Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
The Intel EPM240M100C5N is a FLASH PLD with 192 macro cells, 80 inputs/outputs, and 7.5 ns propagation delay. It uses CMOS technology, operates at a max temp of 85°C, and has JTAG boundary scan test capability. Ideal for applications requiring programmable logic devices with fast signal processing and high I/O count in compact form factors.
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PLASTIC/EPOXY - Provides durability and protection for the internal components, making it suitable for a variety of applications.
7.5 ns - Offers fast signal processing and minimal delay, making it ideal for time-sensitive applications.
YES - Allows for easy installation on circuit boards, saving space and facilitating mass production.
2.625 V - Supports low power consumption and efficient operation in various voltage environments.
192 - Provides ample programmable logic resources for complex logic designs.
CMOS - Offers low power consumption and high noise immunity for reliable performance.
80 - Enables flexibility in accepting various input signals for versatile functionality.
SQUARE - Facilitates straightforward PCB layout and space-efficient design.
BALL - Ensures secure connections and reliable contact with external components.
2.5 - Maintains stable and consistent power supply for the integrated circuits.
1.5/3.3,2.5/3.3 - Allows for compatibility with different voltage requirements, enhancing versatility.
100 - Provides multiple connection points for interfacing with external devices and components.
FLASH PLD - Allows for reprogrammability and flexibility in modifying logic functions as needed.
GRID ARRAY - Ensures a reliable mechanical connection to the PCB and simplifies assembly processes.
YES - Enables on-the-fly programming and configuration changes without removing the device from the system.
MACROCELL - Offers programmable output logic functions for customizing system behavior.
2.375 V - Supports operation in low voltage conditions while maintaining reliable performance.
85 °C - Allows for operation in a wide range of temperature environments.
0.5 mm - Provides compatibility with standard PCB layouts and facilitates high-density designs.
0 DEDICATED INPUTS, 80 I/O - Offers dedicated input lines and a high number of input/output channels for flexible interfacing.
0 °C - Ensures reliable performance even in cold temperature conditions.
Tin/Silver/Copper (Sn/Ag/Cu) - Provides a durable and corrosion-resistant surface finish for long-term reliability.
BOTTOM - Facilitates easy soldering and assembly on the PCB.
3 - Indicates the device's resistance to moisture-related damage, ensuring longevity in humid environments.
6 mm - Offers a compact form factor for space-constrained applications.
80 - Provides a high number of output channels for versatile system functionality.
30 - Ensures proper solder reflow during assembly processes.
260 - Indicates the maximum solder reflow temperature for proper device mounting.
6 mm - Contributes to the product's compact size and space-saving design.
YES - Facilitates efficient testing and debugging of the device during production and operation.
80 - Provides a high number of input/output lines for versatile connectivity options.
Programmable Logic Devices (PLD) EPM240M100C5N attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Intel
Programmable IC Type:
In-System Programmable:
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Nominal Supply Voltage:
Minimum Supply Voltage:
Maximum Supply Voltage:
Power Supplies (V):
Maximum Operating Temperature:
Minimum Operating Temperature:
Temprature Grade:
Peak Reflow Temperature:
Moisture Sensitivity Level (MSL):
Maximum Time At Peak Reflow Temperature:
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Width:
Length:
Terminal Position:
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JESD-30 Code:
JESD-609 Code:
JTAG Boundary Scan Test:
Qualified:
EPM240M100C5N Programmable ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - MAX II EOL-Reversal 19/Mar/2021 Mult Dev EOL 4/Dec/2020
PCN Design/Specification - Quartus SW/Web Chgs 23/Sep/2021
PCN Packaging - Mult Dev Label CHG 24/Jan/2020 Mult Dev Label Chgs 24/Feb/2020
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
DS18B20Z+T&R
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Body Material: PLASTIC/EPOXY;
LL4148
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
FT232RL-TUBE
FTDI
FTDI's FT232RL-TUBE is a bus controller with 28 terminals, operating at 3.3-5.25V. It supports USB, VBUS, and UART interfaces with a data transfer rate of 60MBps. Ideal for industrial applications requiring RS232/RS422/RS485 compatibility in compact designs due to its small outline package style.
BSS138
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel;
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Style (Meter): SMALL OUTLINE; Maximum Operating Temperature: 150 Cel;
LAN8720AI-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
BAV99
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20
DS18B20 by Maxim Integrated is a 12-bit digital temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Commonly used in applications requiring precise temperature monitoring like HVAC systems and industrial automation.
SS14
General Instrument
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Bel Fuse
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Mixed Contacts: NO;
2N7002
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 40; Minimum DS Breakdown Voltage: 60 V;
M85049/85-08W02
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
Vishay Intertechnology
2N7002 by Vishay Intertechnology is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE, suitable for surface mount with GULL WING terminals.
LM358M
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1N4148
NXP Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; No. of Phases: 1; Config: SINGLE; Maximum Operating Temperature: 125 Cel;
2N2222A
Swampscott Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148WS
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ABS25-32.768KHZ-1-T
Abracon
Abracon's ABS25-32.768KHZ-1-T crystal oscillator offers 10 ppm frequency tolerance, 126% stability, and 50000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal operating frequency, such as IoT devices and precision timing systems.
Weitron Technology
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb);
XC2C384-10FTG256I
Xilinx
Xilinx XC2C384-10FTG256I is a 384 macrocell FLASH PLD with 212 I/O lines. It operates at max clock freq of 83MHz, has propagation delay of 10ns, and supports JTAG boundary scan test. Ideal for industrial applications requiring in-system programmable logic devices with low profile grid array package style.
ATF1502AS-10AU44
Atmel
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE;
GAL16V8D-15LPN
Lattice Semiconductor
GAL16V8D-15LPN by Lattice Semiconductor is a 5.25V CMOS PLD with 15ns propagation delay, ideal for PAL-type applications. Featuring 18 inputs and 8 I/O lines, this EE PLD has a clock frequency of up to 45.5MHz and operates b/w 0-70°C, making it suitable for commercial use in various programmable logic designs.
5M80ZT100A5N
Altera
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: SQUARE;
LC4384V-75TN176C
LC4384V-75TN176C by Lattice Semiconductor is a 384 macrocell EE PLD with 132 inputs and 128 I/O lines. Featuring a propagation delay of 7.5 ns, it operates at a max clock frequency of 111 MHz. Ideal for applications requiring in-system programmability and JTAG boundary scan testing in a compact square package.
LC4032ZC-75TN48C
LC4032ZC-75TN48C by Lattice Semiconductor is a 32 macrocell EE PLD with 36 inputs and 32 outputs. It has a propagation delay of 7.5 ns, operates at a max clock frequency of 111 MHz, and can be in-system programmable. Ideal for applications requiring fast processing speeds and high input/output capabilities in compact designs.
ATF1504AS-10AU44
EP1K50TC144-2N
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
EPM570T144I5N
FLASH PLD; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; In-System Programmable: YES;
5M160ZE64C4
Intel
Intel's 5M160ZE64C4 is a FLASH PLD with 54 I/O lines, operating at up to 184.1 MHz clock frequency. With a propagation delay of 7.9 ns and max supply voltage of 1.89 V, it suits applications requiring high-speed data processing in compact electronic systems.
ATF22V10CZ-15PC
Microchip Technology
ATF22V10CZ-15PC by Microchip Technology is a 24-terminal PLD with 15 ns propagation delay and 5.25 V max supply voltage, using CMOS technology. It features 11 dedicated inputs, 10 I/O lines, and operates at up to 55.5 MHz clock frequency. Ideal for applications requiring FLASH PLD functionality in commercial temperature range.
5M570ZT100A5N
FLASH PLD; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
EPF10K50ETI144-2N
EPF10K50ETI144-2N by Intel is a PLD with 2880 logic cells, 0.6 ns propagation delay, and 102 inputs/outputs. It operates at temperatures ranging from -40 to 85 °C and has a max supply voltage of 2.7 V. Ideal for industrial applications requiring fast processing and high I/O capacity in a compact form factor.
EPM2210F256C5N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
GAL16V8D-25QJN
GAL16V8D-25QJN by Lattice Semiconductor is a 5.25V EE PLD with 25ns propagation delay, 64 product terms, and 37MHz clock frequency. Ideal for PAL-type applications requiring 8 dedicated inputs and outputs, it features a square chip carrier package with J bend terminals.
LC4032V-10TN44I
LC4032V-10TN44I by Lattice Semiconductor is a 32 macrocell EE PLD with 10 ns propagation delay. It features 32 inputs, 30 I/O lines, and operates at a max clock frequency of 86 MHz. Ideal for applications requiring programmable logic devices in a compact square package with gull wing terminals.
5M570ZT144C5
Intel's 5M570ZT144C5 is a FLASH PLD with 114 I/O lines, operating at up to 118.3 MHz clock frequency. Featuring GULL WING terminals and low profile FLATPACK package, it's ideal for applications requiring fast propagation delay of 17.7 ns and max supply voltage of 1.89 V.
ATF22V10C-10NM/883
Teledyne E2v (Uk)
EE PLD; Grading Of Temperature: MILITARY; Form Of Terminal: NO LEAD; No. of Terminals: 28; Package Code: QCCN; Package Shape: SQUARE;
EPM3512AQC208-10N
The Intel EPM3512AQC208-10N is a 512 macrocell EE PLD with 172 I/O lines, 10 ns propagation delay, and in-system programmability. It operates at a max voltage of 3.6 V and temp up to 70°C. Ideal for applications requiring fast logic processing and versatile I/O capabilities in commercial-grade environments.
EPF10K20RI208-4N
EPF10K20RI208-4N by Intel is a PLD with 1152 logic cells, 0.6 ns propagation delay, and 147 inputs/outputs. Ideal for industrial applications requiring high clock frequency of 67.11 MHz, operating temperature range from -40 to 85 °C, and low power consumption at supply voltages of 3.3/5 V.
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EPM240T100C5N
Intel's EPM240T100C5N is a PLD with 192 macro cells, 80 inputs/outputs, and 7.5ns propagation delay. Ideal for applications requiring in-system programmability, such as digital signal processing and control systems due to its CMOS technology and flash memory.
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
EPM240T100I5N
EPM240T100I5N by Intel is a PLD with 192 macro cells, 80 inputs/outputs, and 7.5ns propagation delay. It is used for applications requiring in-system programmability, such as digital signal processing and control systems due to its CMOS technology and JTAG boundary scan test capability.
FLASH PLD; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE; Output Function: MACROCELL;
EPM240T100C5NAH
EPM240T100C5NAH by Intel is a FLASH PLD with 192 macro cells and 80 I/O lines. It has a propagation delay of 7.5 ns, operates at a max clock frequency of 104.16 MHz, and supports JTAG boundary scan test. Ideal for applications requiring fast processing speeds and high input/output capabilities in programmable logic devices (PLD).
EPM2210F256I5N
FLASH PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 2.625 V;
The Intel EPM2210F256I5N is a programmable logic device (PLD) with 1700 macro cells and 204 inputs/outputs. It uses CMOS technology, has a max supply voltage of 2.625V, and is surface mountable. This PLD is commonly used for in-system programming and outputting macrocell functions.
EPM240M100C5N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 100; Package Code: BGA; Package Shape: SQUARE;
EPM240T100C4N
Intel's EPM240T100C4N is a PLD with 192 macro cells, 80 inputs/outputs, and 6.1ns propagation delay. Ideal for applications requiring fast processing speeds and high I/O capacity in compact designs. Its CMOS technology and in-system programmability make it versatile for various electronic projects.
The Intel EPM2210F256C5N is a FLASH PLD with 1700 macro cells, 204 inputs/outputs, and 11.2 ns propagation delay. Ideal for applications requiring in-system programmability, such as digital signal processing and control systems due to its CMOS technology and JTAG boundary scan test capability.
EPM240ZM100C7N
The Intel EPM240ZM100C7N is a 192 macrocell FLASH PLD with 80 inputs/outputs, 12 ns propagation delay, and CMOS technology. Ideal for applications requiring in-system programmability, it features a grid array package style and JTAG boundary scan test capability.
EPM240T100A5N
EPM240T100A5N by Intel is a PLD with 192 macro cells, 80 inputs/outputs, and 7.5ns propagation delay. It uses CMOS technology, has a max supply voltage of 2.625V, and is in-system programmable. Ideal for automotive applications due to its high operating temperature range of -40 to 125°C and JTAG boundary scan test capability.
EPM240F100C5N
Intel's EPM240F100C5N is a PLD with 192 macro cells, 80 inputs/outputs, and 7.5ns propagation delay. Ideal for applications requiring in-system programmability, such as digital signal processing and control systems due to its low profile grid array package style.
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE;
EPM240T100C3N
Intel's EPM240T100C3N is a PLD with 192 macro cells, 80 inputs/outputs, and 4.7ns propagation delay. Ideal for applications requiring fast processing speeds and high input/output capabilities in compact designs.
EPM240M100I5ES
FLASH PLD; Form Of Terminal: BALL; No. of Terminals: 100; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
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