Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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EPM1270F256C5N by Intel is a programmable logic device (PLD) with 980 macro cells and 212 inputs/outputs. It uses CMOS technology and has a max supply voltage of 2.625V. This PLD is suitable for applications requiring in-system programmability and a fast propagation delay of 10ns.
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The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable applications.
The low propagation delay of 10 ns ensures fast signal processing, making the product suitable for high-speed applications.
Being surface mountable makes the product easier to assemble on circuit boards, saving space and allowing for automated assembly processes.
The low maximum supply voltage of 2.625 V helps in reducing power consumption and operating costs of the product.
With 980 macro cells, the product offers a high level of logic integration and flexibility for complex programmable logic designs.
CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable.
Having 212 inputs allows for the product to handle a large number of input signals, enabling versatile and scalable design implementations.
The square package shape makes it easy to mount and arrange multiple devices on a PCB efficiently, optimizing board space usage.
Using a ball form of terminal ensures reliable connections and solder joints, improving the overall durability and longevity of the product.
The 2.5V nominal supply voltage provides compatibility with standard power supply configurations, simplifying integration into existing systems.
Support for multiple power supply voltages (1.5/3.3 and 2.5/3.3) offers flexibility in design and compatibility with various power requirements.
Having 256 terminals provides ample connectivity options for interfacing with external devices and components, enhancing the product's versatility.
The use of FLASH PLD technology enables reprogrammability and quick design iterations, making the product suitable for prototyping and development purposes.
The grid array package style offers high pin density and easy routing, facilitating complex PCB layouts and reducing signal interference.
Support for in-system programmability allows for convenient firmware updates and configuration changes without the need for physical device removal or replacement.
The utilization of macrocells as output functions provides configurable logic elements for customizing the product's functionality to meet specific application requirements.
The low minimum supply voltage of 2.375 V ensures reliable operation even under low power conditions, enhancing the product's robustness.
With a maximum operating temperature of 85 °C, the product can withstand high temperature environments, increasing its reliability in various applications.
The 1mm pitch of terminals allows for fine-pitch mounting, enabling high-density integration and compact PCB designs.
The organizational structure of 0 dedicated inputs and 212 I/O lines offers flexible routing options and custom configurations for tailored logic designs.
With a minimum operating temperature of 0 °C, the product can function reliably in low-temperature environments, expanding its range of applications.
The use of tin/silver/copper finishing on terminals ensures excellent conductivity and corrosion resistance, maintaining signal integrity and reliability.
Having terminals positioned at the bottom allows for easier PCB layout and assembly, simplifying the overall manufacturing process.
With an MSL of 3, the product can withstand moderate levels of moisture exposure during storage and handling, ensuring long-term reliability.
The maximum seated height of 2.2 mm allows for low-profile mounting, reducing overall system height and enabling compact device designs.
The 17mm width provides a compact footprint, saving space on the PCB and allowing for more efficient board layouts in densely populated designs.
Having 212 outputs enables the product to drive multiple external devices or components, enhancing connectivity and versatility in logic control applications.
With a maximum time of 30 seconds at peak reflow temperature, the product can undergo solder reflow processes quickly and efficiently, ensuring reliable solder joints.
The peak reflow temperature of 260 °C allows for reliable soldering of the product on PCBs, ensuring strong electrical connections in high-temperature environments.
The 17mm length provides a balanced form factor, complementing the width and height dimensions for optimal PCB layout and integration.
Support for JTAG boundary scan test simplifies debugging and testing processes, allowing for efficient verification of the product's functionality and performance.
Having 212 I/O lines provides extensive connectivity options, enabling seamless interaction with external devices and peripherals, enhancing the product's versatility.
Programmable Logic Devices (PLD) EPM1270F256C5N attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Intel
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EPM1270F256C5N Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - MAX II EOL-Reversal 19/Mar/2021 Mult Dev EOL 4/Dec/2020
PCN Design/Specification - Quartus SW/Web Chgs 23/Sep/2021
PCN Packaging - Mult Dev Label CHG 24/Jan/2020 Mult Dev Label Chgs 24/Feb/2020
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
2N7002
Diotec Semiconductor Ag
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 10; Terminal Finish: MATTE TIN;
LM2931AZ-5.0RPG
Onsemi
LM2931AZ-5.0RPG by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V nominal output voltage and 0.1A max output current. It features a low dropout voltage of 0.6V, making it suitable for applications requiring stable power supply in temperature range from -40 to 125°C. The package style is cylindrical with matte tin terminal finish, ideal for various electronic devices needing precise voltage regulation.
Comchip Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; Operating Mode: ENHANCEMENT MODE;
BSS138
Vishay Intertechnology
Vishay Intertechnology's BSS138 is a N-CHANNEL FET with SINGLE configuration and ENHANCEMENT MODE operation. It features 0.35W power dissipation, METAL-OXIDE SEMICONDUCTOR tech, and 150°C max temp. Ideal for surface mount applications in various electronic circuits requiring efficient power management.
1N4148WS
Rochester Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Fairchild Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
RC0402JR-070RL
Yageo
Yageo's RC0402JR-070RL is a SMT fixed resistor with 0 ohm resistance, rated for temperatures from -55 to 155 °C. It features METAL GLAZE/THICK FILM tech, WRAPAROUND terminals, and 0.0625 W power dissipation. Ideal for jumper applications in electronics requiring compact surface mount components.
1N4148
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Peak Reflow Temperature (C): 260; No. of Phases: 1; Diode Element Material: SILICON;
M39029/56-351
Glenair
CONNECTOR ACCESSORY; Associated Backshell Military - Specifications: MIL-DTL-38999; Material: COPPER ALLOY; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: FEMALE; DIN Conformity: NO;
ABS25-32.768KHZ-1-T
Abracon
Abracon's ABS25-32.768KHZ-1-T crystal oscillator offers 10 ppm frequency tolerance, 126% stability, and 50000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal operating frequency, such as IoT devices and precision timing systems.
Lite-on Semiconductor
SS14
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Vishay Sprague
NPN; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JEDEC-95 Code: TO-18; Maximum Collector-Emitter Voltage: 40 V;
LM107H
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Nominal Common Mode Reject Ratio: 96 dB;
BAV99
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
OHN3020U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
CRG0805F10K
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10000 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
USB2514BI-AEZG
Standard Microsystems
BUS CONTROLLER, UNIVERSAL SERIAL BUS; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
EPF10K50VRI240-4
Altera
LOADABLE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: HFQFP; Package Shape: SQUARE;
EPM7064SLC44-10N
Intel
EPM7064SLC44-10N by Intel is a 64 macrocell EE PLD with 36 I/O lines, operating at up to 125 MHz. It features a propagation delay of 10 ns and can be in-system programmable. This Programmable Logic Device (PLD) is commonly used in commercial applications requiring fast processing speeds and versatile input/output configurations.
LC4064V-75TN44I
Lattice Semiconductor
LC4064V-75TN44I by Lattice Semiconductor is a 3.3V EE PLD with 64 macro cells, 32 inputs, and 30 I/O lines. With a propagation delay of 7.5ns and max clock frequency of 111MHz, it's ideal for applications requiring fast processing speeds in programmable logic devices. The device is surface mountable and supports JTAG boundary scan testing for efficient debugging processes.
EPM7128AETC100-10N
Intel's EPM7128AETC100-10N is a 128 macrocell EE PLD with 10ns propagation delay, operating at max 98MHz clock frequency. Ideal for applications requiring in-system programmability and output function from macrocells. Features include CMOS technology, 3.6V supply voltage, and JTAG boundary scan test capability.
LC4032V-5TN44I
LC4032V-5TN44I by Lattice Semiconductor is a 32 macrocell EE PLD with 5 ns propagation delay and 156 MHz clock frequency. Ideal for applications requiring fast processing speeds, it features in-system programmability, 30 I/O lines, and JTAG boundary scan testing capabilities.
ATF1508ASV-15AU100-T
Microchip Technology
Microchip Technology's ATF1508ASV-15AU100-T is a 3.3V EE PLD with 15ns propagation delay and 100 terminals. Ideal for industrial applications, it features a max clock frequency of 100MHz, 80 I/O lines, and operates b/w -40 to 85°C.
EPM3128ATC144-7N
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
EPM240GF100I5N
FLASH PLD; Form Of Terminal: BALL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
XC95144XL-10TQ100I
Xilinx
The Xilinx XC95144XL-10TQ100I is a 144 macrocell FLASH PLD with 81 I/O lines, operating at a max clock frequency of 81.3 MHz. It features a propagation delay of 10 ns and can be in-system programmable. Ideal for industrial applications requiring high-speed processing and versatile I/O capabilities.
XC95144XL-10TQ144I
XC95144XL-10TQ144I by Xilinx is a 3.3V CMOS PLD with 117 I/O lines, 144 macro cells, and 81.3 MHz clock frequency. Ideal for industrial applications, it offers in-system programmability and JTAG boundary scan testing capabilities in a low-profile package with Gull Wing terminals.
EPM240F100I5N
FLASH PLD; Form Of Terminal: BALL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 2.5;
LC4064ZE-7TN48C
LC4064ZE-7TN48C by Lattice Semiconductor is a 64 macrocell EE PLD with 7.5 ns propagation delay, ideal for applications requiring in-system programmability and JTAG boundary scan test. Featuring 32 I/O lines, this CMOS technology-based PLD operates at a max clock frequency of 111 MHz and has a package style of flatpack, thin profile, fine pitch.
LC4256V-5TN144C
LC4256V-5TN144C by Lattice Semiconductor is a 256 macrocell EE PLD with 110 inputs and 96 I/O lines. It operates at a max clock frequency of 156 MHz, with a propagation delay of 5 ns. Ideal for applications requiring programmable logic devices in surface-mount packages.
EPF10K50ETI144-2
LOADABLE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
5M2210ZF256C5N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
EPM3256ATI144-10N
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
EPM7128SQI100-10
The EPM7128SQI100-10 by Altera is a programmable logic device with 128 macro cells and 84 inputs/outputs. It operates at a maximum frequency of 125 MHz and has a propagation delay of 10 ns. It can be surface-mounted and is compatible with in-system programming. This PLD is commonly used in industrial applications due to its industrial temperature grading.
ATF16V8CZ-15XU
Atmel
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR;
XC2C32A-6CPG56C
The Xilinx XC2C32A-6CPG56C is a 32 macrocell FLASH PLD with 6 ns propagation delay, suitable for applications requiring in-system programmability and JTAG boundary scan test. It operates at a max clock frequency of 300 MHz, has 33 I/O lines, and supports a commercial temperature range of 0 to 70°C.
LC4256V-75TN144E
LC4256V-75TN144E by Lattice Semiconductor is a 256 macrocell EE PLD with 110 inputs and 96 I/O lines. Featuring a propagation delay of 7.5 ns, it operates at a max clock frequency of 111 MHz. Ideal for applications requiring in-system programmability and JTAG boundary scan testing in compact designs.
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EPM1270T144I5N
The Intel EPM1270T144I5N is a FLASH PLD with 980 macro cells, 116 inputs/outputs, and 10ns propagation delay. Ideal for applications requiring in-system programmability, it operates at temperatures from -40 to 100°C and supports JTAG boundary scan testing.
FLASH PLD; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Finishing Of Terminal Used: MATTE TIN;
EPM1270T144C5N
EPM1270T144C5N by Intel is a Flash PLD with 980 macro cells, 116 inputs/outputs, and a propagation delay of 10 ns. It is ideal for applications requiring in-system programmability, such as digital signal processing and control systems due to its low profile package style and CMOS technology.
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
EPM1270F256I5N
The Intel EPM1270F256I5N is a FLASH PLD with 980 macro cells, 212 inputs/outputs, and 10ns propagation delay. Ideal for applications requiring programmable logic devices in a compact grid array package with JTAG boundary scan test capability.
The EPM1270F256I5N by Altera is a programmable logic device with 980 macro cells. It has a maximum supply voltage of 2.625V and uses CMOS technology. It is a flash PLD that is in-system programmable. The package style is grid array, with 256 terminals. Its top application is as a macrocell output function.
EPM1270F256C5N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
EPM1270T144C3N
EPM1270T144C3N by Intel is a FLASH PLD with 980 macro cells, 116 inputs/outputs, and 6.2 ns propagation delay. Ideal for applications requiring fast processing speeds and high input/output capabilities in programmable logic devices.
The EPM1270T144C3N by Altera is a programmable logic device (PLD) with 980 macro cells. It has a propagation delay of 6.2 ns and can operate at a maximum supply voltage of 2.625 V. This device is surface mountable and uses CMOS technology. Its package shape is square with gull wing terminals. It is an in-system programmable flash PLD with a minimum supply voltage of 2.375 V. The EPM1270T144C3N is commonly used for applications that require the output function of a macrocell, such as digital signal processing and control systems.
EPM1270GT144C4N
The Altera EPM1270GT144C4N is a programmable logic device with 980 macro cells, CMOS technology, and a propagation delay of 8.1 ns. It can operate at a maximum supply voltage of 1.89V and has a package shape of square. This PLD is commonly used for applications requiring in-system programmability and output functions like macrocell.
EPM1270T144C4N
EPM1270M256C5N
EPM1270M256C5N by Intel is a programmable logic device (PLD) with 980 macro cells and 212 inputs/outputs. It has a propagation delay of 10 ns and can operate at temperatures up to 85°C. This PLD is commonly used for in-system programming and features JTAG boundary scan testing.
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: RECTANGULAR;
EPM1270M256I5N
FLASH PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: RECTANGULAR; No. of Macro Cells: 980;
FLASH PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: RECTANGULAR; JTAG Boundary Scan Test: YES;
EPM1270GT144C5N
EPM1270F256I4N
FLASH PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;
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