Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Boyd 507002B00000G Heat Sink features Thermal Resistance of 15.6 ohm, U Profile with Height 17.78mm, and Longitudinal Fin Orientation. Ideal for cooling applications in electronics due to its Aluminum construction and Anodized finish, measuring 44.45mm in Length and 9.52mm in Width.
Median Price
$0.650
Lifecycle Status
Suppliers In-Stock
21
In-Stock Inventory
1k+
Interstate Connecting
1+ parts
$0.365
100+ parts
-
1k+ parts
$0.315
10k+ parts
$0.282
Heilind Electronics
$0.396
$0.326
$0.305
Mouser Electronics
$0.640
$0.515
$0.442
$0.405
Newark
$0.993
RS Americas
$1.380
$1.180
Element14
$1.407
$1.267
$1.200
Farnell
$3.550
$1.770
Master Electronics
$0.845
$0.386
$0.368
Verical
$0.303
$0.281
Future Electronics
$0.240
$0.230
$0.225
Avnet
$0.616
Arrow
$0.661
Nova Conductors
$1.031
IBS Electronics
$1.186
$0.541
$0.512
NAC Semi
$2.180
Vyrian
Bisco
EMSNET
Electro Sonic
$0.752
$0.275
Bristol Electronics
Prism Electronics
Component Stockers USA
$0.260
$0.430
Argo Parts USA
Allen Electronics Distributors
$1.710
Continental Prestige Electronics
$3.660
$1.820
Perfect Parts
Glotronic Ltd.
SIE Connect GmbH (Excess)
Low thermal resistance ensures efficient heat dissipation, making this heat sink suitable for devices requiring effective cooling.
Specifically designed as a heat sink, ensuring optimal heat management for electronic components.
The U-shaped profile allows for better airflow and improved cooling performance.
Compact height makes it suitable for applications where space is limited.
Anodized finish provides corrosion resistance and enhances the durability of the heat sink.
Narrow width allows for versatile placement and compatibility with various devices.
Fin construction provides a larger surface area for effective heat dissipation.
Sleek black color adds a professional and aesthetic appeal to the overall design.
Longitudinal fin orientation optimizes heat transfer efficiency and airflow direction for better cooling performance.
Aluminum construction offers lightweight yet durable properties, ideal for heat sink applications.
Moderate length provides a balanced proportion for effective heat dissipation in various electronic devices.
Heat Sinks 507002B00000G attributes and parameters. Explore more Heat Sinks devices from Boyd
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Boyd is the world's leading innovator in sustainable engineered material and thermal solutions that make our customers’ products better, safer, faster, and more reliable. We develop and combine technologies to solve ambitious performance targets in our customers’ most critical applications. By implementing technologies and material science in novel ways to seal, protect, cool, and interface, Boyd has continually redefined the possible and championed customer success for over 90 years. Innovation demands for smaller, lighter, and faster technologies with intuitive new features compete with the need for more sustainable solutions. More smart functionality operating faster in tighter spaces with more sophisticated interfaces mean increased power density and more heat, electrical, and mechanical challenges. Adding further complexity, devices are used in unpredictable environments with harsh conditions and must be contaminant and waterproof, insulated against temperature extremes, and ruggedized. Not only are we determined to find solutions to these challenges, Boyd strives to simplify where possible and create the most wholistic, effective, and sustainable solutions.
LL4148
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
M24308/2-1F
Cristek Interconnects
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; No. of Rows Loaded: 2; Shell Size: 1/E; Filter Feature: NO;
2N2222A
Zetex Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
GRM155R71H103KA88D
Murata Manufacturing
The Murata Manufacturing GRM155R71H103KA88D is a ceramic capacitor with 0.01uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and high reliability.
2N7002
Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain Current (ID): .115 A; Operating Mode: ENHANCEMENT MODE;
LM358N
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148
Sun Wai Electronic
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Reverse Recovery Time: .004 us; Maximum Repetitive Peak Reverse Voltage: 100 V;
EU2B-YS303C
Idec
ROTARY SWITCH;
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Frontier Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
RC0603FR-0710KL
Yageo
Yageo's RC0603FR-0710KL is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. It operates b/w -55 to 155 °C and is ideal for surface mount applications in electronics requiring precise resistance values.
BSS123NH6327XTSA1
Infineon Technologies
Infineon BSS123NH6327XTSA1 is a N-CHANNEL FET with 100V DS breakdown voltage, 0.19A ID, and 6 ohm RDS(on). Ideal for small outline applications requiring high drain current and low on-resistance. AEC-Q101 compliant for automotive use.
Temic Semiconductors
Micropac Industries
TM4C1294NCPDTI3
Texas Instruments
TM4C1294NCPDTI3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 8KB data EEPROM, 20-Ch 12-Bit ADC channels, and 32 DMA channels. Ideal for industrial applications requiring high-speed processing, it offers connectivity options like CAN, Ethernet, I2C, SPI, UART, and USB.
Terry Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V;
1N4148WS
Weitron Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Iskra Semic Capacitors Industry
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; JESD-609 Code: e0; Maximum Non Repetitive Peak Forward Current: 2 A;
CRCW080510K0FKEA
Vishay Intertechnology
Vishay Intertechnology's CRCW080510K0FKEA is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 reference standard compliance and -55 to 155 °C operating temperature range.
Shenzhen Yixinsemi Electronics
518-95AB
Ohmite Manufacturing
The Ohmite Manufacturing 518-95AB Heat Sink is an extruded aluminum device with dimensions of 61x57.9x24.1mm (LxWxH). It features an anodized black finish and is commonly used in electronic applications for thermal management due to its efficient heat dissipation capabilities.
WV-T220-101E
HEAT SINK;
SK52530
Fischer Elektronik & Kg
SK52530 by Fischer Elektronik & Kg is a 7.8 ohm HEAT SINK with dimensions 28mm x 19.4mm x 30mm, constructed using EXTRUDED method. It is designed for TRANSISTOR cooling applications with LONGITUDINAL fin orientation.
SW50-4G
Aavid Thermalloy
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: RADIAL; Color: BLACK; Height: 50 mm;
V-1100-SMD/AL
Assmann Wsw Components
Heat Sinks;
C220-050-2AE
HF20G
Boyd
Boyd's HF20G heat sink boasts a low thermal resistance of 13.1 ohm, ideal for dissipating heat efficiently. With a height of 27.94mm and extruded aluminum construction, it is suitable for compact electronic devices requiring effective cooling. The anodized finish and black color add to its aesthetic appeal in various applications.
507002B00000G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: LONGITUDINAL; Length: 44.45 mm;
FK24408D2PAKTR
FK24408D2PAKTR by Fischer Elektronik & Kg is a 10x8x26mm copper heat sink weighing 2.2g, suitable for ICs. Packed in tape and reel, it efficiently dissipates heat in electronic devices. Ideal for compact applications requiring effective thermal management.
ICKBGA40X40X10
ICKBGA40X40X10 by Fischer Elektronik & Kg is a 10mm high, 40mm wide, and 40mm long black anodized heat sink with fin construction. Specifically designed for ICs, it efficiently dissipates heat to prevent overheating in electronic devices.
904-27-1-23-2-B-0
Wakefield Thermal Solutions
Wakefield Thermal Solutions' 904-27-1-23-2-B-0 heat sink has thermal resistance of 12.93 ohm, elliptical fin orientation, and black anodized finish. It is a clip-profile extruded aluminum alloy device used on ICs for efficient heat dissipation.
FK24413DPAKTR
FK24413DPAKTR by Fischer Elektronik & Kg is a 10x13x23mm copper heat sink weighing 3.3g, suitable for ICs. It comes in tape and reel packaging, ideal for thermal management applications due to its compact size and efficient heat dissipation capabilities.
658-35AB-T4
WAKEFIELD-VETTE INC
658-35AB-T4 by Wakefield-vette is a PIN FIN ARRAY heat sink with a height of 8.89 mm, width and length of 30.73 mm. It is made of black anodized aluminum and has an omnidirectional fin orientation. This heat sink is commonly used in electronic devices for efficient thermal management.
637-15ABEP
Ohmite Manufacturing's 637-15ABEP heat sink is 38.1mm tall, 12.7mm wide, and weighs 15.88g. Constructed with flared aluminum body, it's ideal for thermal management in various electronic applications due to its radial fin orientation.
SV-LED-113E
SK89100SA
SK89100SA by Fischer Elektronik & Kg is a black anodized heat sink measuring 100x80x78.6mm (LxWxH). It is extruded for efficient thermal dissipation, ideal for electronic devices requiring cooling solutions in various applications.
SK10438,1STS
SK10438,1STS by Fischer Elektronik & Kg is a black anodized heat sink measuring 38.1mm in height, 12.7mm in width, and 34.9mm in length. Its extruded construction with staggered fin orientation makes it ideal for cooling electronic components efficiently in various applications.
V5229W
APF40-40-13CB/A01
Cts
The Cts APF40-40-13CB/A01 is a 40x40mm black adhesive heat sink with thermal resistance of 9.9 ohm, ideal for ICs. Made of aluminum alloy, it has a height of 12.7mm and anodized finish, providing efficient heat dissipation in compact spaces.
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507002B05300G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Fin Orientation: LONGITUDINAL; Length: 44.45 mm;
507002B05700G
HEAT SINK; Profile: U; Construction: FIN; Fin Orientation: LONGITUDINAL; Height: 17.78 mm; Finish: ANODIZED;
507002J00000G
HEAT SINK; Profile: U; Construction: FIN; Fin Orientation: LONGITUDINAL; Length: 44.5 mm; Color: BLACK;
507002B10000G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: LONGITUDINAL; Thermal Resistance: 15.6 ohm;
HEAT SINK; Profile: U; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Fin Orientation: LONGITUDINAL; Width: 9.52 mm;
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: LONGITUDINAL; Color: BLACK;
HEAT SINK; Profile: U; Construction: FIN; Fin Orientation: LONGITUDINAL; Thermal Resistance: 15.6 ohm; Height: 17.78 mm;
Supply Digital Components
$106.00
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