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PEEL18CV8P-15L

Diodes Incorporated

PEEL18CV8P-15L by Diodes Incorporated

Diodes Inc. PEEL18CV8P-15L is a PLD with 15ns propagation delay, 5.25V max supply voltage, and CMOS technology. Ideal for PAL-type applications, it offers 74 product terms, 41.6MHz clock frequency, and operates b/w 0-70°C.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

< 1k

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Fibra_Brandt Electronic GMBH

Germany . 199 parts In-Stock

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Vyrian

USA . 190 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 580 parts In-Stock

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Argo Parts USA

USA . 4,064 parts In-Stock

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Continental Prestige Electronics

USA . 2,727 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the PEEL18CV8P-15L by Diodes Incorporated. This high-quality Programmable Logic Device boasts a PAL-type architecture and 74 product terms, offering unparalleled flexibility for your projects. Its CMOS technology ensures reliable performance, while its compact rectangular shape makes it easy to integrate into any design. Whether you're working on consumer electronics, industrial automation, or telecommunications, this EE PLD will elevate your creations to new heights. Trust Diodes Incorporated to deliver cutting-edge solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this PLD lightweight and durable, ideal for various applications.

Propagation Delay: 15 ns

With a fast propagation delay of 15 ns, this PLD can process signals quickly and efficiently.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage of 5.25 V provides flexibility in power requirements for different systems.

Technology Used: CMOS

The CMOS technology used in this PLD offers low power consumption and high noise immunity.

No. of Inputs: 18

With 18 inputs, this PLD can handle a wide range of signals and data inputs.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration and placement within electronic systems.

Form Of Terminal: THROUGH-HOLE

Through-hole terminals provide reliable connections and ease of soldering during assembly.

Architecture: PAL-TYPE

The PAL-type architecture offers programmability and flexibility in creating custom logic functions.

Nominal Supply Voltage (V): 5

The nominal supply voltage of 5 V is a standard in many electronic systems, ensuring compatibility.

Power Supplies (V): 5

Having a stable power supply of 5 V ensures consistent performance and reliable operation.

No. of Terminals: 20

The 20 terminals provide sufficient connectivity options for interfacing with other components.

Programmable IC Type: EE PLD

Being an EE PLD allows for reprogramming of logic functions as needed, offering versatility.

Package Style (Meter): IN-LINE

The in-line package style saves space and allows for efficient use of PCB real estate.

Output Function: MACROCELL

The use of macrocells allows for more complex logic operations and versatile output configurations.

No. of Product Terms: 74

With 74 product terms, this PLD has the capacity to handle intricate logic functions and operations.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage of 4.75 V ensures compatibility with a wide range of systems and applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this PLD can handle demanding environmental conditions.

Pitch Of Terminal: 2.54 mm

The 2.54 mm terminal pitch allows for easy connections and integration with standard components.

Organization: 9 DEDICATED INPUTS, 8 I/O

The organization of 9 dedicated inputs and 8 I/O lines provides flexibility in data handling and processing.

No. of Dedicated Inputs: 9

Having 9 dedicated inputs allows for specific signal processing and differentiation in the logic design.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this PLD can function reliably in various environmental conditions.

Finishing Of Terminal Used: MATTE TIN

The use of matte tin finishing on terminals provides corrosion resistance and ensures long-term reliability.

Position Of Terminal: DUAL

Dual terminal positioning offers redundancy and improved connectivity for stable operation.

Width: 7.62 mm

The compact width of 7.62 mm saves space on the PCB, ideal for miniaturized electronic devices.

Maximum Clock Frequency: 41.6 MHz

With a high maximum clock frequency of 41.6 MHz, this PLD can handle rapid data processing and logic operations.

No. of Outputs: 8

The 8 outputs provide multiple options for data output and signal processing within a system.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this PLD can withstand high-temperature reflow soldering processes.

Length: 26.162 mm

The length of 26.162 mm offers a compact form factor for easy integration and space-saving in electronic designs.

No. of I/O Lines: 8

Having 8 I/O lines allows for sufficient data input and output flexibility for various applications.

Grading Of Temperature: COMMERCIAL

The commercial temperature grading ensures this PLD is suitable for commercial-grade applications.

Technical Specifications

Programmable Logic Devices (PLD) PEEL18CV8P-15L attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Diodes Incorporated

IC Features

Programmable IC Type:

Organization:

9 Dedicated Inputs, 8 I/O

No. of Outputs:

8

Output Function:

Macrocell

No. of Inputs:

18

No. of Product Terms:

74

No. of Dedicated Inputs:

9

No. of I/O Lines:

8

Maximum Clock Frequency:

41.6 MHz

Propagation Delay:

15 ns

Technology:

CMOS

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Width:

7.62 mm

Length:

26.162 mm

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Terminal Finish:

Matte Tin

Standards

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Qualified:

No

Trade Compliance

PEEL18CV8P-15L Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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