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906-31-2-21-2-B-0

Wakefield Thermal Solutions

906-31-2-21-2-B-0 by Wakefield Thermal Solutions

Wakefield Thermal Solutions' 906-31-2-21-2-B-0 heat sink has a thermal resistance of 12.02 ohm, aluminum alloy construction, and pin fin orientation. It is designed for IC devices to efficiently dissipate heat in various applications.

Median Price

$6.060

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

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$6.060

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300

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Vyrian

USA . 6,821 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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$5.938

100+ parts

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$5.701

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500

$5.938

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$5.701

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AZTECH Wire

Italy . 887 parts In-Stock

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$6.333

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887

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Corohmni

South Africa . 602 parts In-Stock

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$6.395

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602

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Advanced Electronics

New Zealand . 200 parts In-Stock

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Overview

Wakefield Thermal Solutions presents the 906-31-2-21-2-B-0, a high-quality heat sink designed to efficiently dissipate heat from IC devices. Manufactured by Wakefield Thermal Solutions, this black anodized clip-style heat sink offers a thermal resistance of 12.02 ohm, making it ideal for applications where thermal management is crucial. Experience improved performance and reliability with this extruded aluminum alloy heat sink, providing value and benefits that exceed expectations. Trust Wakefield Thermal Solutions for superior thermal solutions tailored to your needs.

Feature Benefit Bullets

Thermal Resistance: 12.02 ohm

Low thermal resistance helps in efficiently dissipating heat from the IC, ensuring optimal performance and reliability.

Thermal Device Type: HEAT SINK

Being a heat sink, this product is specifically designed to dissipate heat generated by the IC, preventing overheating and potential damage.

Profile: CLIP

The clip profile makes it easy to install and remove the heat sink from the IC, providing convenient maintenance and flexibility.

Height: 21 mm

The height of 21mm ensures sufficient surface area for heat dissipation, enhancing the cooling efficiency of the heat sink.

Finish: BLACK ANODIZED

The black anodized finish not only gives a sleek appearance but also improves heat transfer, making the heat sink more effective in dissipating heat.

Width: 31 mm

With a width of 31mm, this heat sink provides adequate coverage for the IC, maximizing heat dissipation and thermal performance.

Construction: EXTRUDED

The extruded construction of this heat sink offers excellent thermal conductivity and durability, ensuring reliable heat dissipation over extended periods.

Fin Orientation: PIN FIN

The pin fin design enhances the surface area for heat dissipation, improving the overall cooling efficiency of the heat sink.

Body Material: ALUMINIUM ALLOY

The use of aluminum alloy in the construction of the heat sink provides excellent thermal conductivity and lightweight properties, making it a durable and efficient cooling solution.

Length: 31 mm

The length of 31mm ensures proper coverage of the IC, allowing for effective heat dissipation and thermal management.

Device Used On: IC

This heat sink is specifically designed for use on Integrated Circuits (ICs), providing targeted and efficient cooling to maintain optimal performance and reliability.

Technical Specifications

Heat Sinks 906-31-2-21-2-B-0 attributes and parameters. Explore more Heat Sinks devices from Wakefield Thermal Solutions

Device Specifications

Construction:

Profile:

Fin Orientation:

Physical Specifications

Height:

0.827 in (21 mm)

Width:

1.22 in (31 mm)

Length:

1.22 in (31 mm)

Material and Finish

Finish:

Black Anodized

Body Material Composition:

Thermal Specifications

Thermal Resistance:

12.02 Ω

Usage and Compatibility

Device Type:

Compatible Device:

IC

Manufacturer Highlights

Wakefield Thermal Solutions

Wakefield Thermal has been in continuous operations since 1957, providing thermal solutions across multiple industries, from international Fortune 50 companies to small and medium sized businesses. Industries served include Power Conversion, Information Technology, Renewable Energy, Telecommunications, Transportation, Aerospace/Defense, LED Lighting, Factory Automation, Consumer, and Medical. The thermal solutions Wakefield Thermal manufactures comprise a wide array of products, including thermal extrusions, LED heat sinks, heat frames and pipes, fans, heat exchangers, coolant distribution units, liquid cold plates, etc., making Wakefield Thermal unique in its ability to deliver the increasingly complex thermal solutions required to meet the thermal engineering challenges of today's ever-higher electronics packaging densities.

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