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EPM1270F256I5N

Intel

EPM1270F256I5N by Intel

The Intel EPM1270F256I5N is a FLASH PLD with 980 macro cells, 212 inputs/outputs, and 10ns propagation delay. Ideal for applications requiring programmable logic devices in a compact grid array package with JTAG boundary scan test capability.

Median Price

$88.860

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Arrow

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Schukat

Germany . 20 parts In-Stock

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Digiode

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Nova Conductors

Japan . 10 parts In-Stock

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Goldney Electronics S.L.

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Vigor

Singapore . 500 parts In-Stock

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MARBEL Systems

Belgium . 10 parts In-Stock

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Semicontronic

India . 883 parts In-Stock

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Corphita

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Aranea Global

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Continental Prestige Electronics

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Kenton Components

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Corohmni

South Africa . 250 parts In-Stock

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Texas Native Microelectronics

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Modulus Dynamics

Lithuania . 1,726 parts In-Stock

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Microchip USA

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Ampacity Inc.

Singapore . 854 parts In-Stock

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Advanced Electronics

New Zealand . 318 parts In-Stock

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Lixinc

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Qasali Group International

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RC Electronics

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Overview

Unlock the power of cutting-edge technology with Intel's EPM1270F256I5N Programmable Logic Device. This versatile device offers lightning-fast propagation delay and a multitude of macro cells, perfect for a wide range of applications. With its innovative CMOS technology and in-system programmability, this PLD is a game-changer in the industry. Experience seamless integration and high performance like never before, all packaged in a durable plastic/epoxy body. Trust Intel to deliver top-notch quality and reliability, making the EPM1270F256I5N the ideal choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and cost-effective.

Propagation Delay: 10 ns

With a fast propagation delay of 10 ns, this PLD ensures quick processing speeds for efficient performance.

Surface Mount: YES

This surface mount PLD offers easy installation and space-saving benefits for compact electronic designs.

Maximum Supply Voltage: 2.625 V

The low maximum supply voltage of 2.625V helps in reducing power consumption and enhancing energy efficiency.

No. of Macro Cells: 980

With 980 macro cells, this PLD provides ample logic resources for complex programming and customization.

Technology Used: CMOS

The CMOS technology used ensures low power consumption and high noise immunity for reliable operation.

No. of Inputs: 212

The high number of inputs allows for versatile connectivity and input/output configurations in diverse applications.

Package Shape: SQUARE

The square package shape offers efficient use of board space and easy integration into existing layouts.

Form Of Terminal: BALL

The ball form of terminals enables reliable connections and secure soldering for robust circuit connections.

Nominal Supply Voltage (V): 2.5

The nominal supply voltage of 2.5V ensures stable operation and compatibility with standard power sources.

Power Supplies (V): 1.5/3.3,2.5/3.3

The dual power supply options cater to a wider range of voltage requirements for versatile usage scenarios.

No. of Terminals: 256

With 256 terminals, this PLD offers extensive connectivity options and flexibility in circuit design.

Programmable IC Type: FLASH PLD

The flash programmable IC type allows for easy reprogramming and customization of logic functions for versatile applications.

Package Style (Meter): GRID ARRAY

The grid array package style provides secure mounting and reliable electrical connections for robust performance.

In-System Programmable: YES

The in-system programmable feature allows for convenient and flexible programming without the need for specialized equipment.

Output Function: MACROCELL

The macrocell output function offers customizable logic outputs for tailored system requirements and enhanced performance.

Minimum Supply Voltage: 2.375 V

The low minimum supply voltage of 2.375V ensures compatibility with a wide range of power sources for versatile use.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, this PLD is suitable for high-temperature environments and industrial applications.

Pitch Of Terminal: 1 mm

The 1mm pitch of terminals allows for compact and efficient PCB layouts with tight interconnect spacing.

Organization: 0 DEDICATED INPUTS, 212 I/O

The organization of zero dedicated inputs and 212 I/O options provides flexibility in input/output configurations for diverse applications.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures reliable performance even in harsh cold environments.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin/silver/copper finishing on terminals provides corrosion resistance and stable electrical connections for long-term reliability.

Position Of Terminal: BOTTOM

The bottom position of terminals facilitates easy PCB layout and secure soldering for efficient assembly.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this PLD is suitable for standard moisture exposure levels in various operating environments.

Maximum Seated Height: 2.2 mm

The low maximum seated height of 2.2mm allows for slim and compact device designs with minimal space requirements.

Width: 17 mm

The 17mm width offers a compact form factor for space-efficient integration into electronic systems.

No. of Outputs: 212

With 212 outputs, this PLD provides ample logic output options for diverse programming and customization needs.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature of 260°C ensures proper soldering and secure connections during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for reliable and secure soldering of components during manufacturing processes.

Length: 17 mm

The 17mm length offers a compact and space-saving design for easy integration into electronic systems.

JTAG Boundary Scan Test: YES

The JTAG boundary scan test feature enables easy debugging and testing of circuit connections for improved reliability and performance.

No. of I/O Lines: 212

With 212 I/O lines, this PLD offers extensive input/output connectivity options for versatile system configurations.

Technical Specifications

Programmable Logic Devices (PLD) EPM1270F256I5N attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Intel

IC Features

Programmable IC Type:

In-System Programmable:

Yes

Organization:

0 Dedicated Inputs, 212 I/O

No. of Outputs:

212

Output Function:

Macrocell

No. of Inputs:

212

No. of Macro Cells:

980

No. of Dedicated Inputs:

0

No. of I/O Lines:

212

Propagation Delay:

10 ns

Technology:

CMOS

Sub-Category:

Programmable Logic Devices

Additional Features:

It can also operate at 3.3 V

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.375 V

Maximum Supply Voltage:

2.625 V

Power Supplies (V):

1.5/3.3,2.5/3.3 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

100 °C (212 °F)

Minimum Operating Temperature:

-40 °C (-40 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

3

Maximum Time At Peak Reflow Temperature:

30 s

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Grid Array

Package Code:

BGA

Package Shape:

Package Equivalence Code:

BGA256,16X16,40

Width:

17 mm

Length:

17 mm

Maximum Seated Height:

2.2 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Form:

No. of Terminals:

256

Terminal Pitch:

1 mm

Terminal Finish:

Tin/Silver/Copper

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

JTAG Boundary Scan Test:

Yes

Qualified:

No

Trade Compliance

EPM1270F256I5N Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-601-3878, 5962016013878

NIIN

016013878

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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