Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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ATS-X50400B-C1-R0 by Advanced Thermal Solutions is a 7.5mm high, 40x40mm blue anodized pin fin array heat sink with omnidirectional fins. Ideal for cooling electronic components in compact spaces due to its small profile and efficient heat dissipation capabilities. Perfect for applications requiring effective thermal management solutions.
Median Price
$3.660
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Arrow
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$0.712
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Chip1Stop
DigiKey
$25.670
$20.100
$18.446
Verical
Nova Conductors
$13.645
Vyrian
Netroflash
$13.372
$12.963
$12.690
AZTECH Wire
$14.664
Advanced Electronics
This specific design ensures efficient heat dissipation, making it a reliable choice for cooling purposes.
The pin fin array profile maximizes surface area for better heat transfer, enhancing the heat sink's performance.
With a low profile height, this heat sink can be easily integrated into compact systems without compromising on cooling capacity.
The anodized finish not only enhances the heat sink's durability but also improves its thermal conductivity for optimal cooling.
The 40mm width provides a balanced cooling solution for various electronic components, making it a versatile choice for heat dissipation.
The fin construction design enhances airflow efficiency, ensuring effective heat dissipation and maintaining optimal temperature levels.
The blue color adds a visually appealing touch to the heat sink, making it a stylish yet functional cooling solution.
The omnidirectional fin orientation allows for uniform heat distribution, ensuring consistent cooling performance across the entire heat sink.
The 40mm length accommodates larger heat loads, making this heat sink an ideal choice for high-power electronic devices.
Heat Sinks ATS-X50400B-C1-R0 attributes and parameters. Explore more Heat Sinks devices from Advanced Thermal Solutions
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Advanced Thermal Solutions, Inc. (ATS) has been in business for more than 25 years as a leading-edge engineering and manufacturing company focused on the thermal management of electronics. Founded in 1989 as a consulting company, ATS has evolved into a complete thermal solutions provider and is world-renowned for its portfolio of more than 5,000 high- and ultra-performance heat sinks, its industry-leading liquid cooling solutions, the broadest off-the-shelf heat pipe line on the market, expert consulting and design services, research-quality test equipment, and leading-edge R&D. ATS has established its own manufacturing center in the U.S. and developed strategic partnerships with Asian manufacturers to provide its global customers with complete thermal solutions ready to tackle the industry’s toughest challenges. ATS is committed to providing the electronics industry with innovative, high-quality and cost-effective thermal management and packaging solutions. Our goal is to be our customers’ value-added supplier and success partner for all thermal and packaging needs - analysis, testing and final product.
M24308/2-1F
Amphenol
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body or Shell Style: RECEPTACLE; Body Length: 1.228 inch; No. of Rows Loaded: 2;
ULN2803A
STMicroelectronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; No. of Elements: 8; Minimum DC Current Gain (hFE): 1000;
MS3V-T1R32.768KHZ+/-20PPM12.5PF
Golledge Electronics
MS3V-T1R32.768KHZ+/-20PPM12.5PF by Golledge Electronics is a crystal oscillator with 20 ppm frequency tolerance, 126% stability, and 12.5 pF load capacitance. It is ideal for applications requiring precise timing in temperature-sensitive environments due to its -40 to 85 °C operating range.
SS14
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
International Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
PIC18F4550T-I/PT
Microchip Technology
The Microchip Technology PIC18F4550T-I/PT microcontroller operates at a max clock frequency of 48 MHz with 8-bit architecture. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it suitable for industrial applications requiring high-speed data processing and analog-to-digital conversion. With low power mode and flash ROM programmability, this device offers efficient performance in compact designs.
TM4C1294NCPDTI3
Texas Instruments
TM4C1294NCPDTI3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 8KB data EEPROM, 20-Ch 12-Bit ADC channels, and 32 DMA channels. Ideal for industrial applications requiring high-speed processing, it offers connectivity options like CAN, Ethernet, I2C, SPI, UART, and USB.
MMBT2222ALT1G
Rochester Electronics
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .3 W; Maximum Collector Current (IC): .6 A;
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
EEAGA1H4R7
Panasonic
Panasonic EEAGA1H4R7 is a 4.7uF, 50V Aluminum Electrolytic Capacitor with 0.1 Tan Delta and 0.003mA Leakage Current. Ideal for applications requiring high ripple current handling in temperatures ranging from -55 to 105°C.
OHN3140U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
Continental Device India
MBRS360T3G
Onsemi
MBRS360T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.63V and a max output current of 3A. It is designed for applications requiring high-speed switching and low power loss, making it suitable for use in various electronic devices.
LM555CM
Harris Semiconductor
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
RC0402FR-0710KL
Yageo
Yageo's RC0402FR-0710KL is a 10000 ohm SMT fixed resistor with 1% tolerance, suitable for applications requiring a rated power dissipation of 0.0625 W. With a temperature coefficient of 100 ppm/°C, it operates b/w -55 to 155 °C, making it ideal for various electronic circuits.
ABS07-32.768KHZ-T
Abracon
Abracon ABS07-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 144% stability, and 70000 ohm series resistance. Ideal for applications requiring 0.032768 MHz frequency precision in a compact surface-mount design with gold over nickel finish.
M39029/56351
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/56351 is a CRIMP contact type backshell accessory compliant with MIL-DTL-38999. It features FEMALE gender contacts, compatible with M39029/58363 mating contacts. The insertion and removal tools required are M81969/14-10 and M22520/2-10 respectively, making it ideal for military connector applications.
261
Micronetics
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
SMBJ18CA
Protek Devices
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 175 Cel; Maximum Reverse Recovery Time: .004 us; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V;
ICKSMDA5SA
Fischer Elektronik & Kg
HEAT SINK;
61085
Aavid Thermalloy
573300D00000G
Boyd
Boyd 573300D00000G Heat Sink has Thermal Resistance of 18Ω, U Profile, and Copper Body Material. Ideal for applications requiring efficient heat dissipation in compact spaces.
APA501-60-001
Artesyn Embedded Technologies
Artesyn Embedded Technologies' APA501-60-001 heat sink features a pin fin array profile with dimensions of 15x57.5x59 mm (HxWxL). It is constructed with longitudinal fins and designed for thermal management applications in various electronic devices.
FK245MI247V
658-60AB-T3
WAKEFIELD-VETTE INC
Wakefield-vette's 658-60AB-T3 is a PIN FIN ARRAY HEAT SINK with dimensions 27.9mm x 27.9mm x 15.2mm and weight of 14.17g, featuring anodized finish and omnidirectional fin orientation. Ideal for cooling electronic components in compact spaces due to its efficient heat dissipation capabilities.
ATSEU-077D-C1-R0
Advanced Thermal Solutions
576802B00000G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: CLIP; Fin Orientation: TRANSVERSE; Thermal Resistance: 27.3 ohm;
573100D00010G
HEAT SINK; Profile: U; Body Material: COPPER; Construction: FIN; Fin Orientation: LONGITUDINAL; Packing Method: TAPE AND REEL;
6399BG
HEAT SINK; Profile: PIN FIN ARRAY; Body Material: ALUMINUM; Construction: EXTRUDED; Height: 50.8 mm; Color: BLACK;
527-24AB-MS4
527-24AB-MS4 by Wakefield-vette is a black anodized aluminum heat sink measuring 61x57.9x6.1mm (LxWxH). It is extruded for efficient thermal dissipation, ideal for cooling electronic components in various applications.
401K
HEAT SINK; Construction: EXTRUDED; Height: 31.8 mm; Length: 38.1 mm; Weight: 68.04 g; Width: 120.7 mm;
281-2AB
Ohmite Manufacturing
The Ohmite Manufacturing 281-2AB Heat Sink is 12.7mm in height, 13.2mm in width, and 19.1mm in length with an anodized black aluminum body. Ideal for thermal management in electronic devices, it efficiently dissipates heat to prevent overheating, ensuring optimal performance and longevity.
FK237SA220V
FK237SA220V by Fischer Elektronik & Kg is a black anodized aluminum heat sink measuring 12.7mm in height, 14.5mm in width, and 19.05mm in length. Primarily used on transistors for effective heat dissipation in electronic devices.
658-60AB
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Width: 27.9 mm; Color: BLACK;
APA501-60-003
Astec America
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: LONGITUDINAL; Height: 22.9 mm; Width: 57.5 mm;
578622B03200G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Construction: FIN; Fin Orientation: TRANSVERSE;
DA-T263-301E-TR
577202B04000G
Boyd's 577202B04000G Heat Sink has a Thermal Resistance of 24.4 ohm, U Profile, and Aluminum Body Material. Ideal for applications requiring efficient heat dissipation in compact spaces like electronic devices or LED lighting systems.
ATS-56010-C4-R0
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
ATS-X53400B-C1-R0
ATS-X53400G-C1-R0
ATS-X50210G-C1-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Length: 21 mm; Height: 12.5 mm;
ATS-X50210P-C1-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Height: 17.5 mm; Length: 21 mm;
ATS-X50230G-C1-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Length: 23 mm; Width: 23 mm;
ATS-X50230P-C1-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Color: BLUE; Height: 17.5 mm;
ATS-X50250B-C1-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Finish: ANODIZED; Length: 25 mm;
ATS-X50250G-C1-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Finish: ANODIZED; Width: 25 mm;
ATS-X50270G-C1-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Color: BLUE; Length: 27 mm;
ATS-X50310B-C1-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Height: 7.5 mm; Width: 31 mm;
ATS-X50325B-C1-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Height: 7.5 mm; Color: BLUE;
ATS-X50325G-C1-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Length: 32.5 mm; Finish: ANODIZED;
ATS-X50400G-C1-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Length: 40 mm; Height: 12.5 mm;
ATS-X50400P-C1-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Length: 40 mm; Height: 17.5 mm;
ATS-X50425B-C1-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Width: 42.5 mm; Height: 7.5 mm;
ATS-X50425G-C1-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Length: 42.5 mm; Width: 42.5 mm;
ATS-X50425P-C1-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Width: 42.5 mm; Finish: ANODIZED;
ATS-X50450B-C1-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Length: 45 mm; Width: 45 mm;
ATS-X50450G-C1-R0
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Color: BLUE; Finish: ANODIZED;
ATS-X50450P-C1-R0
Supply Digital Components
$106.00
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