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508600B00000G

Boyd

508600B00000G by Boyd

Boyd 508600B00000G Heat Sink features Thermal Resistance of 32Ω, Height 4.83mm, and Length 36.83mm. Ideal for cooling electronic components in compact spaces with efficient heat dissipation needs.

Median Price

$3.718

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 72 parts In-Stock

1+ parts

$3.718

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72

$3.718

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Vyrian

USA . 1,065 parts In-Stock

1+ parts

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1,065

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 50 parts In-Stock

1+ parts

$3.644

100+ parts

-

1k+ parts

$3.498

10k+ parts

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50

$3.644

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$3.498

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Continental Prestige Electronics

USA . 2,106 parts In-Stock

1+ parts

$3.718

100+ parts

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$3.644

2,106

$3.718

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$3.644

Argo Parts USA

USA . 2,016 parts In-Stock

1+ parts

$3.718

100+ parts

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2,016

$3.718

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AZTECH Wire

Italy . 392 parts In-Stock

1+ parts

$6.831

100+ parts

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392

$6.831

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Overview

Discover the unparalleled quality and innovation of Boyd's 508600B00000G heat sink. Designed with precision and expertise, this heat sink offers exceptional thermal resistance and efficiency for various applications. Its anodized finish and extruded construction not only ensure durability but also enhance performance. Say goodbye to overheating with this sleek and reliable heat sink that guarantees optimal cooling for your electronic devices. Upgrade to Boyd's 508600B00000G and experience the difference in quality and value today.

Feature Benefit Bullets

Thermal Resistance: 32 ohm

Low thermal resistance ensures efficient heat dissipation, keeping the device cool and functioning optimally.

Thermal Device Type: HEAT SINK

Specifically designed as a heat sink, ensuring maximum heat dissipation capabilities for electronic components.

Height: 4.83 mm

Compact height allows for easy integration into various electronic devices without taking up too much space.

Finish: ANODIZED

Anodized finish provides durability and corrosion resistance, extending the lifespan of the heat sink.

Width: 13.46 mm

Optimal width for efficient heat dissipation while still fitting within the constraints of many electronic devices.

Construction: EXTRUDED

Extruded construction ensures a strong and lightweight design, ideal for effectively dissipating heat.

Color: BLACK

Black color gives a sleek and professional look to the heat sink, suitable for various applications.

Fin Orientation: LONGITUDINAL

Longitudinal fin orientation enhances heat dissipation efficiency by maximizing surface area for better thermal transfer.

Body Material: ALUMINUM

Aluminum is a lightweight and excellent thermal conductor, making it an ideal material for heat sink construction.

Length: 36.83 mm

A moderate length allows for sufficient area for effective heat dissipation while still maintaining a compact form factor.

Technical Specifications

Heat Sinks 508600B00000G attributes and parameters. Explore more Heat Sinks devices from Boyd

Device Specifications

Construction:

Fin Orientation:

Physical Specifications

Height:

0.19 in (4.83 mm)

Width:

0.53 in (13.46 mm)

Length:

1.45 in (36.83 mm)

Material and Finish

Finish:

Anodized

Body Material Composition:

Color:

Black

Thermal Specifications

Thermal Resistance:

32 Ω

Usage and Compatibility

Device Type:

Manufacturer Highlights

Boyd

Boyd is the world's leading innovator in sustainable engineered material and thermal solutions that make our customers’ products better, safer, faster, and more reliable. We develop and combine technologies to solve ambitious performance targets in our customers’ most critical applications. By implementing technologies and material science in novel ways to seal, protect, cool, and interface, Boyd has continually redefined the possible and championed customer success for over 90 years. Innovation demands for smaller, lighter, and faster technologies with intuitive new features compete with the need for more sustainable solutions. More smart functionality operating faster in tighter spaces with more sophisticated interfaces mean increased power density and more heat, electrical, and mechanical challenges. Adding further complexity, devices are used in unpredictable environments with harsh conditions and must be contaminant and waterproof, insulated against temperature extremes, and ruggedized. Not only are we determined to find solutions to these challenges, Boyd strives to simplify where possible and create the most wholistic, effective, and sustainable solutions.

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