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EPM2210F256I5N

Intel

EPM2210F256I5N by Intel

The Intel EPM2210F256I5N is a programmable logic device (PLD) with 1700 macro cells and 204 inputs/outputs. It uses CMOS technology, has a max supply voltage of 2.625V, and is surface mountable. This PLD is commonly used for in-system programming and outputting macrocell functions.

Median Price

$233.090

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Verical

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Nova Conductors

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Corohmni

South Africa . 348 parts In-Stock

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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Vigor

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Continental Prestige Electronics

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Ampacity Inc.

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Semicontronic

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Modulus Dynamics

Lithuania . 1,544 parts In-Stock

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Texas Native Microelectronics

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Microchip USA

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Overview

Discover the power and versatility of the EPM2210F256I5N by Intel, a top-of-the-line Programmable Logic Device (PLD) that offers endless possibilities for innovation. With its cutting-edge CMOS technology and 1700 macro cells, this device delivers exceptional performance and speed, allowing you to bring your ideas to life like never before. Whether you're designing complex circuits or developing sophisticated applications, the EPM2210F256I5N is the solution you've been searching for. Its in-system programmability and 204 I/O lines provide unmatched flexibility, while its compact size and durable plastic/epoxy body make it ideal for any project. Don't compromise on quality or reliability – choose Intel and unlock the full potential of your designs with the EPM2210F256I5N.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Propagation Delay: 11.2 ns

Low propagation delay ensures high-speed operation and efficient performance.

Surface Mount: YES

Surface mount capability allows for easy and compact integration onto circuit boards.

Maximum Supply Voltage: 2.625 V

Allows for safe operation within the specified voltage range.

No. of Macro Cells: 1700

High number of macro cells provides flexibility and versatility in programming options.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity.

No. of Inputs: 204

Ample inputs allow for a wide range of signals to be processed and controlled.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board.

Form Of Terminal: BALL

Ball terminals provide reliable connections and easy installation.

Nominal Supply Voltage (V): 2.5

Stable supply voltage ensures consistent performance.

Power Supplies (V): 1.5/3.3,2.5/3.3

Multiple power supply options allow for compatibility with various systems.

No. of Terminals: 256

Sufficient terminals for connecting to external components and devices.

Programmable IC Type: FLASH PLD

Flash PLD technology enables reprogramming for flexibility in design and functionality.

Package Style (Meter): GRID ARRAY

Grid array package style offers high density and reliability in connections.

In-System Programmable: YES

In-system programmability allows for convenient updates and changes.

Output Function: MACROCELL

Macrocell output function enhances programmability and customization options.

Minimum Supply Voltage: 2.375 V

Wide voltage range allows for flexibility in operating conditions.

Maximum Operating Temperature: 100 °C

High operating temperature range ensures reliability in various environments.

Pitch Of Terminal: 1 mm

Optimal terminal pitch for easy soldering and board integration.

Organization: 0 DEDICATED INPUTS, 204 I/O

Organization with dedicated inputs and numerous I/O options allows for efficient signal processing.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures enables operation in extreme conditions.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

Terminal finishing with tin, silver, and copper ensures reliable and durable connections.

Position Of Terminal: BOTTOM

Bottom terminal position allows for easy mounting and connectivity.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates robustness against moisture, suitable for various environments.

Maximum Seated Height: 2.2 mm

Low profile design for space-constrained applications.

Width: 17 mm

Compact width for efficient board layout and space-saving designs.

No. of Outputs: 204

Robust number of outputs for versatile signal routing and processing capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds at peak reflow temperature ensures proper soldering and reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability for durable solder joints.

Length: 17 mm

Compact length for space-efficient board designs.

JTAG Boundary Scan Test: YES

JTAG boundary scan testing for easy debugging and testing of the device.

No. of I/O Lines: 204

High number of I/O lines for extensive connectivity and signal processing capabilities.

Technical Specifications

Programmable Logic Devices (PLD) EPM2210F256I5N attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Intel

IC Features

Programmable IC Type:

In-System Programmable:

Yes

Organization:

0 Dedicated Inputs, 204 I/O

No. of Outputs:

204

Output Function:

Macrocell

No. of Inputs:

204

No. of Macro Cells:

1700

No. of Dedicated Inputs:

0

No. of I/O Lines:

204

Propagation Delay:

11.2 ns

Technology:

CMOS

Sub-Category:

Programmable Logic Devices

Additional Features:

It can also operate at 3.3 V

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.375 V

Maximum Supply Voltage:

2.625 V

Power Supplies (V):

1.5/3.3,2.5/3.3 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

100 °C (212 °F)

Minimum Operating Temperature:

-40 °C (-40 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

3

Maximum Time At Peak Reflow Temperature:

30 s

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Grid Array

Package Code:

BGA

Package Shape:

Package Equivalence Code:

BGA256,16X16,40

Width:

17 mm

Length:

17 mm

Maximum Seated Height:

2.2 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Form:

No. of Terminals:

256

Terminal Pitch:

1 mm

Terminal Finish:

Tin/Silver/Copper

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

JTAG Boundary Scan Test:

Yes

Qualified:

No

Trade Compliance

EPM2210F256I5N Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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