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TICPAL16R8-55CJ

Texas Instruments

TICPAL16R8-55CJ by Texas Instruments

TICPAL16R8-55CJ by Texas Instruments is a PAL-type PLD with 55ns propagation delay, CMOS technology, and 16 inputs. It operates at 5V, has 64 product terms, and supports a max clock frequency of 16MHz. Ideal for applications requiring fast logic processing in commercial temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,766 parts In-Stock

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Digiode

USA . 1,376 parts In-Stock

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AZTECH Wire

Italy . 757 parts In-Stock

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$12.768

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One Stop Electronics

USA . 1,047 parts In-Stock

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$13.000

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Parana Technologies

USA . 1,336 parts In-Stock

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DigiPath Technology Company

USA . 2,338 parts In-Stock

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$126.760

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$116.619

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ChromeModa Solutions

Germany . 4,229 parts In-Stock

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$129.347

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$106.065

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IDEA Electronic Components Group

UK . 2,354 parts In-Stock

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$129.347

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$122.880

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$116.412

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Corphita

USA . 1,723 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TICPAL16R8-55CJ by Texas Instruments. As a leader in Programmable Logic Devices, Texas Instruments delivers unrivaled quality and reliability. This versatile PLD boasts 16 inputs, 8 outputs, and a maximum clock frequency of 16 MHz, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this innovative device offers unmatched performance and value. Experience the difference with Texas Instruments and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent durability and resistance to heat, making this PLD suitable for a wide range of operating conditions.

Propagation Delay: 55 ns

With a fast propagation delay of 55 ns, this PLD can process signals quickly, making it ideal for high-speed applications.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making this PLD energy efficient and reliable.

No. of Inputs: 16

With 16 inputs, this PLD can accommodate a large number of signals, providing flexibility in designing complex logic circuits.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into circuit boards, optimizing space efficiency in electronic designs.

Form Of Terminal: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, ensuring stability and reliability in the PLD's connections to external components.

Architecture: PAL-TYPE

PAL-type architecture offers programmable AND/OR arrays, enabling versatile logic implementations tailored to specific application requirements.

Nominal Supply Voltage (V): 5

Operating at a nominal supply voltage of 5V, this PLD is compatible with standard voltage levels commonly used in electronic circuits.

Power Supplies (V): 5

Having a single 5V power supply simplifies the design and operation of the PLD, reducing complexity in power management.

No. of Terminals: 20

With 20 terminals, this PLD offers ample connectivity options for interfacing with other components, enhancing its versatility in system integration.

Package Style (Meter): IN-LINE

The in-line package style ensures easy handling and installation of the PLD on circuit boards, facilitating efficient assembly processes.

Output Function: REGISTERED

Featuring registered outputs, this PLD offers enhanced signal stability and reduced signal skew, supporting reliable data transmission in digital systems.

No. of Product Terms: 64

With 64 product terms, this PLD provides ample logical resources for implementing complex Boolean functions, enabling sophisticated logic operations.

Maximum Operating Temperature: 70 °C

Operating efficiently at temperatures up to 70°C, this PLD is suitable for applications exposed to elevated thermal conditions.

Pitch Of Terminal: 2.54 mm

The 2.54mm pitch of terminals facilitates standardized connections and compatibility with common electronic components, streamlining integration into circuit designs.

Minimum Operating Temperature: 0 °C

Capable of functioning at temperatures as low as 0°C, this PLD offers reliable performance across a wide range of operating environments.

Position Of Terminal: DUAL

Dual positioning of terminals enhances flexibility in PCB layouts, accommodating different mounting orientations and facilitating optimal signal routing.

Maximum Clock Frequency: 16 MHz

Supporting clock frequencies up to 16 MHz, this PLD enables rapid signal processing and high-speed data transfer rates in digital systems.

No. of Outputs: 8

With 8 outputs, this PLD can drive multiple components or signals simultaneously, enhancing the functionality and efficiency of the overall circuit design.

Grading Of Temperature: COMMERCIAL

Designed for commercial-grade temperature ranges, this PLD is suitable for a wide range of consumer electronics and industrial applications with standard operating conditions.

Technical Specifications

Programmable Logic Devices (PLD) TICPAL16R8-55CJ attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

No. of Outputs:

8

Output Function:

Registered

No. of Inputs:

16

No. of Product Terms:

64

Maximum Clock Frequency:

16 MHz

Propagation Delay:

55 ns

Technology:

CMOS

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-XDIP-T20

Qualified:

No

Trade Compliance

TICPAL16R8-55CJ Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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