Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Boyd's 576802B04000G Heat Sink has a Thermal Resistance of 27.3 ohm, U Profile, and is made of Aluminum. It is designed for use on Transistors, with a Height of 19.05mm, Width of 12.7mm, and Length of 14.48mm.
Median Price
$3.120
Lifecycle Status
Suppliers In-Stock
29
In-Stock Inventory
1k+
Avnet
1+ parts
$0.603
100+ parts
-
1k+ parts
10k+ parts
Mouser Electronics
$0.840
$0.674
$0.616
$0.566
DigiKey
$0.960
$0.754
$0.692
$0.597
Newark
$2.860
RS Americas
$3.990
Adafruit Industries
$103.000
$97.850
Arrow
$3.344
Verical
Master Electronics
$0.684
$0.547
Distrelec
PUI
$0.550
$0.470
$0.392
Nova Conductors
$2.900
IBS Electronics
$0.740
$0.458
$3.581
NAC Semi
$5.080
Vyrian
Sensible Micro Corp
Semtec, LLC
Electro Sonic
$0.505
$0.464
Bristol Electronics
Atlantic Semiconductor
EMSNET
ComSIT Distribution GmbH
Prism Electronics
Sogenti Electronics
MISTER SPROCKETS
Bisco
Inventory MP
EPE Components Inc.
First Choice Components Inc.
Continental Prestige Electronics
$2.722
$2.668
Argo Parts USA
Netroflash
Allen Electronics Distributors
Advanced Electronics
Neutron USA
$121.460
Perfect Parts
Glotronic Ltd.
Eastek
GreenTree Electronics
Aztec Data Supply Inc.
FE SAS
Authorized Procurement Solutions
Futuretech Components
SIE Connect GmbH (Excess)
Low thermal resistance allows for efficient heat dissipation, keeping the device cool and improving performance.
The U profile design provides good surface area for heat dissipation and efficient cooling.
A moderate height allows for good air circulation around the heat sink, enhancing heat dissipation.
Anodized finish provides corrosion resistance and improves the appearance of the heat sink.
A moderate width allows for compatibility with a range of components while still providing sufficient cooling surface.
Clip construction allows for easy installation and removal of the heat sink, making maintenance convenient.
Black color provides a sleek and professional look to the heat sink, suitable for various applications.
Aluminum is a lightweight and highly conductive material, ensuring efficient heat transfer and cooling.
A moderate length provides optimal heat dissipation without adding excessive bulk to the device.
Specifically designed for use on transistors, ensuring effective heat management for these components.
Heat Sinks 576802B04000G attributes and parameters. Explore more Heat Sinks devices from Boyd
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Boyd is the world's leading innovator in sustainable engineered material and thermal solutions that make our customers’ products better, safer, faster, and more reliable. We develop and combine technologies to solve ambitious performance targets in our customers’ most critical applications. By implementing technologies and material science in novel ways to seal, protect, cool, and interface, Boyd has continually redefined the possible and championed customer success for over 90 years. Innovation demands for smaller, lighter, and faster technologies with intuitive new features compete with the need for more sustainable solutions. More smart functionality operating faster in tighter spaces with more sophisticated interfaces mean increased power density and more heat, electrical, and mechanical challenges. Adding further complexity, devices are used in unpredictable environments with harsh conditions and must be contaminant and waterproof, insulated against temperature extremes, and ruggedized. Not only are we determined to find solutions to these challenges, Boyd strives to simplify where possible and create the most wholistic, effective, and sustainable solutions.
BAV99
Meritek Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Integrated Power Semiconductors
Other Regulators; No. of Terminals: 3; Operating Temperature (TJ-Min): 0 Cel; Terminal Pitch: 2.54 mm; Maximum Load Regulation (%): 1.5 %; Nominal Dropout Voltage-1: 3 V;
FDN5618P
Onsemi
FDN5618P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage. It features a single configuration with built-in diode, suitable for switching applications. With 10A IDM and 0.17 ohm RDS(on), it operates in the temperature range of -55 to 150 °C, making it ideal for various electronic devices.
SS14
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/56351
Esterline Technologies
CONNECTOR ACCESSORY; IEC Conformity: NO; Contact Gender: FEMALE; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT; Tool Settings: M22520/2-10;
SMBJ18CA
Daco Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
DS18B20U+
Analog Devices
DS18B20U+ by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
LM555CN
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
1N4148WS
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Sensitron Semiconductor
ECS-.327-12.5-17X-TR
Ecs International
ECS-0.327-12.5-17X-TR by Ecs International is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing in temperature ranges from -40 to 85 °C, such as telecommunications and industrial automation.
CGA3E2X7R1H104K080AA
TDK
CGA3E2X7R1H104K080AA by TDK is a fixed ceramic capacitor with a capacitance of 0.1 uF and a rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate at temperatures ranging from -55 to 125 °C. This capacitor is commonly used in surface mount applications for various electronic devices.
2N2222A
Transistor & Electronic
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
Itt Components
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .15 A;
Baneasa S A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; Qualification: Not Qualified;
General Instrument
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002-7-F
Diodes Incorporated
Diodes Inc. 2N7002-7-F is a N-channel FET with 60V DS breakdown voltage, 0.115A max drain current, and 13.5 ohm RDS(on). Ideal for switching applications in enhancement mode operation. Features Gull Wing terminals, small outline package style, and operates up to 150°C.
ROHM
SK89100SA
Fischer Elektronik & Kg
SK89100SA by Fischer Elektronik & Kg is a black anodized heat sink measuring 100x80x78.6mm (LxWxH). It is extruded for efficient thermal dissipation, ideal for electronic devices requiring cooling solutions in various applications.
507002B00000G
Boyd
Boyd 507002B00000G Heat Sink features Thermal Resistance of 15.6 ohm, U Profile with Height 17.78mm, and Longitudinal Fin Orientation. Ideal for cooling applications in electronics due to its Aluminum construction and Anodized finish, measuring 44.45mm in Length and 9.52mm in Width.
FK24413D2PAKTR
FK24413D2PAKTR by Fischer Elektronik & Kg is a copper heat sink measuring 26x13x10 mm and weighing 3.6g. Designed for ICs, it comes in tape and reel packaging, making it ideal for thermal management in electronic devices.
581002B02500G
Boyd's 581002B02500G Heat Sink has a Thermal Resistance of 17.4 ohm, Height of 25.4mm, and is made of Aluminum. Ideal for ICs, this anodized black heat sink with longitudinal fin orientation efficiently dissipates heat in electronic devices.
EV-T220-64E
Ohmite Manufacturing
HEAT SINK;
ATS-1039-C1-R0
Advanced Thermal Solutions
ATS-1039-C1-R0 by Advanced Thermal Solutions is a 15mm high, 40mm wide, and 53mm long heat sink with pin fin array profile. Anodized in green, it features omnidirectional fin orientation for efficient thermal management. Ideal for applications requiring compact cooling solutions.
7109DG/TR
Boyd's 7109DG/TR heat sink has a thermal resistance of 11 ohm, made of copper with dimensions 25.4mm x 19.38mm x 11.43mm. Ideal for ICs due to folded-back fin orientation and TIN finish, packaged in tape and reel for easy handling during assembly.
MA-302-55E
423K
WAKEFIELD-VETTE INC
423K by Wakefield-vette is a HEAT SINK measuring 66.7mm (H) x 120.7mm (W) x 140.2mm (L), weighing 530.71g. Constructed using EXTRUDED method, it's ideal for thermal management in various applications like electronics cooling and industrial machinery.
518-95AB
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Finish: ANODIZED; Height: 24.1 mm; Width: 57.9 mm;
DA-T263-101E
Ohmite DA-T263-101E is a 10.16mm tall, 12.7mm wide black anodized aluminum heat sink weighing 3.8g. With extruded construction and fin pin orientation, it's ideal for use on transistors to dissipate heat efficiently in electronic devices.
WF151200
Celduc Relais
906-31-2-23-2-B-0
Wakefield Thermal Solutions
Wakefield Thermal Solutions' 906-31-2-23-2-B-0 heat sink features a thermal resistance of 12.02 ohm, aluminum alloy construction with black anodized finish, and pin fin orientation. This clip-profiled device, measuring 31mm in width and length, is designed for IC applications.
ATSEU-077B-C3-R0
321527B00000G
Boyd 321527B00000G Heat Sink has Thermal Resistance of 35.2Ω, Height of 12.7mm, and Radial Fin Orientation. Ideal for cooling electronic components in compact spaces with high thermal demands.
374324B00035G
The Boyd 374324B00035G heat sink features a pin fin array design with a height of 10mm and width of 27mm. Constructed from black anodized aluminum, it is ideal for applications requiring efficient heat dissipation in compact spaces. The omnidirectional fin orientation enhances thermal performance, making it suitable for various electronic devices.
ICKBGA10X10
ICKBGA10X10 by Fischer Elektronik & Kg is a 6mm tall, black anodized heat sink with fin construction. It is designed for IC devices, measuring 10mm in width and length. Ideal for cooling electronic components efficiently in various applications.
908-35-2-23-2-B-0
Wakefield Thermal Solutions' 908-35-2-23-2-B-0 heat sink features a thermal resistance of 10.03 ohm, aluminum alloy construction with black anodized finish, and pin fin orientation. This clip-profiled device is 35mm wide, 12mm high, and used on ICs for effective heat dissipation in various electronic applications.
APA501-60-001
Astec America
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: LONGITUDINAL; Height: 15 mm; Length: 59 mm;
SV-LED-125E
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
576802B04000G
Aavid Thermalloy
HEAT SINK; Profile: U; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Construction: CLIP; Length: 14.48 mm;
576802B00000G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: CLIP; Fin Orientation: TRANSVERSE; Thermal Resistance: 27.3 ohm;
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: CLIP; Fin Orientation: TRANSVERSE; Width: 12.7 mm;
576802B03100G
Boyd 576802B03100G Heat Sink has Thermal Resistance of 27.3 ohm, Height 12.7mm, and Width 14.48mm. Ideal for cooling electronic components in compact spaces due to its small dimensions and efficient heat dissipation capabilities.
HEAT SINK; Body Material: ALUMINUM; Construction: CLIP; Height: 12.7 mm; Width: 14.48 mm; Finish: ANODIZED;
576802B03700G
576802B03900G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: CLIP; Fin Orientation: TRANSVERSE; Length: 12.7 mm;
576802B04100G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: CLIP; Width: 12.7 mm; Finish: ANODIZED;
576802B03200G
HEAT SINK; Body Material: ALUMINUM; Construction: CLIP; Height: 19.05 mm; Length: 14.48 mm; Color: BLACK;
576802B03300G
HEAT SINK; Body Material: ALUMINUM; Construction: CLIP; Finish: ANODIZED; Length: 14.48 mm; Color: BLACK;
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: CLIP; Fin Orientation: TRANSVERSE; Length: 14.48 mm;
HEAT SINK; Body Material: ALUMINUM; Construction: CLIP; Width: 12.7 mm; Thermal Resistance: 27.3 ohm; Finish: ANODIZED;
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: CLIP; Width: 12.7 mm; Color: BLACK;
Boyd's 576802B03900G Heat Sink has a Thermal Resistance of 27.3 ohm, U Profile, and Aluminum Body Material. Ideal for applications requiring efficient heat dissipation in compact spaces with its dimensions of 12.7mm (W) x 19.05mm (H) x 12.7mm (L).
HEAT SINK; Body Material: ALUMINUM; Construction: CLIP; Finish: ANODIZED; Thermal Resistance: 27.3 ohm; Height: 19.05 mm;
576802B04000
HEAT SINK; Profile: U; Device Used On: TRANSISTOR; Construction: FIN; Fin Orientation: FOLDEDBACK; Thermal Resistance: 27.3 ohm;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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