Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
EPM240T100A5N by Intel is a PLD with 192 macro cells, 80 inputs/outputs, and 7.5ns propagation delay. It uses CMOS technology, has a max supply voltage of 2.625V, and is in-system programmable. Ideal for automotive applications due to its high operating temperature range of -40 to 125°C and JTAG boundary scan test capability.
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PLASTIC/EPOXY material provides durability and protection for the PLD, ensuring long-lasting performance.
Low propagation delay allows for fast signal processing and response times, making it ideal for time-sensitive applications.
Surface mount capability offers easy installation and reduces the footprint of the device, making it suitable for compact designs.
Low maximum supply voltage helps in minimizing power consumption and heat dissipation, resulting in energy efficiency.
Having a high number of macro cells allows for complex programmable logic configurations, enabling versatile and customizable functionality.
CMOS technology offers low power consumption and high noise immunity, enhancing overall performance and reliability of the PLD.
Abundance of input pins enables the device to interface with multiple external components, expanding its connectivity capabilities.
Square package shape provides uniformity in size and allows for efficient placement on PCBs, facilitating assembly and reducing space constraints.
Gull wing terminals offer strong mechanical support and ease of soldering, ensuring secure connections and reliable operation.
Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.
Support for multiple power supply voltages enhances flexibility in system integration and optimizes performance under varying voltage conditions.
Having a sufficient number of terminals allows for versatile connectivity options and facilitates intricate wiring configurations.
Utilizing FLASH technology enables quick and efficient reprogramming of logic functions, allowing for rapid prototyping and design iterations.
The combination of flatpack, thin profile, and fine pitch package styles offers space-saving benefits and compatibility with modern PCB designs.
In-system programmability provides the convenience of reconfiguring the PLD without physically removing it from the system, simplifying maintenance and updates.
Macrocell output function enhances the device's ability to perform complex logic operations, enabling advanced data processing capabilities.
Low minimum supply voltage ensures operational stability even under low-power conditions, increasing the device's versatility and reliability.
High maximum operating temperature tolerance allows for reliable performance in elevated temperature environments, suitable for industrial and automotive applications.
Fine terminal pitch enables precise connections and compact design layouts, contributing to overall system efficiency and signal integrity.
Dedicated inputs and abundant I/O lines offer configuration flexibility and streamline the interfacing process with external devices.
Wide range of minimum operating temperature tolerance ensures reliable performance even in cold environments, expanding the device's applicability in diverse conditions.
Matte tin terminal finishing provides corrosion resistance and promotes solderability, enhancing the durability and longevity of the connections.
Quad terminal positioning facilitates robust electrical connections and efficient signal transmission, ensuring stable operation in demanding conditions.
Moisture sensitivity Level 3 indicates moderate sensitivity to moisture, prompting the need for standard handling precautions during storage and assembly.
Low maximum seated height allows for a slim profile and facilitates compact system designs, enhancing overall space utilization and aesthetics.
Compact width dimension provides versatility in placement options within the system layout, accommodating space constraints and design requirements.
Abundance of output pins enables the device to drive multiple external components, enhancing its functionality and compatibility with diverse systems.
Balanced length dimension offers symmetry and ease of integration within the system layout, promoting efficient wiring arrangements and overall system aesthetics.
JTAG boundary scan test support allows for thorough testing and debugging of the PLD, ensuring reliable operation and facilitating efficient troubleshooting.
Abundance of I/O lines provides extensive interfacing capabilities with external devices, enhancing the device's versatility in data exchange and signal processing.
Automotive-grade temperature grading ensures reliable performance in harsh environmental conditions and compliance with automotive industry standards, making it suitable for automotive applications.
Programmable Logic Devices (PLD) EPM240T100A5N attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Intel
Programmable IC Type:
In-System Programmable:
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No. of Macro Cells:
No. of Dedicated Inputs:
No. of I/O Lines:
Propagation Delay:
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Nominal Supply Voltage:
Minimum Supply Voltage:
Maximum Supply Voltage:
Power Supplies (V):
Maximum Operating Temperature:
Minimum Operating Temperature:
Temprature Grade:
Moisture Sensitivity Level (MSL):
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Width:
Length:
Maximum Seated Height:
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JESD-30 Code:
JESD-609 Code:
JTAG Boundary Scan Test:
Qualified:
EPM240T100A5N Programmable ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - MAX II EOL-Reversal 19/Mar/2021 Mult Dev EOL 4/Dec/2020
PCN Design/Specification - Appearance Update 30/Mar/2015 Quartus SW/Web Chgs 23/Sep/2021
PCN Packaging - Mult Dev Label CHG 24/Jan/2020 Mult Dev Label Chgs 24/Feb/2020
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
LL4148
Rectron
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N7002
Diodes Incorporated
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; JESD-30 Code: R-PDSO-G3;
1N4148
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
Zowie Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Diotec Semiconductor Ag
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; Maximum Time At Peak Reflow Temperature (s): 10;
1N4148WS
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
NE555D
STMicroelectronics
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
World Products
Itt Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Taitron Components
FT232RL-TUBE
FTDI
FTDI's FT232RL-TUBE is a bus controller with 28 terminals, operating at 3.3-5.25V. It supports USB, VBUS, and UART interfaces with a data transfer rate of 60MBps. Ideal for industrial applications requiring RS232/RS422/RS485 compatibility in compact designs due to its small outline package style.
M39029/56-351
Itt Cannon
CONNECTOR ACCESSORY; MIL Conformity: YES; Terminal Type: WIRE; IEC Conformity: NO; Alternate Contact Sources: ITT CANNON; Associated Military - Specifications: MIL-C-38999;
TDK
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); No. of Phases: 1; No. of Elements: 1; Maximum Output Current: .2 A;
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Time At Peak Reflow Temperature (s): 30; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
LM555CN
Intersil
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
BSS123,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 1; No. of Terminals: 3; Maximum Time At Peak Reflow Temperature (s): 30;
BSS138W-7-F
Multicomp Pro
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Transistor Element Material: SILICON; No. of Elements: 1;
BSS138
Vishay Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Package Shape: RECTANGULAR; Transistor Application: SWITCHING;
C0603X104K5RACAUTO
KEMET Corporation
C0603X104K5RACAUTO by KEMET Corp is a ceramic capacitor with capacitance of 0.1 uF and rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate b/w -55 to 125 °C. This SMT package is commonly used in automotive applications due to its AEC-Q200 reference standard.
MMBT2222ALT1G
Rochester Electronics
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .3 W; Maximum Collector Current (IC): .6 A;
XCR3032XL-7CS48I
Xilinx
Xilinx XCR3032XL-7CS48I is a 32-macrocell EE PLD with 7.5ns propagation delay and 119MHz max clock frequency. Ideal for industrial applications, it features in-system programmability, 36 I/O lines, and JTAG boundary scan test capability.
ATF1502ASL-25JU44
Atmel
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;
EPF10K50VRI240-4
Intel
Intel's EPF10K50VRI240-4 is a PLD with 2880 logic cells, 0.6 ns propagation delay, and 3.6 V max supply voltage. Ideal for industrial applications requiring high-speed processing and versatile I/O capabilities in a compact 32mm square package.
ATF1504AS-10JU44
Microchip Technology
ATF1504AS-10JU44 by Microchip Technology is a programmable logic device (PLD) with 64 macro cells and 32 inputs/outputs. It has a max clock frequency of 125 MHz and can be used for in-system programming, making it suitable for industrial applications.
ATF22V10C-7PX
ATF22V10C-7PX by Microchip Technology is a PLD with 7.5ns propagation delay, 132 product terms, and 125MHz clock frequency. Ideal for PAL-type applications requiring 10 dedicated inputs and outputs, it operates at temperatures ranging from 0 to 70°C.
XC2C256-7CPG132I
The Xilinx XC2C256-7CPG132I is a 256 macrocell FLASH PLD with 106 I/O lines, operating at max frequency of 108 MHz. It features a propagation delay of 7.5 ns and can be in-system programmable. Ideal for industrial applications requiring high-speed processing and versatile I/O capabilities in a compact GRID ARRAY package.
XCR3128XL-10VQG100C
Xilinx XCR3128XL-10VQG100C is a 128 macrocell EE PLD with 84 I/O lines, operating at max 95 MHz clock frequency. It has a propagation delay of 10 ns and supports JTAG boundary scan test. Ideal for applications requiring fast processing speeds and high I/O capabilities in commercial temperature environments.
XC95144XL-10TQ100C
XC95144XL-10TQ100C by Xilinx is a 144 macrocell FLASH PLD with 81 I/O lines, operating at max 81.3 MHz clock frequency. It has a propagation delay of 10 ns and supports in-system programmability. Ideal for applications requiring fast processing speeds and versatile I/O configurations in commercial-grade environments.
XC9536-15VQ44I
Xilinx XC9536-15VQ44I is a 36 macrocell FLASH PLD with 15 ns propagation delay. Operating at 5.5 V, it supports in-system programming and has 34 I/O lines for applications requiring up to 55.6 MHz clock frequency in industrial settings.
XC9572XL-7VQG44I
The Xilinx XC9572XL-7VQG44I is a 72 macrocell FLASH PLD with 34 I/O lines, operating at up to 125 MHz. It features a propagation delay of 7.5 ns and can be in-system programmable. Ideal for industrial applications requiring high-speed processing and versatile I/O capabilities in a compact form factor.
XC2C384-10FTG256I
Xilinx XC2C384-10FTG256I is a 384 macrocell FLASH PLD with 212 I/O lines. It operates at max clock freq of 83MHz, has propagation delay of 10ns, and supports JTAG boundary scan test. Ideal for industrial applications requiring in-system programmable logic devices with low profile grid array package style.
LC4256V-5TN100C
Lattice Semiconductor
LC4256V-5TN100C by Lattice Semiconductor is a 256 macrocell EE PLD with 74 inputs and 64 I/O lines. Featuring a propagation delay of 5 ns, it operates at a max clock frequency of 156 MHz. Ideal for applications requiring in-system programmability and JTAG boundary scan testing in environments with temperatures ranging from 0 to 90°C.
EPM1270M256I5N
Altera
FLASH PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: RECTANGULAR; JTAG Boundary Scan Test: YES;
ATF16V8CZ-15JU
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: J BEND; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE;
XC2C64A-7CP56I
XC2C64A-7CP56I by Xilinx is a 64 macrocell FLASH PLD with 7.5 ns propagation delay, operating at up to 200 MHz. Ideal for industrial applications, it features in-system programmability, 45 I/O lines, and JTAG boundary scan testing capabilities.
5M240ZT144C5N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
5M40ZM64I5N
Intel's 5M40ZM64I5N is a FLASH PLD with 30 I/O lines, 118.3 MHz clock frequency, and 14 ns propagation delay. Ideal for industrial applications requiring programmable logic devices in a compact square package with fine pitch grid array style.
ATF22V10C-10PC
Atmel's ATF22V10C-10PC is a 5.25V CMOS PLD with 10ns propagation delay, ideal for PAL-type applications. Featuring 22 inputs and 10 I/O lines, this FLASH PLD offers a clock frequency of up to 90MHz in commercial temperature grades.
EPM1270GT144C5N
EPM2210F324I5N
The Intel EPM2210F324I5N is a programmable logic device (PLD) with 1700 macro cells and 272 inputs/outputs. It uses CMOS technology and has a max supply voltage of 2.625V. This PLD is suitable for applications requiring in-system programmability and output functions using macrocells.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
EPM240T100C5N
Intel's EPM240T100C5N is a PLD with 192 macro cells, 80 inputs/outputs, and 7.5ns propagation delay. Ideal for applications requiring in-system programmability, such as digital signal processing and control systems due to its CMOS technology and flash memory.
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
EPM240T100I5N
EPM240T100I5N by Intel is a PLD with 192 macro cells, 80 inputs/outputs, and 7.5ns propagation delay. It is used for applications requiring in-system programmability, such as digital signal processing and control systems due to its CMOS technology and JTAG boundary scan test capability.
FLASH PLD; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE; Output Function: MACROCELL;
EPM240T100C5NAH
EPM240T100C5NAH by Intel is a FLASH PLD with 192 macro cells and 80 I/O lines. It has a propagation delay of 7.5 ns, operates at a max clock frequency of 104.16 MHz, and supports JTAG boundary scan test. Ideal for applications requiring fast processing speeds and high input/output capabilities in programmable logic devices (PLD).
EPM2210F256I5N
FLASH PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 2.625 V;
The Intel EPM2210F256I5N is a programmable logic device (PLD) with 1700 macro cells and 204 inputs/outputs. It uses CMOS technology, has a max supply voltage of 2.625V, and is surface mountable. This PLD is commonly used for in-system programming and outputting macrocell functions.
EPM240M100C5N
The Intel EPM240M100C5N is a FLASH PLD with 192 macro cells, 80 inputs/outputs, and 7.5 ns propagation delay. It uses CMOS technology, operates at a max temp of 85°C, and has JTAG boundary scan test capability. Ideal for applications requiring programmable logic devices with fast signal processing and high I/O count in compact form factors.
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 100; Package Code: BGA; Package Shape: SQUARE;
EPM240T100C4N
Intel's EPM240T100C4N is a PLD with 192 macro cells, 80 inputs/outputs, and 6.1ns propagation delay. Ideal for applications requiring fast processing speeds and high I/O capacity in compact designs. Its CMOS technology and in-system programmability make it versatile for various electronic projects.
EPM2210F256C5N
The Intel EPM2210F256C5N is a FLASH PLD with 1700 macro cells, 204 inputs/outputs, and 11.2 ns propagation delay. Ideal for applications requiring in-system programmability, such as digital signal processing and control systems due to its CMOS technology and JTAG boundary scan test capability.
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
EPM240ZM100C7N
The Intel EPM240ZM100C7N is a 192 macrocell FLASH PLD with 80 inputs/outputs, 12 ns propagation delay, and CMOS technology. Ideal for applications requiring in-system programmability, it features a grid array package style and JTAG boundary scan test capability.
EPM240T100A5N
FLASH PLD; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
EPM240F100C5N
Intel's EPM240F100C5N is a PLD with 192 macro cells, 80 inputs/outputs, and 7.5ns propagation delay. Ideal for applications requiring in-system programmability, such as digital signal processing and control systems due to its low profile grid array package style.
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE;
EPM240T100C3N
Intel's EPM240T100C3N is a PLD with 192 macro cells, 80 inputs/outputs, and 4.7ns propagation delay. Ideal for applications requiring fast processing speeds and high input/output capabilities in compact designs.
EPM240T100I4
FLASH PLD; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: SQUARE; Maximum Clock Frequency: 128.2 MHz;
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