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TIBPAL16L8-10MWB

Texas Instruments

TIBPAL16L8-10MWB by Texas Instruments

TIBPAL16L8-10MWB by Texas Instruments is a TTL technology-based PAL-type PLD with 12ns propagation delay, 64 product terms, and 52.5MHz max clock frequency. Ideal for military applications due to MIL-PRF-38535 screening level, it features 10 dedicated inputs and 6 I/O lines in a flatpack package style.

Median Price

$26.440

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 25 parts In-Stock

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$26.440

100+ parts

$27.762

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$26.176

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Vyrian

USA . 5,938 parts In-Stock

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Digiode

USA . 1,497 parts In-Stock

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1,497

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Resion

USA . 11 parts In-Stock

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Electronic Expediters

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Electronics Depot

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One Stop Electronics

USA . 1,528 parts In-Stock

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$17.000

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AZTECH Wire

Italy . 316 parts In-Stock

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$17.024

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Parana Technologies

USA . 1,862 parts In-Stock

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$85.992

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DigiPath Technology Company

USA . 2,138 parts In-Stock

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$94.688

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$87.113

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ChromeModa Solutions

Germany . 3,982 parts In-Stock

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$96.620

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$79.228

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IDEA Electronic Components Group

UK . 1,609 parts In-Stock

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$96.620

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$91.789

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$86.958

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Corphita

USA . 3,541 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TIBPAL16L8-10MWB from Texas Instruments. This high-quality Programmable Logic Device is perfect for a wide range of applications, offering fast propagation delays and reliable performance. Designed with precision and expertise, this PLD provides customers with unmatched value and benefits, making it a top choice for those seeking innovative solutions. Trust Texas Instruments to deliver excellence in every product, and experience the advantages of advanced technology with the TIBPAL16L8-10MWB.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Durable and reliable material ensures long-term performance and protection for the PLD.

Propagation Delay: 12 ns

Fast propagation delay allows for efficient data processing and high-speed operations.

Maximum Supply Voltage: 5.5 V

Can handle a high supply voltage, making it suitable for a wide range of applications.

Technology Used: TTL

Utilizes TTL technology known for its reliability and compatibility in various systems.

No. of Inputs: 10

Offers a sufficient number of inputs for versatile connectivity and input processing.

Output Function: COMBINATORIAL

Supports combinatorial logic operations for flexible and customizable output functions.

Maximum Clock Frequency: 52.5 MHz

High clock frequency allows for speedy operations and real-time processing.

Grading Of Temperature: MILITARY

Military-grade temperature grading ensures reliable performance in extreme conditions and harsh environments.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAL16L8-10MWB attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

10 Dedicated Inputs, 6 I/O

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

10

No. of Product Terms:

64

No. of Dedicated Inputs:

10

No. of I/O Lines:

6

Maximum Clock Frequency:

52.5 MHz

Propagation Delay:

12 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

Flatpack

Package Code:

DFP

Package Shape:

Package Equivalence Code:

FL20,.3

Width:

6.92 mm

Length:

13.09 mm

Maximum Seated Height:

2.45 mm

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

R-GDFP-F20

Qualified:

No

Screening Level:

MIL-PRF-38535

Trade Compliance

TIBPAL16L8-10MWB Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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