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TICPAL22V10Z-25CNT

Texas Instruments

TICPAL22V10Z-25CNT by Texas Instruments

TICPAL22V10Z-25CNT by Texas Instruments is a PAL-TYPE PLD with 22 inputs, 10 I/O lines, and 10 outputs. It operates at a max clock frequency of 31.2 MHz with a propagation delay of 25 ns. This programmable IC is commonly used in applications requiring high-speed logic functions within the commercial extended temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,328 parts In-Stock

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Digiode

USA . 3,338 parts In-Stock

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Nova Conductors

Japan . 85 parts In-Stock

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85

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Ampacity Inc.

Singapore . 1,631 parts In-Stock

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$5.000

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AZTECH Wire

Italy . 419 parts In-Stock

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$5.489

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One Stop Electronics

USA . 1,543 parts In-Stock

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$31.000

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$31.000

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Semicontronic

India . 211 parts In-Stock

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$34.000

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$33.150

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$32.980

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$32.980

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Parana Technologies

USA . 1,700 parts In-Stock

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$47.971

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DigiPath Technology Company

USA . 1,987 parts In-Stock

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$52.822

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$48.596

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ChromeModa Solutions

Germany . 774 parts In-Stock

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$53.900

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$44.198

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IDEA Electronic Components Group

UK . 726 parts In-Stock

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$53.900

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$51.205

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$48.510

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Corohmni

South Africa . 177 parts In-Stock

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Corphita

USA . 3,182 parts In-Stock

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Continental Prestige Electronics

USA . 1,901 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,557 parts In-Stock

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Argo Parts USA

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Advanced Electronics

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Bastille Electronics

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Microchip USA

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Computer Components Inc. - USA

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Overview

Unlock the potential of your electronic projects with the TICPAL22V10Z-25CNT by Texas Instruments, a top-tier manufacturer renowned for quality and reliability. This cutting-edge Programmable Logic Device offers unparalleled performance in a wide range of applications, thanks to its advanced technology and innovative design. With 22 inputs, 10 I/O lines, and 10 outputs, this versatile PLD packs a punch, delivering lightning-fast speeds and seamless functionality. Trust Texas Instruments to provide you with the tools you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the PLD.

Propagation Delay: 25 ns

Low propagation delay ensures fast operation of the PLD, suitable for time-critical applications.

Maximum Supply Voltage: 5.25 V

Allows for a higher maximum supply voltage, providing flexibility in power supply options.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the PLD.

No. of Inputs: 22

With a high number of inputs, the PLD can accommodate a variety of input signals and complex logic functions.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to fit the PLD into different systems and designs.

Form Of Terminal: THROUGH-HOLE

Through-hole terminals provide secure connections and ease of soldering during PCB assembly.

Architecture: PAL-TYPE

PAL-type architecture offers programmability and versatility in designing custom logic functions.

Nominal Supply Voltage (V): 5

Nominal supply voltage of 5V ensures compatibility with standard power supply configurations.

Power Supplies (V): 5

Stable power supply at 5V ensures reliable operation of the PLD.

No. of Terminals: 24

Sufficient terminals for connecting various input and output signals, allowing for versatile integration into systems.

Programmable IC Type: OT PLD

OT PLD offers programmability and customization for specific logic functions and applications.

Package Style (Meter): IN-LINE

In-line package style offers space-saving and compact design for efficient PCB layout.

Output Function: MACROCELL

Macrocell output function provides complex combinational or sequential logic capabilities.

No. of Product Terms: 132

High number of product terms allows for more complex logic functions to be implemented.

Minimum Supply Voltage: 4.75 V

With a low minimum supply voltage, the PLD can operate efficiently at lower power levels.

Maximum Operating Temperature: 75 °C

Wide operating temperature range of 0 to 75°C ensures reliable operation in various environments.

Pitch Of Terminal: 2.54 mm

Standard pitch terminal spacing allows for easy integration into standard PCB layouts.

Organization: 11 DEDICATED INPUTS, 10 I/O

Dedicated inputs and IO lines provide flexibility in designing and implementing specific logic functions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows the PLD to operate in a wide range of environments.

Finishing Of Terminal Used: NICKEL PALLADIUM GOLD

Nickel palladium gold finish on terminals enhances conductivity and corrosion resistance for reliable connections.

Position Of Terminal: DUAL

Dual position terminals provide flexibility in mounting and soldering options for PCB assembly.

Maximum Seated Height: 5.08 mm

Low seated height allows for compact integration into systems with limited vertical space.

Width: 7.62 mm

Narrow width of the PLD enables efficient use of board space in system designs.

Maximum Clock Frequency: 31.2 MHz

High maximum clock frequency allows for fast operation and response times in applications.

No. of Outputs: 10

Multiple outputs enable the PLD to drive multiple devices or perform complex logic functions simultaneously.

Length: 31.64 mm

Moderate length provides a balanced form factor for easy integration into various system designs.

No. of I/O Lines: 10

Adequate number of I/O lines for connecting external devices and interfaces, enhancing the versatility of the PLD.

Grading Of Temperature: COMMERCIAL EXTENDED

Commercial extended temperature grading ensures reliable operation in a wide range of temperature environments.

Technical Specifications

Programmable Logic Devices (PLD) TICPAL22V10Z-25CNT attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

11 Dedicated Inputs, 10 I/O

No. of Outputs:

10

Output Function:

Macrocell

No. of Inputs:

22

No. of Product Terms:

132

No. of Dedicated Inputs:

11

No. of I/O Lines:

10

Maximum Clock Frequency:

31.2 MHz

Propagation Delay:

25 ns

Technology:

CMOS

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP24,.3

Width:

7.62 mm

Length:

31.64 mm

Maximum Seated Height:

5.08 mm

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

24

Terminal Pitch:

2.54 mm

Terminal Finish:

Nickel Palladium Gold

Standards

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e4

Qualified:

No

Trade Compliance

TICPAL22V10Z-25CNT Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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