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Heat Sinks

Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.

Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.

Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.

Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.

However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.

Heat Sinks

Available Parts 56

Part# Info Device Specifications Physical Specifications Material and Finish Thermal Specifications Usage and Compatibility
Part RoHS Manufacturer Description Construction Profile Fin Orientation Packing Method Additional Features Standards Height Width Length Weight Finish Body Material Composition Color Thermal Resistance Rated Power Device Type Compatible Device
V8508C by Assmann Wsw Components

V8508C

Assmann Wsw Components

Heat Sinks;

V7236B1 by Assmann Wsw Components

V7236B1

Assmann Wsw Components

Heat Sinks;

HSB16-404018 by CUI Devices

HSB16-404018

CUI Devices

HEAT SINK;

Heat Sink

CR101-75AE by Ohmite Manufacturing

CR101-75AE

Ohmite Manufacturing

The Ohmite CR101-75AE Heat Sink features a thermal resistance of 4.2 ohm, aluminum alloy construction, and a height of 50mm. Ideal for applications requiring efficient heat dissipation in compact spaces such as electronic devices or industrial equipment.

Extruded

Clip

1.969 in (50 mm)

1.063 in (27 mm)

2.953 in (75 mm)

85 g

Anodized

Aluminium Alloy

Black

4.2 Ω

Heat Sink

V5641A-T by Assmann Wsw Components

V5641A-T

Assmann Wsw Components

V5641A-T by Assmann Wsw Components is a 6.4mm high, 22.3mm wide black anodized heat sink with thermal resistance of 21 ohm. Made of aluminum alloy, it's designed for transistors with folded back fin orientation, measuring 35.8mm in length.

Folded Back

0.252 in (6.4 mm)

0.878 in (22.3 mm)

1.409 in (35.8 mm)

Anodized

Aluminium Alloy

Black

21 Ω

Heat Sink

Transistor

7G0020A by TDK

7G0020A

TDK

The TDK 7G0020A heat sink has a thermal resistance of 10 ohm, with dimensions of 5.6mm x 24.2mm x 49.8mm and weight of 9.49g. It is designed for use on converters, featuring an omnidirectional fin orientation for efficient heat dissipation in electronic devices.

Fin Pin

Omnidirectional

0.22 in (5.6 mm)

0.953 in (24.2 mm)

1.961 in (49.8 mm)

9.49 g

10 Ω

Heat Sink

Converter

7G0011A by TDK

7G0011A

TDK

The TDK 7G0011A heat sink has a thermal resistance of 8.24Ω, with dimensions of 5.7mm x 37.4mm x 50mm and weight of 14.6g. It is designed for converters, featuring an omnidirectional fin orientation for efficient heat dissipation in various applications.

Fin Pin

Omnidirectional

0.224 in (5.7 mm)

1.472 in (37.4 mm)

1.969 in (50 mm)

14.6 g

8.24 Ω

Heat Sink

Converter

HAF-15T by TDK

HAF-15T

TDK

The TDK HAF-15T Heat Sink features a thermal resistance of 1.5Ω, with dimensions of 38.1mm x 61mm x 116.8mm and weight of 250g. Designed for converters, it utilizes fin pin construction with omnidirectional fin orientation for efficient heat dissipation in electronic devices.

Fin Pin

Omnidirectional

1.5 in (38.1 mm)

2.402 in (61 mm)

4.598 in (116.8 mm)

250 g

1.5 Ω

Heat Sink

Converter