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576802B03700G

Boyd

576802B03700G by Boyd

HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: CLIP; Fin Orientation: TRANSVERSE; Length: 14.48 mm;

Median Price

$0.760

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,231 parts In-Stock

1+ parts

$0.760

100+ parts

-

1k+ parts

-

10k+ parts

$0.637

3,231

$0.760

-

-

$0.637

DigiKey

USA . 1,961 parts In-Stock

1+ parts

$4.810

100+ parts

$3.766

1k+ parts

$3.457

10k+ parts

-

1,961

$4.810

$3.766

$3.457

-

Avnet

USA . 12,722 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.725

12,722

-

-

-

$3.725

Arrow

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.609

10k+ parts

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4,000

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-

$0.609

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Verical

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$0.721

1k+ parts

-

10k+ parts

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4,000

-

$0.721

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Prism Electronics

USA . 2 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2

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Sensible Micro Corp

USA . 1 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1

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Technical Specifications

Heat Sinks 576802B03700G attributes and parameters. Explore more Heat Sinks devices from Boyd

Device Specifications

Construction:

Profile:

U

Fin Orientation:

Physical Specifications

Height:

0.75 in (19.05 mm)

Width:

0.5 in (12.7 mm)

Length:

0.57 in (14.48 mm)

Material and Finish

Finish:

Anodized

Body Material Composition:

Color:

Black

Thermal Specifications

Thermal Resistance:

27.3 Ω

Usage and Compatibility

Device Type:

Manufacturer Highlights

Boyd

Boyd is the world's leading innovator in sustainable engineered material and thermal solutions that make our customers’ products better, safer, faster, and more reliable. We develop and combine technologies to solve ambitious performance targets in our customers’ most critical applications. By implementing technologies and material science in novel ways to seal, protect, cool, and interface, Boyd has continually redefined the possible and championed customer success for over 90 years. Innovation demands for smaller, lighter, and faster technologies with intuitive new features compete with the need for more sustainable solutions. More smart functionality operating faster in tighter spaces with more sophisticated interfaces mean increased power density and more heat, electrical, and mechanical challenges. Adding further complexity, devices are used in unpredictable environments with harsh conditions and must be contaminant and waterproof, insulated against temperature extremes, and ruggedized. Not only are we determined to find solutions to these challenges, Boyd strives to simplify where possible and create the most wholistic, effective, and sustainable solutions.

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