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EPM2210F324I5N

Intel

EPM2210F324I5N by Intel

The Intel EPM2210F324I5N is a programmable logic device (PLD) with 1700 macro cells and 272 inputs/outputs. It uses CMOS technology and has a max supply voltage of 2.625V. This PLD is suitable for applications requiring in-system programmability and output functions using macrocells.

Median Price

$136.600

Lifecycle Status

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Arrow

USA . 1,680 parts In-Stock

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Verical

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Digiode

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Nova Conductors

Japan . 41 parts In-Stock

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Cyclops Electronics Ltd

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PC Components Company LLC

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Vigor

Singapore . 804 parts In-Stock

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$85.420

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Texas Native Microelectronics

USA . 3,246 parts In-Stock

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Corphita

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Modulus Dynamics

Lithuania . 1,047 parts In-Stock

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Corohmni

South Africa . 675 parts In-Stock

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$111.888

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Semicontronic

India . 1,181 parts In-Stock

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$112.627

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Continental Prestige Electronics

USA . 5,981 parts In-Stock

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$120.264

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Kenton Components

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Aztec Data Supply Inc.

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Advanced Electronics

New Zealand . 4,772 parts In-Stock

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Microchip USA

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Ampacity Inc.

Singapore . 72 parts In-Stock

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Lixinc

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Alle Elektronik GmbH

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Glotronic Ltd.

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Supply Digital

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Netroflash

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Qasali Group International

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Speed Components Ltd (Excess)

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RC Electronics

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Futuretech Components

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Overview

Unlock endless possibilities with the EPM2210F324I5N by Intel. As a leading manufacturer in programmable logic devices (PLD), Intel delivers unparalleled quality and reliability in every product. Whether you're designing complex systems or seeking flexibility and scalability, this flash PLD is the perfect solution. With its 1700 macro cells and 272 inputs/outputs, you can customize your designs with ease. The EPM2210F324I5N offers lightning-fast speeds with a propagation delay of just 11.2 ns. Its in-system programmability and JTAG boundary scan test capabilities make it incredibly versatile. Experience the power of innovation and transform your projects with Intel's EPM2210F324I5N.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - The use of plastic/epoxy material for the package body ensures durability and protection for the internal components of the PLD, making it a reliable choice for various applications.

Propagation Delay

11.2 ns - With a low propagation delay, this PLD is capable of achieving fast response times, making it suitable for high-speed applications that require efficient signal processing.

Surface Mount

YES - The surface mount capability of this PLD simplifies the PCB assembly process, allowing for easy integration into a wide range of electronic systems.

Maximum Supply Voltage

2.625 V - The high maximum supply voltage tolerance provides flexibility in power requirements and allows the PLD to be compatible with different voltage levels, expanding its applicability.

No. of Macro Cells

1700 - The abundance of macro cells in this PLD allows for complex programming and customization, making it a versatile choice for designing intricate logic circuits.

Technology Used

CMOS - The employment of CMOS technology in this PLD results in low power consumption, reducing energy costs and minimizing heat dissipation, making it an energy-efficient option.

No. of Inputs

272 - With a large number of inputs, this PLD can process a significant amount of information simultaneously, offering enhanced versatility and accommodating complex input requirements.

Package Shape

SQUARE - The square package shape provides excellent space utilization, making it convenient for tight PCB layouts and compact electronic designs.

Form Of Terminal

BALL - The ball terminal form ensures a reliable and secure connection between the PLD and other components, contributing to the overall robustness and stability of the system.

Nominal Supply Voltage (V)

2.5 - The nominal supply voltage of 2.5V offers a standard power level that is commonly available, simplifying power supply design and integration.

Power Supplies (V)

1.5/3.3,2.5/3.3 - The flexibility in power supply voltage options (1.5/3.3V and 2.5/3.3V) enables compatibility with different system requirements, contributing to the versatility of this PLD.

No. of Terminals

324 - The abundance of terminals allows for easy connectivity with other components, facilitating seamless integration into various electronic systems.

Programmable IC Type

FLASH PLD - The use of flash-based programmable IC technology in this PLD provides reprogrammability and ease of customization, enabling adaptability to changing design requirements.

Package Style (Meter)

GRID ARRAY - The grid array package style offers excellent mechanical stability and electrical performance characteristics, ensuring reliable operation even in demanding environments.

In-System Programmable

YES - The in-system programmability of this PLD allows for convenient and efficient field upgrades and modifications, reducing downtime and enhancing system flexibility.

Output Function

MACROCELL - The availability of macrocells as output functions enables the PLD to perform complex logic operations and drive multiple output signals simultaneously, enhancing its versatility and utility.

Minimum Supply Voltage

2.375 V - The low minimum supply voltage requirement provides compatibility with lower power supply levels, making it suitable for energy-efficient designs and battery-powered applications.

Maximum Operating Temperature

100 °C - With a high maximum operating temperature, this PLD can withstand demanding environmental conditions, ensuring reliable operation even in harsh settings.

Pitch Of Terminal

1 mm - The small terminal pitch allows for high-density packaging and integration, enabling the PLD to fit into space-constrained designs and achieve compact circuit layouts.

Organization

0 DEDICATED INPUTS, 272 I/O - With dedicated inputs and a large number of I/O lines, this PLD allows for efficient interfacing with external devices, facilitating seamless integration and data exchange.

Minimum Operating Temperature

40 °C - The PLD's ability to operate in extremely low temperatures (-40°C) ensures reliable performance in cold environments or industrial applications that demand extended temperature ranges.

Finishing Of Terminal Used

Tin/Silver/Copper (Sn/Ag/Cu) - The use of tin/silver/copper as terminal finishing ensures good electrical conductivity, corrosion resistance, and solderability, contributing to the product's longevity and reliability.

Position Of Terminal

BOTTOM - The bottom position of the terminals simplifies PCB layout and component placement, maximizing utilization of available space and facilitating efficient assembly.

Moisture Sensitivity Level (MSL)

3 - The moisture sensitivity level 3 indicates that this PLD has a moderate susceptibility to moisture, making it suitable for various standard manufacturing and handling processes.

Maximum Seated Height

2.2 mm - With a low maximum seated height, this PLD can be easily incorporated into compact designs, enabling the creation of small form factor electronic devices.

Width

19 mm - The compact width dimension makes this PLD suitable for space-constrained designs, allowing for efficient board layouts and integration into a wide variety of applications.

No. of Outputs

272 - With a large number of outputs, this PLD facilitates the generation of multiple output signals simultaneously, making it well-suited for applications requiring extensive logic operations.

Maximum Time At Peak Reflow Temperature (s)

30 - The maximum time at peak reflow temperature of 30 seconds ensures a reliable soldering process during assembly, contributing to the overall quality and durability of the PLD.

Peak Reflow Temperature °C

260 - The high peak reflow temperature of 260°C allows for effective solder reflow during the assembly process, ensuring secure connections and robust performance.

Length

19 mm - The compact length dimension makes this PLD suitable for space-constrained designs, enabling efficient board layouts and integration into various electronic systems.

JTAG Boundary Scan Test

YES - The availability of JTAG boundary scan testing facilitates efficient and accurate testing and debugging of the PLD, ensuring reliable manufacturing and ease of maintenance.

No. of I/O Lines

272 - With a large number of I/O lines, this PLD supports versatile input and output configurations, providing flexibility and enabling extensive data communication.

Technical Specifications

Programmable Logic Devices (PLD) EPM2210F324I5N attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Intel

IC Features

Programmable IC Type:

In-System Programmable:

Yes

Organization:

0 Dedicated Inputs, 272 I/O

No. of Outputs:

272

Output Function:

Macrocell

No. of Inputs:

272

No. of Macro Cells:

1700

No. of Dedicated Inputs:

0

No. of I/O Lines:

272

Propagation Delay:

11.2 ns

Technology:

CMOS

Sub-Category:

Programmable Logic Devices

Additional Features:

It can also operate at 3.3 V

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.375 V

Maximum Supply Voltage:

2.625 V

Power Supplies (V):

1.5/3.3,2.5/3.3 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

100 °C (212 °F)

Minimum Operating Temperature:

-40 °C (-40 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

3

Maximum Time At Peak Reflow Temperature:

30 s

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Grid Array

Package Code:

BGA

Package Shape:

Package Equivalence Code:

BGA324,18X18,40

Width:

19 mm

Length:

19 mm

Maximum Seated Height:

2.2 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Form:

No. of Terminals:

324

Terminal Pitch:

1 mm

Terminal Finish:

Tin/Silver/Copper

Standards

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

JTAG Boundary Scan Test:

Yes

Qualified:

No

Trade Compliance

EPM2210F324I5N Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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