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EPM1270M256C5N

Intel

EPM1270M256C5N by Intel

EPM1270M256C5N by Intel is a programmable logic device (PLD) with 980 macro cells and 212 inputs/outputs. It has a propagation delay of 10 ns and can operate at temperatures up to 85°C. This PLD is commonly used for in-system programming and features JTAG boundary scan testing.

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$43.427

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Overview

Experience the power of Intel with the EPM1270M256C5N Programmable Logic Device (PLD). Designed with precision and quality, this product offers unparalleled performance and reliability. With its cutting-edge CMOS technology and 980 macro cells, it provides limitless possibilities for your applications. Whether you need to enhance your data processing or optimize your system configurations, this PLD is the ideal solution. Its in-system programmability allows for easy updates and modifications, ensuring flexibility and adaptability. Trust Intel to deliver the best-in-class products that drive innovation and efficiency. Upgrade your systems today with the EPM1270M256C5N and experience the Intel advantage.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This PLD is made of high-quality plastic/epoxy material, providing a durable and reliable package for the device. This makes it an excellent choice for applications requiring robustness and longevity.

Propagation Delay: 10 ns

With a fast propagation delay of only 10 ns, this PLD can efficiently process signals and deliver quick response times. This attribute is ideal for applications demanding high-speed data processing and real-time operations.

Surface Mount: YES

Being surface mountable, this PLD allows for easy and convenient installation on circuit boards. The surface mount feature simplifies assembly processes, making it a practical choice for automated production lines and space-constrained applications.

Maximum Supply Voltage: 2.625 V

The PLD operates reliably within a maximum supply voltage of 2.625 V. This voltage range makes it compatible with various power sources and ensures stable performance in a wide range of applications.

No. of Macro Cells: 980

With an impressive number of 980 macro cells, this PLD offers extensive logic resources for complex programmable functions. This high capacity makes it suitable for advanced digital designs that require extensive control and functionality.

Technology Used: CMOS

Utilizing CMOS technology, this PLD provides excellent power efficiency combined with high-speed operation. The CMOS technology enables reduced power consumption and enhanced overall system performance, making it an advantageous choice.

No. of Inputs: 212

Featuring 212 inputs, this PLD can handle a significant number of input signals for processing and decision-making. The abundance of input options allows for flexible connectivity and comprehensive data manipulation, making it suitable for versatile applications.

Package Shape: RECTANGULAR

The rectangular package shape of this PLD simplifies its integration into various circuit board layouts. This shape optimizes space utilization and facilitates efficient PCB designs, making it a convenient choice for compact electronic systems.

Form Of Terminal: BALL

The PLD employs a ball terminal form, which ensures secure connections and reliable electrical contacts. This terminal form enhances the device's durability against vibration and mechanical stress, making it a reliable option for harsh environments.

Nominal Supply Voltage (V): 2.5

The PLD operates nominally at a supply voltage of 2.5 V, providing a stable power level for consistent performance. This voltage specification allows for compatibility with standard power supplies and ensures proper functionality in various applications.

Power Supplies (V): 1.5/3.3,2.5/3.3

Supporting multiple power supply options including 1.5/3.3 V and 2.5/3.3 V, this PLD offers flexibility in accommodating different voltage requirements. This feature allows for seamless integration with diverse system architectures and simplifies compatibility considerations.

No. of Terminals: 256

Equipped with 256 terminals, this PLD provides abundant connection points for linking with external circuitry. The extensive terminal count allows for enhanced connectivity and facilitates comprehensive system integration, making it a versatile choice.

Programmable IC Type: FLASH PLD

Being a flash programmable logic device (PLD), this product enables reprogramming of its internal configuration to adapt to changing functional requirements. This flexibility makes it an attractive choice for applications where customization and adaptability are crucial.

Package Style (Meter): GRID ARRAY

This PLD utilizes a grid array package style, which ensures precise alignment and robust mechanical support. The grid array style improves manufacturing yield, simplifies handling during assembly, and enhances thermal performance, making it a reliable option.

In-System Programmable: YES

Supporting in-system programming, this PLD allows for on-the-fly reconfiguration without requiring physical removal. This feature simplifies system upgrades, debugging, and customization, making it a convenient and time-saving choice for dynamic applications.

Output Function: MACROCELL

The PLD features a macrocell-based output function, providing versatile logic capabilities and output control. The macrocell architecture allows for complex logic operations and efficient signal routing, making it suitable for applications demanding intricate operational control.

Minimum Supply Voltage: 2.375 V

The PLD operates within a minimum supply voltage of 2.375 V, ensuring wide compatibility with different power sources. This voltage range allows for flexible integration and reliable performance across various applications and system configurations.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this PLD exhibits excellent thermal resilience and can withstand demanding environmental conditions. This attribute guarantees stable operation under elevated temperatures, making it a robust choice.

Pitch Of Terminal: 0.5 mm

The PLD features a terminal pitch of 0.5 mm, allowing for precise and compact connections. This small pitch facilitates tight integration and space-saving designs, making it suitable for applications with limited board real estate.

Organization: 0 DEDICATED INPUTS, 212 I/O

With 212 I/O lines and 0 dedicated inputs, this PLD offers a flexible organization for connecting external devices and processing inputs. The versatile organization allows for adaptable system architectures and efficient utilization of available resources, making it an excellent choice.

Minimum Operating Temperature: 0 °C

Featuring a minimum operating temperature of 0°C, this PLD can function reliably even in low-temperature environments. This attribute ensures consistent performance in diverse operating conditions, making it a dependable option.

Finishing Of Terminal Used: TIN SILVER COPPER

The PLD employs a terminal finishing consisting of tin, silver, and copper layers, ensuring reliable electrical performance and corrosion resistance. This finishing enhances signal integrity and extends the device's lifespan, making it a durable choice.

Position Of Terminal: BOTTOM

The terminal position at the bottom of the PLD simplifies routing and connection management within the overall system design. This bottom position improves PCB layout flexibility and enables efficient signal flow, making it a convenient choice for streamlined designs.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this PLD can tolerate moderate exposure to humidity during handling and assembly processes. This attribute ensures proper device functionality even in standard manufacturing environments, making it a reliable option.

Width: 11 mm

With a compact width of 11 mm, this PLD enables space-efficient circuit board layouts and compact system designs. The small form factor facilitates miniaturization efforts and allows for denser system integration, making it suitable for applications with tight size constraints.

No. of Outputs: 212

Featuring 212 outputs, this PLD can deliver multiple signals and drive various external devices. The generous output count allows for flexible configuration and effective system control, making it an advantageous choice for applications with numerous output requirements.

Length: 11 mm

The PLD's length of 11 mm contributes to its compact footprint and promotes efficient space utilization. This length specification supports miniaturized designs and enables high-density system integration, making it a practical option for size-constrained applications.

JTAG Boundary Scan Test: YES

Supporting JTAG (Joint Test Action Group) boundary scan testing, this PLD allows for efficient debugging and validation during system development. The boundary scan feature enhances testability and simplifies fault detection, making it a valuable tool for production and maintenance.

No. of I/O Lines: 212

Equipped with 212 I/O lines, this PLD provides a generous number of input/output connections for interfacing with external devices and systems. The extensive I/O line count enables versatile communication and system integration, making it a flexible and adaptable choice.

Technical Specifications

Programmable Logic Devices (PLD) EPM1270M256C5N attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Intel

IC Features

Programmable IC Type:

In-System Programmable:

Yes

Organization:

0 Dedicated Inputs, 212 I/O

No. of Outputs:

212

Output Function:

Macrocell

No. of Inputs:

212

No. of Macro Cells:

980

No. of Dedicated Inputs:

0

No. of I/O Lines:

212

Propagation Delay:

10 ns

Technology:

CMOS

Sub-Category:

Programmable Logic Devices

Additional Features:

It can also operate at 3.3 V

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.375 V

Maximum Supply Voltage:

2.625 V

Power Supplies (V):

1.5/3.3,2.5/3.3 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

85 °C (185 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Grid Array

Package Code:

BGA

Package Shape:

Package Equivalence Code:

BGA256,20X20,20

Width:

11 mm

Length:

11 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Form:

No. of Terminals:

256

Terminal Pitch:

.5 mm

Terminal Finish:

Tin Silver Copper

Standards

JESD-30 Code:

R-PBGA-B256

JESD-609 Code:

e1

JTAG Boundary Scan Test:

Yes

Qualified:

No

Trade Compliance

EPM1270M256C5N Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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