Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Boyd's 576802B03900G Heat Sink has a Thermal Resistance of 27.3 ohm, U Profile, and Aluminum Body Material. Ideal for applications requiring efficient heat dissipation in compact spaces with its dimensions of 12.7mm (W) x 19.05mm (H) x 12.7mm (L).
Median Price
$2.061
Lifecycle Status
Suppliers In-Stock
19
In-Stock Inventory
1k+
Mouser Electronics
1+ parts
$0.690
100+ parts
$0.579
1k+ parts
$0.512
10k+ parts
$0.469
DigiKey
$0.930
$0.725
$0.666
$0.574
Sager
$2.200
-
$1.890
$1.790
Element14
$2.940
Newark
$3.240
$3.000
Arrow
$0.360
Verical
Future Electronics
$0.565
$0.525
Heilind Electronics
Interstate Connecting
Farnell
$2.570
PUI
$0.240
$0.220
NAC Semi
$1.050
$0.530
Nova Conductors
$1.724
Electro Sonic
$2.650
$1.980
$1.840
$1.660
IBS Electronics
$0.470
$0.449
$0.463
Vyrian
Lakeland Logistics Inc
Bristol Electronics
Component Stockers USA
$0.490
$0.450
$0.460
Netroflash
Continental Prestige Electronics
$1.930
$1.730
$1.600
Neutron USA
$114.500
Perfect Parts
GreenTree Electronics
Authorized Procurement Solutions
Low thermal resistance ensures efficient heat dissipation, helping to keep the component cool and increase its lifespan.
Being a heat sink, this product is specifically designed to dissipate heat away from the component, preventing overheating and potential damage.
The U profile allows for better airflow, enhancing the heat dissipation capabilities of the heat sink.
The height of the heat sink provides sufficient surface area for effective heat dissipation.
Anodized finish provides corrosion resistance and enhances the durability of the heat sink.
The width of the heat sink allows for easy installation and compatibility with various components.
Clip construction makes it easy to attach and detach the heat sink when needed for maintenance or upgrades.
The black color adds a sleek and professional look to the heat sink, making it suitable for various applications.
Transverse fin orientation helps in dispersing heat more effectively and efficiently.
Aluminum is a lightweight and excellent conductor of heat, making it an ideal material for heat sinks.
The length of the heat sink provides adequate coverage for the component, ensuring uniform heat dissipation.
Heat Sinks 576802B03900G attributes and parameters. Explore more Heat Sinks devices from Boyd
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Boyd is the world's leading innovator in sustainable engineered material and thermal solutions that make our customers’ products better, safer, faster, and more reliable. We develop and combine technologies to solve ambitious performance targets in our customers’ most critical applications. By implementing technologies and material science in novel ways to seal, protect, cool, and interface, Boyd has continually redefined the possible and championed customer success for over 90 years. Innovation demands for smaller, lighter, and faster technologies with intuitive new features compete with the need for more sustainable solutions. More smart functionality operating faster in tighter spaces with more sophisticated interfaces mean increased power density and more heat, electrical, and mechanical challenges. Adding further complexity, devices are used in unpredictable environments with harsh conditions and must be contaminant and waterproof, insulated against temperature extremes, and ruggedized. Not only are we determined to find solutions to these challenges, Boyd strives to simplify where possible and create the most wholistic, effective, and sustainable solutions.
2N7002
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
BSS123,215
NXP Semiconductors
NXP Semiconductors' BSS123,215 is a N-CHANNEL FET for SWITCHING applications. Features include 100V DS Breakdown Voltage, 0.17A Drain Current, and 6 ohm On Resistance. With GULL WING terminals and ENHANCEMENT MODE operation, it's ideal for small outline packages in various electronic devices.
LL4148
Continental Device India
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N2222A
Shanghai Lunsure Electronic Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
1N4148
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM7805CT
Integrated Circuit Technology
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Terminal Position: SINGLE; Operating Temperature (TJ-Min): 0 Cel;
Taiwan Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Peak Reflow Temperature (C): 260; Maximum Operating Temperature: 175 Cel; JESD-609 Code: e3; No. of Elements: 1;
BSS138
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel;
Itt Semiconductor
BAV99
Vishay Sprague
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Motorola
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Collector-Base Capacitance: 8 pF;
SMBJ18CA
Changzhou Galaxy Century Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
STM32F103C8T6
STMicroelectronics
STM32F103C8T6 by STMicroelectronics is a 32-bit microcontroller with 48 terminals, operating at up to 16 MHz. It features 10-Ch 12-Bit ADC channels and 7 DMA channels, suitable for industrial applications requiring low power consumption and high-speed connectivity via CAN, I2C(2), SPI(2), USART(3), USB.
Tak Cheong Electronics Holdings
Bkc Semiconductors
Sinyork
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V;
LM358AN
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM317T
Analog Devices
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; No. of Functions: 1; Package Body Material: PLASTIC/EPOXY; Surface Mount: NO;
Micro Commercial Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Position: DUAL;
1N4148WS
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
C247-025-1VE
Ohmite Manufacturing
HEAT SINK;
HAF-15T
TDK
The TDK HAF-15T Heat Sink features a thermal resistance of 1.5Ω, with dimensions of 38.1mm x 61mm x 116.8mm and weight of 250g. Designed for converters, it utilizes fin pin construction with omnidirectional fin orientation for efficient heat dissipation in electronic devices.
577102B04000G
Boyd
Boyd's 577102B04000G Heat Sink has a thermal resistance of 25.9 ohm, U profile, and transverse fin orientation. Ideal for cooling electronic components in compact spaces due to its dimensions (13.21mm x 9.52mm x 19.05mm) and anodized black finish.
ATSEU-077C-C3-R0
Advanced Thermal Solutions
WF070000
Celduc Relais
374324B00035G
The Boyd 374324B00035G heat sink features a pin fin array design with a height of 10mm and width of 27mm. Constructed from black anodized aluminum, it is ideal for applications requiring efficient heat dissipation in compact spaces. The omnidirectional fin orientation enhances thermal performance, making it suitable for various electronic devices.
1963856-1
TE Connectivity
TE Connectivity's 1963856-1 is a HEAT SINK with dimensions of 111.5x85.6x10.27mm, made of ALUMINUM ALLOY with ANODIZED finish. Its FIN construction and LONGITUDINAL orientation make it ideal for thermal management in various electronic applications.
574902B03300G
Boyd's 574902B03300G heat sink has a thermal resistance of 16Ω, height of 34.93mm, and width of 9.02mm. Ideal for applications requiring efficient heat dissipation in compact spaces due to its folded-back fin orientation and aluminum body construction.
HSS26-B20-P38
Cui Devices
HS202DR
Crydom
274-1AB
WAKEFIELD-VETTE INC
HEAT SINK; Body Material: ALUMINUM; Color: BLACK; Height: 9.5 mm; Finish: ANODIZED; Width: 13.2 mm;
PF527G
Boyd PF527G Heat Sink has 7.4 ohm Thermal Resistance, 25mm Height, and Anodized Black Finish. Ideal for cooling electronic components in various applications due to its aluminum body material and efficient heat dissipation capabilities.
320205B00000G
Boyd 320205B00000G Heat Sink is an extruded aluminum device with a height of 6.35mm and diameter of 7.75mm, finished in black anodized color. Ideal for cooling electronic components in compact spaces due to its small form factor and efficient heat dissipation capabilities.
V2008B
Assmann Wsw Components
Heat Sinks;
HS201DR
Sensata Technologies
HEAT SINK; Profile: SCREW; Body Material: ALUMINUM ALLOY; Device Used On: RELAY; Fin Orientation: LONGITUDINAL; Weight: 353 g;
7106PD/TR
Aavid Thermalloy
HEAT SINK; Body Material: COPPER; Finish: TIN; Packing Method: TAPE AND REEL; Height: 9.52 mm; Thermal Resistance: 15 ohm;
2005
Ro Associates
PF433G
HEAT SINK; Body Material: ALUMINUM; Construction: CLIP; Height: 13 mm; Length: 19.5 mm; Finish: ANODIZED;
ATS-54375W-C1-R0
573100D00010G
HEAT SINK; Profile: U; Body Material: COPPER; Construction: FIN; Fin Orientation: LONGITUDINAL; Packing Method: TAPE AND REEL;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
576802B04000G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Construction: CLIP; Length: 14.48 mm;
576802B00000G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: CLIP; Fin Orientation: TRANSVERSE; Width: 12.7 mm;
576802B03100G
Boyd 576802B03100G Heat Sink has Thermal Resistance of 27.3 ohm, Height 12.7mm, and Width 14.48mm. Ideal for cooling electronic components in compact spaces due to its small dimensions and efficient heat dissipation capabilities.
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: CLIP; Fin Orientation: TRANSVERSE; Thermal Resistance: 27.3 ohm;
576802B03700G
576802B03900G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: CLIP; Fin Orientation: TRANSVERSE; Length: 12.7 mm;
576802B04100G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: CLIP; Width: 12.7 mm; Finish: ANODIZED;
576802B03200G
HEAT SINK; Body Material: ALUMINUM; Construction: CLIP; Height: 19.05 mm; Length: 14.48 mm; Color: BLACK;
576802B03300G
HEAT SINK; Body Material: ALUMINUM; Construction: CLIP; Finish: ANODIZED; Length: 14.48 mm; Color: BLACK;
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: CLIP; Fin Orientation: TRANSVERSE; Length: 14.48 mm;
HEAT SINK; Body Material: ALUMINUM; Construction: CLIP; Width: 12.7 mm; Thermal Resistance: 27.3 ohm; Finish: ANODIZED;
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: CLIP; Width: 12.7 mm; Color: BLACK;
HEAT SINK; Body Material: ALUMINUM; Construction: CLIP; Finish: ANODIZED; Thermal Resistance: 27.3 ohm; Height: 19.05 mm;
576802B04000
HEAT SINK; Profile: U; Device Used On: TRANSISTOR; Construction: FIN; Fin Orientation: FOLDEDBACK; Thermal Resistance: 27.3 ohm;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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