Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
910-40-1-23-2-B-0 by Wakefield Thermal Solutions is a heat sink with thermal resistance of 9.95 ohm, elliptical fin orientation, and black anodized finish. It is an extruded aluminum alloy device used on ICs for efficient heat dissipation in electronic applications.
Median Price
$11.420
Lifecycle Status
Suppliers In-Stock
6
In-Stock Inventory
1k+
DigiKey
1+ parts
$11.150
100+ parts
$8.729
1k+ parts
$7.934
10k+ parts
$7.646
Verical
-
$11.690
$11.046
Nova Conductors
$7.478
Vyrian
Electro Sonic
$8.830
$7.950
$7.840
IBS Electronics
$11.141
$10.036
$9.893
AZTECH Wire
$6.520
Netroflash
$7.104
$6.954
This low thermal resistance ensures efficient heat dissipation, making it a reliable choice for cooling ICs.
The heat sink type ensures effective heat transfer, ideal for keeping electronic components cool under heavy use.
The clip profile allows for easy installation and removal, providing convenient maintenance for the heat sink.
With a compact height of 23mm, this heat sink can fit into tight spaces while still providing effective cooling.
The black anodized finish not only enhances the heat sink's appearance but also improves its heat dissipation properties.
The 40mm width provides a good surface area for heat dissipation, ensuring efficient cooling performance.
The extruded construction offers a lightweight and durable design, making this heat sink a long-lasting cooling solution.
The elliptical fin orientation maximizes heat dissipation efficiency, making this heat sink suitable for high-performance applications.
Constructed from aluminum alloy, this heat sink offers excellent thermal conductivity while being lightweight and corrosion-resistant.
The 40mm length provides sufficient coverage for electronic components, ensuring optimal heat dissipation and overall system performance.
Specifically designed for ICs, this heat sink effectively prevents overheating, ensuring the reliable operation of electronic devices.
Heat Sinks 910-40-1-23-2-B-0 attributes and parameters. Explore more Heat Sinks devices from Wakefield Thermal Solutions
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Wakefield Thermal has been in continuous operations since 1957, providing thermal solutions across multiple industries, from international Fortune 50 companies to small and medium sized businesses. Industries served include Power Conversion, Information Technology, Renewable Energy, Telecommunications, Transportation, Aerospace/Defense, LED Lighting, Factory Automation, Consumer, and Medical. The thermal solutions Wakefield Thermal manufactures comprise a wide array of products, including thermal extrusions, LED heat sinks, heat frames and pipes, fans, heat exchangers, coolant distribution units, liquid cold plates, etc., making Wakefield Thermal unique in its ability to deliver the increasingly complex thermal solutions required to meet the thermal engineering challenges of today's ever-higher electronics packaging densities.
PIC18F4550-I/PT
Microchip Technology
PIC18F4550-I/PT by Microchip: 8-bit microcontroller with 44 terminals, 48 MHz clock frequency, and USB connectivity. Ideal for industrial applications requiring low power mode and 10-bit ADC channels.
ERJU06F10R0V
Panasonic
ERJU06F10R0V by Panasonic is an 0805 size SMT fixed resistor with a resistance of 10 ohm and 1% tolerance. It operates b/w -55 to 155 °C, suitable for AEC-Q200 standards in automotive applications due to its high temperature coefficient of 100 ppm/°C. With a max operating voltage of 150 V and power dissipation of 0.125 W, it is ideal for surface mounting type.
FT232RL-TUBE
FTDI
FTDI's FT232RL-TUBE is a bus controller with 28 terminals, operating at 3.3-5.25V. It supports USB, VBUS, and UART interfaces with a data transfer rate of 60MBps. Ideal for industrial applications requiring RS232/RS422/RS485 compatibility in compact designs due to its small outline package style.
1N4148
Weitron Technology
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb);
BSS138
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Feedback Capacitance (Crss): 10 pF; JEDEC-95 Code: TO-236AB;
LM358MX
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
SMBJ18CA
Littelfuse
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
ABS25-32.768KHZ-T
Abracon
Abracon's ABS25-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 122% stability, and 50000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal frequency, such as IoT devices and precision timing systems in industrial settings.
M39029/58-360
Carlisle Interconnect Technologies
GENERAL CONN ACCESSORY; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; Maximum Operating Temperature: 200 Cel; MIL-Connector Accessory: CONTACT; Terminal Type: CRIMP; MIL Conformity: YES;
BAV99
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Taiwan Semiconductor
Rectron
C0603X104K5RACAUTO
KEMET Corporation
C0603X104K5RACAUTO by KEMET Corp is a ceramic capacitor with capacitance of 0.1 uF and rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate b/w -55 to 125 °C. This SMT package is commonly used in automotive applications due to its AEC-Q200 reference standard.
261
New England Microwave
Other Interface ICs; No. of Terminals: 14; Package Equivalence Code: FL14(UNSPEC); Power Supplies (V): +-5,-15; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
1N4148WS
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ROHM
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
OHN3020U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
LL4148
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM358M
Onsemi
V7236A1
Assmann Wsw Components
Heat Sinks;
577102B04000G
Boyd
Boyd's 577102B04000G Heat Sink has a thermal resistance of 25.9 ohm, U profile, and transverse fin orientation. Ideal for cooling electronic components in compact spaces due to its dimensions (13.21mm x 9.52mm x 19.05mm) and anodized black finish.
HS151DR
Sensata Technologies
HEAT SINK;
SK68100SA
Fischer Elektronik & Kg
SK68100SA by Fischer Elektronik & Kg is a 100mm extruded heat sink with thermal resistance of 5.85 ohm. It features screw profile, anodized finish, and longitudinal fin orientation. Ideal for use on transistors to dissipate heat efficiently in electronic devices.
7109DG/TR
Boyd's 7109DG/TR heat sink has a thermal resistance of 11 ohm, made of copper with dimensions 25.4mm x 19.38mm x 11.43mm. Ideal for ICs due to folded-back fin orientation and TIN finish, packaged in tape and reel for easy handling during assembly.
HF20G
Boyd's HF20G heat sink boasts a low thermal resistance of 13.1 ohm, ideal for dissipating heat efficiently. With a height of 27.94mm and extruded aluminum construction, it is suitable for compact electronic devices requiring effective cooling. The anodized finish and black color add to its aesthetic appeal in various applications.
574502B03300G
Boyd's 574502B03300G is a black anodized aluminum heat sink with dimensions of 20.57mm x 9.9mm x 19.05mm (LxWxH). It has a thermal resistance of 21.2 ohm and features a slide-on construction, making it suitable for various applications requiring efficient heat dissipation.
CR101-75AE
Ohmite Manufacturing
The Ohmite CR101-75AE Heat Sink features a thermal resistance of 4.2 ohm, aluminum alloy construction, and a height of 50mm. Ideal for applications requiring efficient heat dissipation in compact spaces such as electronic devices or industrial equipment.
ATS-1181-C1-R0
Advanced Thermal Solutions
PF750G
Aavid Thermalloy
HEAT SINK; Profile: U; Body Material: COPPER; Thermal Resistance: 20.3 ohm; Width: 11 mm; Finish: TIN;
302NN
WAKEFIELD-VETTE INC
302NN by Wakefield-vette is a black anodized heat sink made of aluminum, with dimensions of 50.8mm x 50.8mm x 38.1mm and weighing 60.33g. Ideal for cooling electronic components in various applications due to its efficient thermal dissipation capabilities and durable construction.
281-1AB
HEAT SINK; Body Material: ALUMINUM; Length: 19.1 mm; Color: BLACK; Finish: ANODIZED; Width: 13.2 mm;
573300D00000G
HEAT SINK; Profile: U; Body Material: COPPER; Construction: FIN; Finish: TIN; Thermal Resistance: 18 ohm;
TEN-HS4
Traco Electronic Ag
PF433G
Boyd's PF433G heat sink, 19.5mm height, 13mm width, and 12.7mm length, is ideal for transistors with a clip profile and anodized finish. Its aluminum body and transverse fin orientation ensure efficient heat dissipation in electronic devices.
HS202DR
FA-T220-51E
The Ohmite FA-T220-51E is a black anodized aluminum heat sink measuring 41.6mm x 25mm x 50.8mm and weighing 37g. With omnidirectional fin orientation, it efficiently dissipates heat in various applications like electronics cooling systems. Ideal for compact spaces requiring effective thermal management.
577202B00000G
Boyd's 577202B00000G Heat Sink is 19.05mm tall with a width of 12.7mm and length of 13.21mm, made of black anodized aluminum fins for efficient heat dissipation. Ideal for applications requiring compact cooling solutions in electronic devices or industrial equipment due to its transverse fin orientation and construction design.
PF526G
Boyd PF526G heat sink has 8.9 ohm thermal resistance, 19mm height, anodized black finish. Ideal for cooling electronic components in various applications due to its aluminum body material and efficient heat dissipation capabilities.
WA400-11P
Schaffner Holding Ag
WA400-11P by Schaffner Holding Ag is a U-shaped HEAT SINK with dimensions 25x11x16 mm. It has a low Thermal Resistance of 18 ohm, ideal for cooling TRANSISTOR devices efficiently. Suitable for various electronic applications requiring compact and effective heat dissipation solutions.
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910-40-2-12-2-B-0
Wakefield-vette
910-40-2-23-2-B-0
Wakefield Thermal Solutions
HEAT SINK; Profile: CLIP; Body Material: ALUMINIUM ALLOY; Device Used On: IC; Construction: EXTRUDED; Fin Orientation: PIN FIN;
910-40-1-21-2-B-0
HEAT SINK; Profile: CLIP; Body Material: ALUMINIUM ALLOY; Device Used On: IC; Construction: EXTRUDED; Fin Orientation: ELLIPTICAL FIN;
910-40-1-28-2-B-0
910-40-1-33-2-B-0
910-40-1-12-1-B-0
910-40-1-12-2-B-1
910-40-1-15-2-B-1
910-40-1-18-1-B-0
910-40-1-18-2-B-0
910-40-1-18-2-B-1
910-40-1-21-1-B-0
910-40-1-21-1-B-1
910-40-1-21-2-B-1
910-40-1-23-1-B-0
910-40-1-23-1-B-1
910-40-1-23-2-B-1
910-40-1-28-1-B-0
910-40-1-28-1-B-1
910-40-1-28-2-B-1
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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