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TIBPAL16L8-10MJB

Texas Instruments

TIBPAL16L8-10MJB by Texas Instruments

TIBPAL16L8-10MJB by Texas Instruments is a MIL-PRF-38535 screened PLD with 12ns propagation delay, 5.5V max supply voltage, and TTL technology. Ideal for military applications, it features 10 dedicated inputs, 6 I/O lines, and supports a max clock frequency of 52.5MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 7,157 parts In-Stock

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Digiode

USA . 2,603 parts In-Stock

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Sunrise Surplus Inc.

USA . 6 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 3 parts In-Stock

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Bristol Electronics

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Sogenti Electronics

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AZTECH Wire

Italy . 866 parts In-Stock

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$12.286

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One Stop Electronics

USA . 326 parts In-Stock

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Parana Technologies

USA . 1,130 parts In-Stock

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DigiPath Technology Company

USA . 2,278 parts In-Stock

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$104.669

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ChromeModa Solutions

Germany . 4,766 parts In-Stock

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IDEA Electronic Components Group

UK . 1,483 parts In-Stock

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Authorized Procurement Solutions

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Corphita

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Kepictronics

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Overview

Unlock endless possibilities with the TIBPAL16L8-10MJB by Texas Instruments, a high-quality Programmable Logic Device that offers unparalleled performance and reliability. Designed with precision and expertise by Texas Instruments, this PLD is perfect for a wide range of applications. From aerospace to industrial automation, this versatile device provides value, efficiency, and flexibility to meet your unique needs. Experience the power of innovative technology with the TIBPAL16L8-10MJB and take your projects to new heights.

Feature Benefit Bullets

Propagation Delay: 12 ns

Low propagation delay means faster processing speed, making this product suitable for applications requiring quick response times.

Maximum Supply Voltage: 5.5 V

Can handle higher supply voltages, providing flexibility in various power supply configurations.

Technology Used: TTL

TTL technology offers high speed and compatibility with existing TTL circuits, making integration easier.

No. of Inputs: 16

Having 16 inputs allows for more complex logic operations to be performed, increasing the versatility of this PLD.

No. of Outputs: 8

Multiple outputs provide the ability to control multiple external devices or circuits, enhancing the functionality of the PLD.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAL16L8-10MJB attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

10 Dedicated Inputs, 6 I/O

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

16

No. of Product Terms:

64

No. of Dedicated Inputs:

10

No. of I/O Lines:

6

Maximum Clock Frequency:

52.5 MHz

Propagation Delay:

12 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Width:

7.62 mm

Length:

24.195 mm

Maximum Seated Height:

5.08 mm

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-GDIP-T20

Qualified:

No

Screening Level:

MIL-PRF-38535

Trade Compliance

TIBPAL16L8-10MJB Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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