Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Boyd's 576802B04000G Heat Sink has a Thermal Resistance of 27.3 ohm, U Profile, and is made of Aluminum. It is designed for use on Transistors, with a Height of 19.05mm, Width of 12.7mm, and Length of 14.48mm.
Median Price
$0.885
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$0.530
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$0.505
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$0.470
Mouser Electronics
$0.810
$0.631
$0.558
$0.512
DigiKey
$0.960
$0.754
$0.692
$0.597
Newark
$3.120
$2.860
Avnet
$3.794
RS Americas
$3.990
Adafruit Industries
$103.000
$97.850
Arrow
$0.391
Verical
$0.408
Master Electronics
$0.488
$0.457
Distrelec
PUI
$0.550
$0.392
Nova Conductors
$2.900
IBS Electronics
$0.736
$0.456
$3.492
NAC Semi
$5.080
Vyrian
Sensible Micro Corp
Semtec, LLC
Electro Sonic
$0.464
Bristol Electronics
Atlantic Semiconductor
EMSNET
ComSIT Distribution GmbH
Prism Electronics
Sogenti Electronics
MISTER SPROCKETS
Bisco
Inventory MP
EPE Components Inc.
First Choice Components Inc.
Continental Prestige Electronics
$2.722
$2.668
Argo Parts USA
Netroflash
Allen Electronics Distributors
Advanced Electronics
Perfect Parts
Glotronic Ltd.
Eastek
GreenTree Electronics
Aztec Data Supply Inc.
FE SAS
Authorized Procurement Solutions
SIE Connect GmbH (Excess)
Low thermal resistance allows for efficient heat dissipation, keeping the device cool and improving performance.
The U profile design provides good surface area for heat dissipation and efficient cooling.
A moderate height allows for good air circulation around the heat sink, enhancing heat dissipation.
Anodized finish provides corrosion resistance and improves the appearance of the heat sink.
A moderate width allows for compatibility with a range of components while still providing sufficient cooling surface.
Clip construction allows for easy installation and removal of the heat sink, making maintenance convenient.
Black color provides a sleek and professional look to the heat sink, suitable for various applications.
Aluminum is a lightweight and highly conductive material, ensuring efficient heat transfer and cooling.
A moderate length provides optimal heat dissipation without adding excessive bulk to the device.
Specifically designed for use on transistors, ensuring effective heat management for these components.
Heat Sinks 576802B04000G attributes and parameters. Explore more Heat Sinks devices from Boyd
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Boyd is the world's leading innovator in sustainable engineered material and thermal solutions that make our customers’ products better, safer, faster, and more reliable. We develop and combine technologies to solve ambitious performance targets in our customers’ most critical applications. By implementing technologies and material science in novel ways to seal, protect, cool, and interface, Boyd has continually redefined the possible and championed customer success for over 90 years. Innovation demands for smaller, lighter, and faster technologies with intuitive new features compete with the need for more sustainable solutions. More smart functionality operating faster in tighter spaces with more sophisticated interfaces mean increased power density and more heat, electrical, and mechanical challenges. Adding further complexity, devices are used in unpredictable environments with harsh conditions and must be contaminant and waterproof, insulated against temperature extremes, and ruggedized. Not only are we determined to find solutions to these challenges, Boyd strives to simplify where possible and create the most wholistic, effective, and sustainable solutions.
STM32H743XIH6
STMicroelectronics
STM32H743XIH6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 36-Ch 16-Bit ADC, and 2-Ch 12-Bit DAC. It operates at up to 48 MHz, has 1085440 bytes of RAM, and offers connectivity options like CAN, I2C, USB. Ideal for industrial applications requiring high-performance processing and extensive peripheral support.
LL4148
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SN6505BDBVR
Texas Instruments
SN6505BDBVR by Texas Instruments is a small outline, low profile interface IC with 6 terminals. It operates b/w -55 to 125°C and supports a max output current of 1.5A at supply voltages ranging from 2.25V to 5.5V. Ideal for military-grade applications requiring compact design and high reliability.
ISO1050DUBR
ISO1050DUBR by Texas Instruments is a network interface IC with 8 terminals, operating from -55 to 105°C. It features a small outline package, nickel palladium gold finish, and gull wing terminal form. Ideal for telecom applications requiring a 5V supply voltage and peak reflow temperature of 260°C.
LD1117S33TR
LD1117S33TR by STMicroelectronics is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 1.3A. It has a small outline package style, operates at an adjustable temperature range from 0 to 125°C, and is ideal for applications requiring stable voltage regulation in compact electronic devices.
LM358AN
LM358AN by Texas Instruments is an Operational Amplifier with 2 functions. It has a Max Input Offset Voltage of 5000 uV and Nominal Common Mode Reject Ratio of 85 dB. Widely used in voltage-feedback applications due to its high Min Voltage Gain of 15000 and Unity Gain Bandwidth of 1000 kHz.
2N2222A
Microsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 30; No. of Elements: 1;
SMBJ18CA
Fagor Electronica S Coop
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS123LT1G
Onsemi
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
BAV99WT1G
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Rfe International
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Forward Voltage (VF): 1 V; Config: SINGLE;
Lite-on Semiconductor
BAV99
Gec Plessey Semiconductors
Diodes Incorporated
LM358N
Harris Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1554216002
Molex
WIRE AND CABLE;
Kec
MBR130T1G
MBR130T1G by Onsemi is a Schottky rectifier diode with max output current of 1A and max repetitive peak reverse voltage of 30V. It operates b/w -65 to 125°C, suitable for surface mount applications in electronics requiring low forward voltage drop.
Taejin Technology
OPERATIONAL AMPLIFIER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM358D-T
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
ATS-1039-C2-R0
Advanced Thermal Solutions
ATS-1039-C2-R0 by Advanced Thermal Solutions is a 15mm high, 40mm wide, and 53mm long heat sink with pin fin array profile. Anodized in green color, it features omnidirectional fin orientation for efficient thermal management. Ideal for applications requiring compact cooling solutions.
281-1AB
Ohmite Manufacturing
The Ohmite Manufacturing 281-1AB Heat Sink is 9.5mm tall, 13.2mm wide, and 19.1mm long with an anodized black aluminum body. Ideal for thermal management in electronic devices due to its compact size and efficient heat dissipation capabilities.
517-95AB
The Ohmite Manufacturing 517-95AB Heat Sink is an extruded aluminum device measuring 24.1mm in height, 57.9mm in width, and 61mm in length. It features an anodized black finish and is commonly used for thermal management applications in electronic devices.
SK681000SA
Fischer Elektronik & Kg
SK681000SA by Fischer Elektronik & Kg is a heat sink with a thermal resistance of 5.85 ohm. It has a screw profile, measuring 33mm in height and 46mm in width. This extruded heat sink, with a length of 1000mm, is commonly used on transistors for effective heat dissipation.
ICKBGA35X35X10
ICKBGA35X35X10 by Fischer Elektronik & Kg is a 10mm high, 35mm wide, and 35mm long black anodized heat sink with fin construction. Specifically designed for ICs, it efficiently dissipates heat to prevent overheating in electronic devices. Ideal for applications requiring compact cooling solutions.
374724B60024G
Aavid Thermalloy
HEAT SINK; Profile: PIN FIN ARRAY; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: OMNIDIRECT; Finish: ANODIZED;
528-45AB
The Ohmite Manufacturing 528-45AB Heat Sink is an extruded aluminum device with dimensions of 61x57.9x11.4mm (LxWxH). It features an anodized black finish and is designed for thermal management in electronic applications. Ideal for dissipating heat efficiently while maintaining a compact form factor.
573300D00010G
HEAT SINK; Profile: U; Construction: EXTRUDED; Width: 12.7 mm; Height: 10.16 mm; Packing Method: TAPE AND REEL;
SK10438,1STS
SK10438,1STS by Fischer Elektronik & Kg is a black anodized heat sink measuring 38.1mm in height, 12.7mm in width, and 34.9mm in length. Its extruded construction with staggered fin orientation makes it ideal for cooling electronic components efficiently in various applications.
031607
Heat Sinks;
FK237SA220H
FK237SA220H by Fischer Elektronik & Kg is a black anodized aluminum heat sink with dimensions 19.05mm x 14.5mm x 12.7mm (LxWxH). Designed for transistors, it efficiently dissipates heat in electronic devices, ensuring optimal performance and longevity.
SV-LED-151E
HEAT SINK;
SK10450.8STS
ATS-56010-C4-R0
WA400-11P
Schaffner Holding Ag
WA400-11P by Schaffner Holding Ag is a U-shaped HEAT SINK with dimensions 25x11x16 mm. It has a low Thermal Resistance of 18 ohm, ideal for cooling TRANSISTOR devices efficiently. Suitable for various electronic applications requiring compact and effective heat dissipation solutions.
ATS-CPX030030010-169-C2-R0
7G0011A
TDK
The TDK 7G0011A heat sink has a thermal resistance of 8.24Ω, with dimensions of 5.7mm x 37.4mm x 50mm and weight of 14.6g. It is designed for converters, featuring an omnidirectional fin orientation for efficient heat dissipation in various applications.
576802B00000G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: CLIP; Fin Orientation: TRANSVERSE; Thermal Resistance: 27.3 ohm;
1963856-1
TE Connectivity
TE Connectivity's 1963856-1 is a HEAT SINK with dimensions of 111.5x85.6x10.27mm, made of ALUMINUM ALLOY with ANODIZED finish. Its FIN construction and LONGITUDINAL orientation make it ideal for thermal management in various electronic applications.
SK5850SA
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
576802B04000G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Construction: CLIP; Length: 14.48 mm;
Boyd
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: CLIP; Fin Orientation: TRANSVERSE; Width: 12.7 mm;
576802B03100G
Boyd 576802B03100G Heat Sink has Thermal Resistance of 27.3 ohm, Height 12.7mm, and Width 14.48mm. Ideal for cooling electronic components in compact spaces due to its small dimensions and efficient heat dissipation capabilities.
HEAT SINK; Body Material: ALUMINUM; Construction: CLIP; Height: 12.7 mm; Width: 14.48 mm; Finish: ANODIZED;
576802B03700G
576802B03900G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: CLIP; Fin Orientation: TRANSVERSE; Length: 12.7 mm;
576802B04100G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: CLIP; Width: 12.7 mm; Finish: ANODIZED;
576802B03200G
HEAT SINK; Body Material: ALUMINUM; Construction: CLIP; Height: 19.05 mm; Length: 14.48 mm; Color: BLACK;
576802B03300G
HEAT SINK; Body Material: ALUMINUM; Construction: CLIP; Finish: ANODIZED; Length: 14.48 mm; Color: BLACK;
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: CLIP; Fin Orientation: TRANSVERSE; Length: 14.48 mm;
HEAT SINK; Body Material: ALUMINUM; Construction: CLIP; Width: 12.7 mm; Thermal Resistance: 27.3 ohm; Finish: ANODIZED;
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: CLIP; Width: 12.7 mm; Color: BLACK;
Boyd's 576802B03900G Heat Sink has a Thermal Resistance of 27.3 ohm, U Profile, and Aluminum Body Material. Ideal for applications requiring efficient heat dissipation in compact spaces with its dimensions of 12.7mm (W) x 19.05mm (H) x 12.7mm (L).
HEAT SINK; Body Material: ALUMINUM; Construction: CLIP; Finish: ANODIZED; Thermal Resistance: 27.3 ohm; Height: 19.05 mm;
576802B04000
HEAT SINK; Profile: U; Device Used On: TRANSISTOR; Construction: FIN; Fin Orientation: FOLDEDBACK; Thermal Resistance: 27.3 ohm;
Supply Digital Components
$106.00
$54.25
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$7.29
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12,000 In-Stock
Total price ≈ $80,197.29
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