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APF40-40-13CB/A01

Cts

APF40-40-13CB/A01 by Cts

The Cts APF40-40-13CB/A01 is a 40x40mm black adhesive heat sink with thermal resistance of 9.9 ohm, ideal for ICs. Made of aluminum alloy, it has a height of 12.7mm and anodized finish, providing efficient heat dissipation in compact spaces.

Median Price

$10.000

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 940 parts In-Stock

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$10.000

100+ parts

$7.833

1k+ parts

$7.679

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940

$10.000

$7.833

$7.679

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Nova Conductors

Japan . 50 parts In-Stock

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$6.084

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$6.084

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Vyrian

USA . 7,019 parts In-Stock

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Bristol Electronics

USA . 1,106 parts In-Stock

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Sea View Technologies

USA . 1,015 parts In-Stock

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VNN

France . 45 parts In-Stock

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Resion

USA . 42 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 4,432 parts In-Stock

1+ parts

$6.084

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$5.962

4,432

$6.084

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$5.962

AZTECH Wire

Italy . 858 parts In-Stock

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$7.172

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858

$7.172

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Argo Parts USA

USA . 4,530 parts In-Stock

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4,530

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Perfect Parts

USA . 335 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$5.962

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$5.780

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$5.658

50

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$5.962

$5.780

$5.658

Overview

Upgrade your electronic devices with the APF40-40-13CB/A01 heat sink by Cts - a trusted manufacturer known for quality and innovation. Designed to efficiently dissipate heat, this adhesive heat sink is perfect for ICs, ensuring optimal performance and longevity. Say goodbye to overheating issues and hello to seamless operation with the APF40-40-13CB/A01. Experience the difference today!

Feature Benefit Bullets

Thermal Resistance: 9.9 ohm

Low thermal resistance allows for efficient heat dissipation, ensuring optimal performance of the IC.

Thermal Device Type: HEAT SINK

A heat sink is an essential component for thermal management in electronic devices, ensuring that heat is efficiently transferred away from the IC.

Profile: ADHESIVE

The adhesive profile allows for easy installation and secure attachment to the IC, enhancing thermal conductivity.

Height: 12.7 mm

The height of 12.7mm provides sufficient surface area for heat dissipation while maintaining a compact design.

Finish: ANODIZED

Anodized finish enhances the durability and corrosion resistance of the heat sink, ensuring long-lasting performance.

Width: 40 mm

The width of 40mm provides adequate coverage for heat dissipation, ensuring efficient cooling of the IC.

Color: BLACK

Black color gives a sleek and professional appearance, making it suitable for a variety of applications.

Body Material: ALUMINUM ALLOY

Aluminum alloy is lightweight yet offers good thermal conductivity, making it an ideal material for heat sink applications.

Length: 40 mm

The length of 40mm provides a balanced design for efficient heat dissipation without being overly bulky.

Device Used On: IC

Designed specifically for use on integrated circuits, ensuring that the heat sink is tailored for optimal thermal management of the IC.

Technical Specifications

Heat Sinks APF40-40-13CB/A01 attributes and parameters. Explore more Heat Sinks devices from Cts

Device Specifications

Profile:

Physical Specifications

Height:

0.5 in (12.7 mm)

Width:

1.575 in (40 mm)

Length:

1.575 in (40 mm)

Material and Finish

Finish:

Anodized

Body Material Composition:

Color:

Black

Thermal Specifications

Thermal Resistance:

9.9 Ω

Usage and Compatibility

Device Type:

Compatible Device:

IC

Manufacturer Highlights

Cts

Founded in 1896, CTS Corporation (NYSE: CTS) is a leading designer and manufacturer of products that Sense, Connect, and Move. The company manufactures sensors, actuators, and electronic components in North America, Europe, and Asia. CTS provides solutions to OEMs in the aerospace, communications, defense, industrial, information technology, medical, and transportation markets. CTS focuses on providing advanced technology, exceptional customer service and superior value to industry partners throughout the globe. CTS aims to be at the forefront of technology, delivering innovative sensing, connectivity and motion solutions for the creation and advancement of products and services around the world.

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