Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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EPM1270T144C3N by Intel is a FLASH PLD with 980 macro cells, 116 inputs/outputs, and 6.2 ns propagation delay. Ideal for applications requiring fast processing speeds and high input/output capabilities in programmable logic devices.
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Perfect Parts
PLASTIC/EPOXY - This lightweight and durable material makes the product suitable for various industrial applications.
6.2 ns - The fast propagation delay ensures swift execution of commands, enhancing performance.
YES - The surface mount feature allows for easy integration into circuit boards, saving space and simplifying assembly.
2.625 V - The low maximum supply voltage helps in reducing power consumption and heat generation.
980 - The high number of macro cells provides flexibility and scalability for complex logic designs.
CMOS - The CMOS technology offers low power consumption, making the product energy-efficient.
116 - The ample number of inputs allow for versatile connectivity and compatibility with various systems.
SQUARE - The square shape facilitates easy placement and alignment on circuit boards.
GULL WING - The gull wing form of terminals ensures secure and reliable connections.
2.5 - The nominal supply voltage of 2.5V is ideal for stable and efficient operation.
1.5/3.3,2.5/3.3 - The multiple power supply options provide flexibility in system integration.
144 - The high number of terminals allows for comprehensive input/output options.
FLASH PLD - The programmable flash PLD offers reconfigurability and adaptability for changing requirements.
FLATPACK, LOW PROFILE, FINE PITCH - The varied package styles cater to different space constraints and design needs.
YES - The in-system programmability feature enables easy updates and modifications without removing the device.
MACROCELL - The macrocell output function provides integrated logic and routing capabilities.
2.375 V - The low minimum supply voltage ensures compatibility with a wide range of power sources.
85 °C - The high maximum operating temperature range allows for reliability in harsh environments.
0.5 mm - The small pitch of terminals enables high-density mounting on PCBs.
0 DEDICATED INPUTS, 116 I/O - The dedicated inputs and numerous I/O lines cater to specific input requirements and versatile output options.
0 °C - The low minimum operating temperature ensures functionality even in cold environments.
Matte Tin (Sn) - annealed - The matte tin finish provides corrosion resistance and excellent solderability.
QUAD - The quad terminal arrangement offers a stable and secure connection during operation.
3 - The MSL 3 rating ensures reliability in humid conditions.
1.6 mm - The low seated height allows for compact and space-efficient integration.
20 mm - The moderate width offers a balance between space efficiency and ease of handling.
116 - The abundant number of outputs facilitates complex logic operations and signal routing.
30 - The short reflow time reduces the risk of overheating during assembly.
260 - The high peak reflow temperature ensures secure solder joints and reliable connections.
20 mm - The moderate length provides a balanced form factor for various applications.
YES - The JTAG boundary scan test feature enables comprehensive testing and debugging capabilities.
116 - The high number of I/O lines offers versatility in connecting to external devices and systems.
Programmable Logic Devices (PLD) EPM1270T144C3N attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Intel
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Power Supplies (V):
Maximum Operating Temperature:
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Peak Reflow Temperature:
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JESD-30 Code:
JESD-609 Code:
JTAG Boundary Scan Test:
Qualified:
EPM1270T144C3N Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
1N4148
Weitronic Enterprise
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
DS18B20
Maxim Integrated
DS18B20 by Maxim Integrated is a 12-bit digital temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Commonly used in applications requiring precise temperature monitoring like HVAC systems and industrial automation.
1N4148WT
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Supertex
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Maximum Feedback Capacitance (Crss): 5 pF;
LM317T
Sgs-ates Componenti Electronici S P A
Other Regulators; No. of Terminals: 3; JESD-609 Code: e0; Terminal Position: SINGLE; Adjustability: ADJUSTABLE; Maximum Load Regulation (%): 1.5 %;
LM358M
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
2N2222A
Minilogic Device
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .001 A;
BAV99
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): .715 V; Maximum Operating Temperature: 150 Cel; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .2 A;
Rectron
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel; Terminal Form: GULL WING;
Excel (Suzhou) Semiconductor
LM107H/883
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Average Bias Current (IIB): .1 uA;
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Package Shape: RECTANGULAR; Minimum Input-Output Voltage Differential: 3 V;
ROHM
C1206C104M5RACTU
KEMET Corporation
KEMET C1206C104M5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±20% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
NE555D
Philips Semiconductors
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Style (Meter): SMALL OUTLINE; Terminal Position: DUAL;
ULN2803A
Sanken Electric
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; JESD-30 Code: R-PDIP-T18; Package Body Material: PLASTIC/EPOXY;
1N4148WS
Taiwan Semiconductor
Bytesonic Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Elements: 1;
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
5M570ZT144C4N
Intel
The Intel 5M570ZT144C4N is a FLASH PLD with 440 macro cells, 114 I/O lines, and a max clock frequency of 184.1 MHz. It is ideal for applications requiring fast propagation delay of 9.5 ns, such as high-speed digital signal processing and communication systems. With in-system programmability and JTAG boundary scan test support, it offers flexibility and ease of integration in various electronic designs.
EP20K100EQC240-2N
Altera
LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE;
ATF16V8B-15JU
Atmel
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: J BEND; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE;
EPM570T100C3N
EPM570T100C3N by Intel is a Programmable Logic Device with 440 macro cells, 76 inputs/outputs, and a propagation delay of 5.4 ns. It uses CMOS technology and is suitable for applications requiring in-system programmability and JTAG boundary scan testing in electronic systems.
EPM9320LC84-15
EPM9320LC84-15 by Intel is a 320 macrocell EE PLD with 16ns propagation delay, operating at up to 117.6MHz clock frequency. It is ideal for applications requiring in-system programmability and features JTAG boundary scan test capability. The device supports a max supply voltage of 5.25V and has a package style of chip carrier, making it suitable for commercial temperature-grade projects.
EPM570T144C5N
The Intel EPM570T144C5N is a 440 macrocell FLASH PLD with 116 inputs/outputs. It operates at a max supply voltage of 2.625V and has a propagation delay of 8.7ns. Ideal for applications requiring in-system programmability, such as digital signal processing and control systems.
EPM1270M256C5N
EPM1270M256C5N by Intel is a programmable logic device (PLD) with 980 macro cells and 212 inputs/outputs. It has a propagation delay of 10 ns and can operate at temperatures up to 85°C. This PLD is commonly used for in-system programming and features JTAG boundary scan testing.
ATF1504ASVL-20AU44
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE;
XC95144XL-7TQG100C
Xilinx
The Xilinx XC95144XL-7TQG100C is a 144 macrocell CMOS PLD with 81 I/O lines. It has a propagation delay of 7.5 ns and operates at a max clock frequency of 138.88 MHz. Ideal for applications requiring in-system programmability, such as digital signal processing and control systems.
ATF22V10C-7SX
FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;
ATF1508AS-10JU84
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: J BEND; No. of Terminals: 84; Package Code: QCCJ; Package Shape: SQUARE;
5M40ZM64C5N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 64; Package Code: TFBGA; Package Shape: SQUARE;
EPM7064SLC44-10N
The EPM7064SLC44-10N by Altera is a programmable logic device with 64 macro cells. It has a propagation delay of 10 ns and a maximum supply voltage of 5.25 V. This CMOS device is surface mountable and in-system programmable. Its application includes output function as macrocell and it can operate at a maximum clock frequency of 125 MHz.
M4A5-64/32-10VNC48
Lattice Semiconductor
M4A5-64/32-10VNC48 by Lattice Semiconductor is a 64 macrocell EE PLD with 34 inputs and 32 I/O lines. It operates at a max clock frequency of 62.5 MHz, has a propagation delay of 10 ns, and can be in-system programmable. Ideal for applications requiring fast processing speeds and versatile I/O configurations in commercial-grade environments.
XC95144XL-10TQ100I
The Xilinx XC95144XL-10TQ100I is a 144 macrocell FLASH PLD with 81 I/O lines, operating at a max clock frequency of 81.3 MHz. It features a propagation delay of 10 ns and can be in-system programmable. Ideal for industrial applications requiring high-speed processing and versatile I/O capabilities.
5M1270ZT144I5
Intel's 5M1270ZT144I5 is a FLASH PLD with 114 I/O lines, 201.1 MHz clock frequency, and 10 ns propagation delay. Ideal for industrial applications requiring high-speed data processing in compact spaces due to its low profile, fine pitch package style and macrocell output function.
ATF22V10CQZ-20PC
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;
EPM7128SQC100-15N
EPM7128SQC100-15N by Intel is a 128 macrocell EE PLD with 84 I/O lines, operating at up to 100 MHz. It features a propagation delay of 15 ns and can be used for applications requiring in-system programmability and JTAG boundary scan testing.
ATF1504ASL-25AU100
Microchip Technology
Microchip Technology's ATF1504ASL-25AU100 is a 64 macrocell EE PLD with 25ns propagation delay and 60MHz clock frequency. Ideal for industrial applications, it features in-system programmability, JTAG boundary scan test, and operates at temperatures ranging from -40 to 85°C.
XC2C256-7VQG100C
XC2C256-7VQG100C by Xilinx is a 256 macrocell CMOS PLD with 80 inputs/outputs, 108 MHz clock frequency, and 7.5 ns propagation delay. Ideal for applications requiring in-system programmability, such as digital signal processing and telecommunications systems.
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EPM1270T144I5N
The Intel EPM1270T144I5N is a FLASH PLD with 980 macro cells, 116 inputs/outputs, and 10ns propagation delay. Ideal for applications requiring in-system programmability, it operates at temperatures from -40 to 100°C and supports JTAG boundary scan testing.
FLASH PLD; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Finishing Of Terminal Used: MATTE TIN;
EPM1270T144C5N
EPM1270T144C5N by Intel is a Flash PLD with 980 macro cells, 116 inputs/outputs, and a propagation delay of 10 ns. It is ideal for applications requiring in-system programmability, such as digital signal processing and control systems due to its low profile package style and CMOS technology.
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
EPM1270F256I5N
The Intel EPM1270F256I5N is a FLASH PLD with 980 macro cells, 212 inputs/outputs, and 10ns propagation delay. Ideal for applications requiring programmable logic devices in a compact grid array package with JTAG boundary scan test capability.
The EPM1270F256I5N by Altera is a programmable logic device with 980 macro cells. It has a maximum supply voltage of 2.625V and uses CMOS technology. It is a flash PLD that is in-system programmable. The package style is grid array, with 256 terminals. Its top application is as a macrocell output function.
EPM1270F256C5N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
EPM1270F256C5N by Intel is a programmable logic device (PLD) with 980 macro cells and 212 inputs/outputs. It uses CMOS technology and has a max supply voltage of 2.625V. This PLD is suitable for applications requiring in-system programmability and a fast propagation delay of 10ns.
EPM1270T144C3N
The EPM1270T144C3N by Altera is a programmable logic device (PLD) with 980 macro cells. It has a propagation delay of 6.2 ns and can operate at a maximum supply voltage of 2.625 V. This device is surface mountable and uses CMOS technology. Its package shape is square with gull wing terminals. It is an in-system programmable flash PLD with a minimum supply voltage of 2.375 V. The EPM1270T144C3N is commonly used for applications that require the output function of a macrocell, such as digital signal processing and control systems.
EPM1270GT144C4N
The Altera EPM1270GT144C4N is a programmable logic device with 980 macro cells, CMOS technology, and a propagation delay of 8.1 ns. It can operate at a maximum supply voltage of 1.89V and has a package shape of square. This PLD is commonly used for applications requiring in-system programmability and output functions like macrocell.
EPM1270T144C4N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: RECTANGULAR;
EPM1270M256I5N
FLASH PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: RECTANGULAR; No. of Macro Cells: 980;
FLASH PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: RECTANGULAR; JTAG Boundary Scan Test: YES;
EPM1270GT144C5N
EPM1270T144A3
FLASH PLD; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE; Maximum Operating Temperature: 124 Cel;
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