Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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Xilinx XCR3128XL-10VQG100C is a 128 macrocell EE PLD with 84 I/O lines, operating at max 95 MHz clock frequency. It has a propagation delay of 10 ns and supports JTAG boundary scan test. Ideal for applications requiring fast processing speeds and high I/O capabilities in commercial temperature environments.
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ChipTracer
Provides durability and protection for the internal components of the PLD.
Offers fast processing speeds and efficient performance for various applications.
Enables easy and secure installation on circuit boards, saving space and simplifying production processes.
Allows for safe operation within specified voltage limits, ensuring reliability and longevity of the device.
Provides a high level of programmable logic capabilities for complex logic design and implementation.
Utilizes advanced CMOS technology for low power consumption and high-speed operation, ideal for energy-efficient applications.
Facilitates easy handling and alignment during assembly processes, contributing to manufacturing efficiency.
Offers reliable solder joints and mechanical stability, improving overall product durability and performance.
Standard voltage requirement ensures compatibility with common power sources, enhancing versatility.
Consistent power supply for optimal performance and stability under various operating conditions.
Provides sufficient connectivity options for input/output operations, supporting diverse application needs.
Embedded memory elements offer programmable functionalities, allowing for flexibility in implementing custom logic configurations.
Compact and space-efficient design for easy integration into modern electronic devices with limited space constraints.
Facilitates on-the-fly reprogramming and debugging of the device without the need for physical removal, enhancing flexibility and ease of use.
Each output function can be individually programmed, enabling tailored logic processing for specific applications.
Designed to operate reliably with a low minimum voltage requirement, ensuring compatibility with various power sources.
Can withstand elevated temperatures during operation, suitable for industrial and automotive applications requiring extended temperature ranges.
Fine pitch spacing enables high-density mounting on PCBs, maximizing circuit board space efficiency.
Allows for dedicated input allocation and supports a large number of I/O lines for versatile connectivity options.
Capable of functioning reliably at freezing temperatures, suitable for use in cold environments without performance degradation.
Matte tin finish provides excellent solderability and corrosion resistance, ensuring reliable electrical connections.
Quad position terminal layout enhances stability and ease of soldering during assembly processes.
MSL 3 classification indicates the PLD's ability to withstand moderate moisture exposure during storage and operation.
Low-profile design for space-constrained applications, enabling compact and slim device configurations.
Optimal width dimension for easy integration and compatibility with standard PCB layouts and mounting configurations.
High clock frequency capability for rapid data processing and real-time applications, ensuring efficient performance.
Able to withstand peak reflow temperatures for a specified time, facilitating reliable soldering and assembly processes.
High-temperature tolerance for lead-free soldering processes, ensuring secure and durable solder joints.
Standard length dimension for compatibility with industry-standard board sizes and mounting configurations.
Supports JTAG boundary scan test for diagnostics and debugging, enabling efficient fault detection and resolution.
Extensive I/O line support for versatile connectivity and data exchange capabilities in diverse applications.
Designed for commercial-grade temperature ranges, suitable for general-purpose applications in standard operating conditions.
Programmable Logic Devices (PLD) XCR3128XL-10VQG100C attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Xilinx
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Power Supplies (V):
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Peak Reflow Temperature:
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JESD-609 Code:
JTAG Boundary Scan Test:
Qualified:
XCR3128XL-10VQG100C Programmable ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - Mult DEV EOL 01/Jan/2024
PCN Assembly/Origin - Mult Dev LeadFrame Chg 29/Oct/2018
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
FDD5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 42 W; Terminal Position: SINGLE; Terminal Form: GULL WING;
SN65HVD234DR
Texas Instruments
SN65HVD234DR by Texas Instruments is an 8-terminal interface circuit with a data rate of 1 Mbps. Operating temperature ranges from -40 to 125 °C, making it ideal for automotive applications. With a supply voltage of 3.3 V and low current draw of 6 mA, it's suitable for network interfaces in compact designs.
LM358DT
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
LL4148
Weitronic Enterprise
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Panjit International
SMBJ18CA
Rectron
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Promax-johnton
SZNUP2105LT1G
Onsemi
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
OPA2277UA
OPA2277UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 100 uV and micropower consumption of 1.65 mA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1000 kHz in a small outline package.
2N2222A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Semicoa
1N4148
Kec
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Non Repetitive Peak Forward Current: 2 A; Config: SINGLE; Maximum Operating Temperature: 200 Cel;
BAV99
Electronic Devices
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Package Shape: RECTANGULAR; Minimum Input-Output Voltage Differential: 3 V;
Taitron Components
Hy Electronic
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
ATF1504AS-10AU44-T
Microchip Technology
Microchip Technology's ATF1504AS-10AU44-T is a 32 I/O EE PLD with 10 ns propagation delay and 125 MHz clock frequency. Ideal for industrial applications, this PLD features a max supply voltage of 5.5 V and operates in temperatures ranging from -40 to 85 °C.
EPM7064AETC44-4N
Altera
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: LQFP; Package Shape: SQUARE;
XC2C128-7TQG144C
Xilinx
The Xilinx XC2C128-7TQG144C is a 128 macrocell FLASH PLD with 100 I/O lines, 7.5 ns propagation delay, and 119 MHz max clock frequency. Ideal for applications requiring in-system programmability, such as digital signal processing and telecommunications systems.
ATF750CL-15XU
Atmel
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR;
LC4384V-75TN176C
Lattice Semiconductor
LC4384V-75TN176C by Lattice Semiconductor is a 384 macrocell EE PLD with 132 inputs and 128 I/O lines. Featuring a propagation delay of 7.5 ns, it operates at a max clock frequency of 111 MHz. Ideal for applications requiring in-system programmability and JTAG boundary scan testing in a compact square package.
ATF22V10CQZ-20SU
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;
EPF6024AQC240-2N
LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE;
EPM1270F256A5N
The EPM1270F256A5N by Altera is a programmable logic device with 980 macro cells. It has a maximum supply voltage of 2.625V and operates on CMOS technology. Its package is BGA256, measures 17mm in length and width, and has a bottom position of terminals. It is surface mountable and in-system programmable. The EPM1270F256A5N has a propagation delay of 10ns and an output function of macrocell. It is suitable for applications that require flash PLD functionality and can operate at 3.3V.
EPM570T100I5N
Intel
EPM570T100I5N by Intel is a FLASH PLD with 440 macro cells, 76 I/O lines, and 8.7 ns propagation delay. Ideal for applications requiring in-system programmability, it operates at temperatures from -40 to 100°C and has a max supply voltage of 2.625 V.
ATF1504ASV-15AU100
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
ATF16V8C-5JX
ATF16V8C-5JX by Microchip Technology is a 5.25V PLD with 5ns propagation delay, ideal for PAL-type applications. Featuring 18 inputs and 8 I/O lines, it offers a max clock frequency of 142MHz. This CMOS technology chip comes in a square chip carrier package with J bend terminals.
XC95144XL-10TQ144I
XC95144XL-10TQ144I by Xilinx is a 3.3V CMOS PLD with 117 I/O lines, 144 macro cells, and 81.3 MHz clock frequency. Ideal for industrial applications, it offers in-system programmability and JTAG boundary scan testing capabilities in a low-profile package with Gull Wing terminals.
EPM570M100C4N
Intel's EPM570M100C4N is a 440 macrocell FLASH PLD with 76 I/O lines. It features a propagation delay of 7ns, operates at max supply voltage of 2.625V, and uses CMOS technology. Ideal for applications requiring in-system programmability and JTAG boundary scan testing in a compact square package style.
ATF16V8B-15PU
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
5M1270ZF324C5N
The Intel 5M1270ZF324C5N is a programmable logic device (PLD) with 980 macro cells and a max clock frequency of 201.1 MHz. It is used for applications requiring in-system programmability and features a package style of grid array, low profile.
EPM1270M256I5N
FLASH PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: RECTANGULAR; JTAG Boundary Scan Test: YES;
5M570ZF256I5N
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
5M80ZE64C5N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 64; Package Code: HTFQFP; Package Shape: SQUARE;
LC4032ZE-7MN64C
LC4032ZE-7MN64C by Lattice Semiconductor is a 32 macrocell EE PLD with 7.5 ns propagation delay and 111 MHz max clock frequency. Ideal for applications requiring in-system programmability, it features a grid array package with thin profile and fine pitch terminals for versatile integration.
EPM570M100C5N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 100; Package Code: BGA; Package Shape: SQUARE;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
XCR3032XL-7CSG48I
Xilinx XCR3032XL-7CSG48I is a 32 macrocell EE PLD with 7.5ns propagation delay, operating at max clock frequency of 119MHz. Ideal for industrial applications, it features in-system programmability and JTAG boundary scan test capability.
XCR3128XL-10VQG100I
Xilinx XCR3128XL-10VQG100I is a 128 macrocell EE PLD with 84 I/O lines. It operates at max clock frequency of 95 MHz, with propagation delay of 10 ns. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing.
XCR3256XL-10TQG144C
Xilinx XCR3256XL-10TQG144C is a 256 macrocell EE PLD with 120 I/O lines, operating at up to 105 MHz. It features a propagation delay of 10 ns and can be in-system programmable. Ideal for applications requiring high-speed processing and versatile I/O capabilities in commercial-grade environments.
XCR3256XL-12TQ144I
Xilinx XCR3256XL-12TQ144I is a 256 macrocell EE PLD with 120 I/O lines, operating at max 88 MHz clock frequency. It has in-system programmability and JTAG boundary scan test capability. Ideal for industrial applications requiring fast propagation delay of 12 ns and wide temperature range from -40 to 85 °C.
XCR3032XL-10VQG44I
Xilinx XCR3032XL-10VQG44I is a 32 macrocell EE PLD with 36 I/O lines, operating at up to 95 MHz. It features a propagation delay of 10 ns and can be in-system programmable. Ideal for industrial applications requiring high-speed logic functions in a compact form factor.
XCR3032XL-10VQG44C
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE;
XCR3064XL-10VQG44C
Xilinx XCR3064XL-10VQG44C is a 64-macrocell EE PLD with 36 I/O lines, operating at max 95 MHz clock frequency. It features in-system programmability, JTAG boundary scan test, and propagation delay of 10 ns. Ideal for applications requiring fast processing speeds and versatile I/O capabilities in commercial-grade environments.
XCR3064XL-10VQG100C
Xilinx XCR3064XL-10VQG100C is a 64 macrocell EE PLD with 68 I/O lines, operating at max 95 MHz. It features in-system programmability, JTAG boundary scan test, and propagation delay of 10 ns. Ideal for applications requiring fast processing speeds and versatile I/O configurations in commercial-grade environments.
XCR3128XL-10VQ100I
Xilinx XCR3128XL-10VQ100I is a 128 macrocell EE PLD with 84 I/O lines, operating at max 95 MHz clock frequency. It has in-system programmability and JTAG boundary scan test support. Ideal for industrial applications requiring fast processing and high I/O capabilities in compact form factor.
XCR3256XL-10TQG144I
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XCR3128XL-10TQG144C
Xilinx XCR3128XL-10TQG144C is a 128 macrocell EE PLD with 108 I/O lines, operating at max clock freq of 95 MHz. In-system programmable, it has propagation delay of 10 ns and operates within -40 to +85 °C range. Ideal for applications requiring high-speed logic processing in commercial environments.
XCR3256XL-12TQ144C
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XCR3128XL-10VQ100C
The Xilinx XCR3128XL-10VQ100C is a programmable logic device with 128 macro cells. It operates on a max supply voltage of 3.6V and has a propagation delay of 10ns. This PLD is commonly used for applications requiring in-system programmability and a clock frequency of up to 95MHz.
XCR3128XL-7TQG144I
XCR3256XL-10TQ144I
Xilinx XCR3256XL-10TQ144I is a 256 macrocell EE PLD with 120 I/O lines, operating at up to 105 MHz. It has a propagation delay of 10 ns and can handle supply voltages from 2.7V to 3.6V. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing in a compact square package.
XCR3064XL-10VQG44I
Xilinx XCR3064XL-10VQG44I is a 64 macrocell EE PLD with 36 I/O lines, operating at max 95 MHz. It has a propagation delay of 10 ns and can handle supply voltages from 2.7 V to 3.6 V. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing.
XCR3128XL-7VQ100I
XCR3064XL-10VQG100I
XCR3512XL-10PQG208C
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
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