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TIBPAD18N8-6CJ

Texas Instruments

TIBPAD18N8-6CJ by Texas Instruments

TIBPAD18N8-6CJ by Texas Instruments is a TTL technology-based PLD with 6 ns propagation delay and 5.25 V max supply voltage. It features 18 inputs, 8 outputs, and is ideal for applications requiring combinatorial output functions in commercial extended temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,381 parts In-Stock

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Digiode

USA . 2,544 parts In-Stock

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2,544

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Distributors (Availability)

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AZTECH Wire

Italy . 317 parts In-Stock

1+ parts

$7.041

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317

$7.041

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One Stop Electronics

USA . 1,165 parts In-Stock

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$35.000

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1,165

$35.000

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Parana Technologies

USA . 386 parts In-Stock

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$44.603

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386

$44.603

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DigiPath Technology Company

USA . 154 parts In-Stock

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$49.114

100+ parts

$45.185

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154

$49.114

$45.185

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ChromeModa Solutions

Germany . 2,881 parts In-Stock

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$50.116

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$41.095

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2,881

$50.116

$41.095

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IDEA Electronic Components Group

UK . 400 parts In-Stock

1+ parts

$50.116

100+ parts

$47.610

1k+ parts

$45.104

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400

$50.116

$47.610

$45.104

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Corphita

USA . 3,359 parts In-Stock

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Overview

Elevate your electronic projects with the TIBPAD18N8-6CJ by Texas Instruments. Crafted from high-quality ceramic and glass-sealed materials, this Programmable Logic Device offers lightning-fast propagation delay of 6 ns and a maximum supply voltage of 5.25 V. Perfect for a wide range of applications, this PLD features 10 dedicated inputs and 8 I/O lines, providing flexibility and reliability. Trust in Texas Instruments' reputation for excellence and innovation, and experience the value and benefits this product brings to your designs. Upgrade your projects today with the TIBPAD18N8-6CJ.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed material ensures durability and reliability, making this product suitable for long-term use in various environments.

Propagation Delay: 6 ns

With a fast propagation delay of only 6 ns, this PLD offers quick processing speeds, making it ideal for applications that require high performance and responsiveness.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage of 5.25 V provides flexibility in power requirements and ensures compatibility with a wide range of external systems.

Technology Used: TTL

Utilizing TTL technology enables reliable and efficient logic operations, making this PLD suitable for a variety of digital electronics applications.

No. of Inputs: 18

Having 18 inputs allows for complex logic functions to be implemented, providing versatility and customization in designing digital circuits.

Nominal Supply Voltage (V): 5

The nominal supply voltage of 5V ensures stable operation and compatibility with standard power sources, simplifying integration into existing systems.

Output Function: COMBINATORIAL

The combinatorial output function enables the creation of logic circuits without feedback paths, simplifying design and increasing efficiency in signal processing.

Pitch Of Terminal: 2.54 mm

With a standard pitch of 2.54 mm, this PLD is easy to interface with other components and circuit boards, facilitating seamless integration into electronic systems.

No. of Outputs: 8

Featuring 8 outputs allows for multiple signals to be generated simultaneously, increasing the versatility and functionality of the PLD in various digital applications.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAD18N8-6CJ attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

10 Dedicated Inputs, 8 I/O

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

18

No. of Product Terms:

8

No. of Dedicated Inputs:

10

No. of I/O Lines:

8

Propagation Delay:

6 ns

Technology:

TTL

Architecture:

PAD-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Width:

7.62 mm

Length:

24.195 mm

Maximum Seated Height:

5.08 mm

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-GDIP-T20

Qualified:

No

Trade Compliance

TIBPAD18N8-6CJ Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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