Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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EPM1270F256C5N by Intel is a programmable logic device (PLD) with 980 macro cells and 212 inputs/outputs. It uses CMOS technology and has a max supply voltage of 2.625V. This PLD is suitable for applications requiring in-system programmability and a fast propagation delay of 10ns.
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The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable applications.
The low propagation delay of 10 ns ensures fast signal processing, making the product suitable for high-speed applications.
Being surface mountable makes the product easier to assemble on circuit boards, saving space and allowing for automated assembly processes.
The low maximum supply voltage of 2.625 V helps in reducing power consumption and operating costs of the product.
With 980 macro cells, the product offers a high level of logic integration and flexibility for complex programmable logic designs.
CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable.
Having 212 inputs allows for the product to handle a large number of input signals, enabling versatile and scalable design implementations.
The square package shape makes it easy to mount and arrange multiple devices on a PCB efficiently, optimizing board space usage.
Using a ball form of terminal ensures reliable connections and solder joints, improving the overall durability and longevity of the product.
The 2.5V nominal supply voltage provides compatibility with standard power supply configurations, simplifying integration into existing systems.
Support for multiple power supply voltages (1.5/3.3 and 2.5/3.3) offers flexibility in design and compatibility with various power requirements.
Having 256 terminals provides ample connectivity options for interfacing with external devices and components, enhancing the product's versatility.
The use of FLASH PLD technology enables reprogrammability and quick design iterations, making the product suitable for prototyping and development purposes.
The grid array package style offers high pin density and easy routing, facilitating complex PCB layouts and reducing signal interference.
Support for in-system programmability allows for convenient firmware updates and configuration changes without the need for physical device removal or replacement.
The utilization of macrocells as output functions provides configurable logic elements for customizing the product's functionality to meet specific application requirements.
The low minimum supply voltage of 2.375 V ensures reliable operation even under low power conditions, enhancing the product's robustness.
With a maximum operating temperature of 85 °C, the product can withstand high temperature environments, increasing its reliability in various applications.
The 1mm pitch of terminals allows for fine-pitch mounting, enabling high-density integration and compact PCB designs.
The organizational structure of 0 dedicated inputs and 212 I/O lines offers flexible routing options and custom configurations for tailored logic designs.
With a minimum operating temperature of 0 °C, the product can function reliably in low-temperature environments, expanding its range of applications.
The use of tin/silver/copper finishing on terminals ensures excellent conductivity and corrosion resistance, maintaining signal integrity and reliability.
Having terminals positioned at the bottom allows for easier PCB layout and assembly, simplifying the overall manufacturing process.
With an MSL of 3, the product can withstand moderate levels of moisture exposure during storage and handling, ensuring long-term reliability.
The maximum seated height of 2.2 mm allows for low-profile mounting, reducing overall system height and enabling compact device designs.
The 17mm width provides a compact footprint, saving space on the PCB and allowing for more efficient board layouts in densely populated designs.
Having 212 outputs enables the product to drive multiple external devices or components, enhancing connectivity and versatility in logic control applications.
With a maximum time of 30 seconds at peak reflow temperature, the product can undergo solder reflow processes quickly and efficiently, ensuring reliable solder joints.
The peak reflow temperature of 260 °C allows for reliable soldering of the product on PCBs, ensuring strong electrical connections in high-temperature environments.
The 17mm length provides a balanced form factor, complementing the width and height dimensions for optimal PCB layout and integration.
Support for JTAG boundary scan test simplifies debugging and testing processes, allowing for efficient verification of the product's functionality and performance.
Having 212 I/O lines provides extensive connectivity options, enabling seamless interaction with external devices and peripherals, enhancing the product's versatility.
Programmable Logic Devices (PLD) EPM1270F256C5N attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Intel
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EPM1270F256C5N Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - MAX II EOL-Reversal 19/Mar/2021 Mult Dev EOL 4/Dec/2020
PCN Design/Specification - Quartus SW/Web Chgs 23/Sep/2021
PCN Packaging - Mult Dev Label CHG 24/Jan/2020 Mult Dev Label Chgs 24/Feb/2020
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
FDV304P
Onsemi
The Onsemi FDV304P is a P-CHANNEL FET with 25V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 0.46A and an Operating Temperature range of -55 to 150 °C. The transistor comes in a PLASTIC/EPOXY package with GULL WING terminals, suitable for surface mount configurations.
LD1117S33CTR
STMicroelectronics
STMicroelectronics LD1117S33CTR is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 1.3A. It operates within an input voltage range of 4.75V to 15V, making it suitable for various applications requiring stable voltage regulation in compact designs. The device features low dropout voltage of 1.3V, high temperature operation up to 125°C, and small outline package style for space-constrained PCB layouts.
1N4148WT
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358AN
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM555CMX
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
MBR0520LT1
MBR0520LT1 by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring low power consumption in compact electronic devices. This single-configured diode is surface mountable and has a max repetitive peak reverse voltage of 20V, ideal for small outline package designs.
2N2222A
Itt Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM358N
2N7002
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Operating Mode: ENHANCEMENT MODE; Maximum Drain Current (ID): .115 A;
SS14
Goodwork Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Synsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM2931AZ-5.0G
LM2931AZ-5.0G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 5V and max output current of 0.1A. It has a max dropout voltage of 0.6V, making it suitable for applications requiring stable power supply in temperature-sensitive environments up to 125°C. The package style is cylindrical with wire terminals, ideal for rail packing methods in various electronic devices.
Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM358M
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
BAV99
Toshiba
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
RC0402JR-070RL
Yageo
Yageo's RC0402JR-070RL is a SMT fixed resistor with 0 ohm resistance, rated for temperatures from -55 to 155 °C. It features METAL GLAZE/THICK FILM tech, WRAPAROUND terminals, and 0.0625 W power dissipation. Ideal for jumper applications in electronics requiring compact surface mount components.
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
Vishay Intertechnology
2N7002 by Vishay Intertechnology is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE, suitable for surface mount with GULL WING terminals.
Samsung
N-CHANNEL AND P-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 5 ohm; No. of Terminals: 3;
4554
Jw Miller Magnetics
Other Semiconductors;
ISPLSI1048E-70LQN
Lattice Semiconductor
ISPLSI1048E-70LQN by Lattice Semiconductor is a PLD with 192 macro cells, 96 I/O lines, and 18.5 ns propagation delay. It is used for applications requiring in-system programmability, such as digital signal processing and control systems. The device operates at temperatures ranging from 0 to 70°C and has a max clock frequency of 56 MHz.
EPM7128STC100-15F
Altera
EPM7128STC100-15F by Altera is a 128 macrocell EE PLD with 15ns propagation delay, operating at up to 100MHz. It features in-system programmability and 84 I/O lines for versatile applications in Programmable Logic Devices (PLD). The device is surface mountable, uses CMOS technology, and has a max supply voltage of 5.25V.
EPM7128AETI100-7N
Intel
Intel's EPM7128AETI100-7N is a 128 macrocell EE PLD with 84 I/O lines, operating at max clock freq of 129.9 MHz. With propagation delay of 7.5 ns and in-system programmability, it suits industrial applications requiring high-speed processing and versatile I/O capabilities.
XC9536XL-10VQG44I
Xilinx
Xilinx XC9536XL-10VQG44I is a 36 macrocell FLASH PLD with 34 I/O lines, operating at max 138.88 MHz clock frequency. It features 10 ns propagation delay and supports in-system programmability. Ideal for industrial applications requiring high-speed logic processing within temperature range of -40 to 85°C.
EPM240T100C3N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
ATF1504ASV-15JC44
Atmel
Atmel's ATF1504ASV-15JC44 is a 64 macrocell EE PLD with 15ns propagation delay, suitable for applications requiring in-system programmability and a max clock frequency of 100MHz. With a package style of chip carrier and JTAG boundary scan test capability, it operates at temperatures ranging from 0 to 70°C.
XC2C32A-6QFG32C
The Xilinx XC2C32A-6QFG32C is a 32 macrocell FLASH PLD with 6 ns propagation delay and 300 MHz max clock frequency. Ideal for applications requiring in-system programmability, it operates at temperatures ranging from 0 to 70°C and supports JTAG boundary scan testing.
5M40ZM64C4N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 64; Package Code: TFBGA; Package Shape: SQUARE;
EPM570GT144C4N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XCR3032XL-7CSG48I
Xilinx XCR3032XL-7CSG48I is a 32 macrocell EE PLD with 7.5ns propagation delay, operating at max clock frequency of 119MHz. Ideal for industrial applications, it features in-system programmability and JTAG boundary scan test capability.
ATF1502AS-10JU44
Microchip Technology
Microchip Technology's ATF1502AS-10JU44 is a 32 macrocell EE PLD with 36 inputs and 32 I/O lines. With a propagation delay of 10 ns and max clock frequency of 83.33 MHz, it is ideal for PAL-type applications requiring fast processing speeds in programmable logic devices. The device is surface mountable, has JTAG boundary scan test capability, and operates b/w -40 to 85°C temperatures.
5M40ZE64C4N
The Intel 5M40ZE64C4N is a FLASH PLD with 54 I/O lines, operating at up to 184.1 MHz clock frequency. With a propagation delay of 7.9 ns and max supply voltage of 1.89 V, it's ideal for applications requiring high-speed data processing in programmable logic devices (PLD).
ATF22V10CQZ-20SI
ATF22V10CQZ-20SI by Microchip Technology is a 24-terminal PLD with 20ns propagation delay and 5.5V max supply voltage. It features CMOS technology, flash PLD type, and macrocell output function. Ideal for industrial applications requiring high clock frequency up to 38.5MHz in compact small outline package style.
EPM1270F256C5N
5M160ZE64C5
Intel's 5M160ZE64C5 is a FLASH PLD with 54 I/O lines, 118.3 MHz clock frequency, and 14 ns propagation delay. Ideal for applications requiring fast processing speeds and versatile input/output configurations in programmable logic devices.
LC4256ZC-75TN100C
LC4256ZC-75TN100C by Lattice Semiconductor is a 256 macrocell EE PLD with 74 inputs and 64 I/O lines. It has a propagation delay of 7.5 ns, operates at max clock frequency of 111 MHz, and can be in-system programmed. Ideal for applications requiring programmable logic devices with low profile flatpack package style.
ATF22V10CQ-15PC
Atmel's ATF22V10CQ-15PC is a PLD with 15ns propagation delay, 5.25V max supply voltage, and CMOS technology. Ideal for applications requiring PAL-type architecture, it offers 132 product terms, operates at up to 55.5MHz clock frequency, and has 10 dedicated inputs and I/O lines.
PEEL18CV8P-15
Diodes Incorporated
Diodes Inc. PEEL18CV8P-15 is a 5V EE PLD with 15ns propagation delay, 74 product terms, and 41.6MHz clock frequency. Ideal for PAL-type applications requiring 9 dedicated inputs, 8 I/O lines, and macrocell output function in commercial temperature range.
XC2C64A-5VQ100C
XC2C64A-5VQ100C by Xilinx is a 64 macrocell FLASH PLD with 5 ns propagation delay, operating at up to 333 MHz. It features in-system programmability and 64 I/O lines, suitable for applications requiring fast processing speeds and versatile I/O configurations in commercial-grade environments.
EPM240F100C5N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE;
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EPM1270T144I5N
The Intel EPM1270T144I5N is a FLASH PLD with 980 macro cells, 116 inputs/outputs, and 10ns propagation delay. Ideal for applications requiring in-system programmability, it operates at temperatures from -40 to 100°C and supports JTAG boundary scan testing.
FLASH PLD; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Finishing Of Terminal Used: MATTE TIN;
EPM1270T144C5N
EPM1270T144C5N by Intel is a Flash PLD with 980 macro cells, 116 inputs/outputs, and a propagation delay of 10 ns. It is ideal for applications requiring in-system programmability, such as digital signal processing and control systems due to its low profile package style and CMOS technology.
EPM1270F256I5N
The Intel EPM1270F256I5N is a FLASH PLD with 980 macro cells, 212 inputs/outputs, and 10ns propagation delay. Ideal for applications requiring programmable logic devices in a compact grid array package with JTAG boundary scan test capability.
The EPM1270F256I5N by Altera is a programmable logic device with 980 macro cells. It has a maximum supply voltage of 2.625V and uses CMOS technology. It is a flash PLD that is in-system programmable. The package style is grid array, with 256 terminals. Its top application is as a macrocell output function.
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
EPM1270T144C3N
EPM1270T144C3N by Intel is a FLASH PLD with 980 macro cells, 116 inputs/outputs, and 6.2 ns propagation delay. Ideal for applications requiring fast processing speeds and high input/output capabilities in programmable logic devices.
The EPM1270T144C3N by Altera is a programmable logic device (PLD) with 980 macro cells. It has a propagation delay of 6.2 ns and can operate at a maximum supply voltage of 2.625 V. This device is surface mountable and uses CMOS technology. Its package shape is square with gull wing terminals. It is an in-system programmable flash PLD with a minimum supply voltage of 2.375 V. The EPM1270T144C3N is commonly used for applications that require the output function of a macrocell, such as digital signal processing and control systems.
EPM1270GT144C4N
The Altera EPM1270GT144C4N is a programmable logic device with 980 macro cells, CMOS technology, and a propagation delay of 8.1 ns. It can operate at a maximum supply voltage of 1.89V and has a package shape of square. This PLD is commonly used for applications requiring in-system programmability and output functions like macrocell.
EPM1270T144C4N
EPM1270M256C5N
EPM1270M256C5N by Intel is a programmable logic device (PLD) with 980 macro cells and 212 inputs/outputs. It has a propagation delay of 10 ns and can operate at temperatures up to 85°C. This PLD is commonly used for in-system programming and features JTAG boundary scan testing.
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: RECTANGULAR;
EPM1270M256I5N
FLASH PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: RECTANGULAR; No. of Macro Cells: 980;
FLASH PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: RECTANGULAR; JTAG Boundary Scan Test: YES;
EPM1270GT144C5N
EPM1270F256I4N
FLASH PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;
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