35X35
Fischer Elektronik & Kg
ICKBGA35X35 by Fischer Elektronik & Kg is a 6mm tall, black anodized heat sink with fin construction. It measures 35mm in width and length, designed for IC devices to dissipate heat efficiently. Ideal for electronic applications requiring compact cooling solutions.
ATSEU-077D-C2-R0
Advanced Thermal Solutions
Y92B-P200
Omron
7023BG
Boyd
Boyd's 7023BG Heat Sink has a Thermal Resistance of 4.4 ohm, Height of 44.45mm, and Width of 24.13mm. Ideal for cooling electronic components in compact spaces due to its folded back fin orientation and aluminum body material.
SK40938.1STS
SK40938.1STS by Fischer Elektronik & Kg is a 38.1mm tall, 12.7mm wide heat sink made of aluminum alloy with longitudinal fin orientation. It is ideal for cooling electronic components in compact spaces due to its dimensions and material properties.
PSD1-2CB
Cts
PSD1-2CB by Cts is a HEAT SINK with thermal resistance of 14.4Ω, ideal for TRANSISTOR cooling. With a SCREW profile and dimensions of 55.37mm x 12.7mm x 35.05mm, it efficiently dissipates heat in electronic devices.
658-60AB
Ohmite Manufacturing
The Ohmite Manufacturing 658-60AB heat sink features a pin fin array profile with dimensions of 27.9mm x 27.9mm x 15.2mm and weighs 14.17g. It is anodized in black, constructed with omnidirectional fins, and commonly used for thermal management in electronic devices.
532702B02500G
Aavid Thermalloy
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: RADIAL; Width: 25.4 mm; Thermal Resistance: 4.8 ohm;
EV-T220-51E
274-1AB
WAKEFIELD-VETTE INC
HEAT SINK; Body Material: ALUMINUM; Color: BLACK; Height: 9.5 mm; Finish: ANODIZED; Width: 13.2 mm;
SK5850SA
FK24408D2PAKTR
FK24408D2PAKTR by Fischer Elektronik & Kg is a 10x8x26mm copper heat sink weighing 2.2g, suitable for ICs. Packed in tape and reel, it efficiently dissipates heat in electronic devices. Ideal for compact applications requiring effective thermal management.
30182
Vicor
Vicor 30182 Heat Sink, made of aluminum alloy, measures 23.1mm (H) x 56.4mm (W) x 57.9mm (L). Ideal for thermal management in electronic devices due to its extruded construction. Ensures efficient heat dissipation in compact spaces like PCBs or power supplies.
SK46375SA
26923
Trenz Electronic
HEAT SINK; Profile: SCREW; Body Material: ALUMINIUM ALLOY; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL; Weight: 60 g;
ICKPGA6X6X14
ICKPGA6X6X14 by Fischer Elektronik & Kg is a 14mm adhesive heat sink with thermal resistance of 20Ω. Ideal for ICs, it features anodized finish and omnidirectional fin orientation, offering efficient heat dissipation in electronic applications.
FK24408D3PAK
FK24408D3PAK by Fischer Elektronik & Kg is a copper heat sink measuring 31x8x10mm and weighing 2.5g. Primarily used on ICs, it comes in bulk packaging and offers efficient thermal dissipation for electronic components.
WA400-11P
Schaffner Holding Ag
WA400-11P by Schaffner Holding Ag is a U-shaped HEAT SINK with dimensions 25x11x16 mm. It has a low Thermal Resistance of 18 ohm, ideal for cooling TRANSISTOR devices efficiently. Suitable for various electronic applications requiring compact and effective heat dissipation solutions.
573100D00000G
Boyd 573100D00000G Heat Sink has Thermal Resistance of 15Ω, Height 10.16mm, and Width 8mm. Ideal for cooling electronic components in compact spaces like PCBs.
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ICKBGA31X31X10
HEAT SINK; Device Used On: IC; Construction: FIN; Finish: BLACK ANODIZED; Height: 10 mm; Length: 31 mm;
ICKBGA14X14X10
ICKBGA14X14X10 by Fischer Elektronik & Kg is a black anodized heat sink with dimensions of 14mm x 14mm x 10mm. It features fin construction and is designed for IC devices, providing efficient thermal management in electronic applications.
ICKBGA35X35X10
HEAT SINK; Device Used On: IC; Construction: FIN; Height: 10 mm; Length: 35 mm; Finish: BLACK ANODIZED;
ICKBGA40X40X10
HEAT SINK; Device Used On: IC; Construction: FIN; Length: 40 mm; Finish: BLACK ANODIZED; Height: 10 mm;
ICKBGA10X10
ICKBGA10X10 by Fischer Elektronik & Kg is a 6mm tall, black anodized heat sink with fin construction. It is designed for IC devices, measuring 10mm in width and length. Ideal for cooling electronic components efficiently in various applications.
ICKBGA23X23X10
HEAT SINK; Device Used On: IC; Construction: FIN; Width: 23 mm; Length: 23 mm; Finish: BLACK ANODIZED;
ICKBGA27X27X10
ICKBGA27X27X10 by Fischer Elektronik & Kg is a 27x27x10mm black anodized heat sink with fin construction. Designed for ICs, it offers efficient thermal dissipation, measuring 10mm in height and suitable for various electronic applications requiring effective heat management.
ICKBGA14X14
HEAT SINK; Device Used On: IC; Construction: FIN; Width: 14 mm; Length: 14 mm; Height: 6 mm;
ICKBGA23X23
ICKBGA23X23 by Fischer Elektronik & Kg is a 6mm high, 23mm wide and 23mm long heat sink with a black anodized finish. It is designed for use on IC devices.
ICKBGA37X37X10
HEAT SINK; Device Used On: IC; Construction: FIN; Finish: BLACK ANODIZED; Height: 10 mm; Width: 37 mm;
Supply Digital Components
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