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TICPAL22V10Z-25CFN

Texas Instruments

TICPAL22V10Z-25CFN by Texas Instruments

TICPAL22V10Z-25CFN by Texas Instruments is a PAL-TYPE PLD with 22 inputs, 10 I/O lines, and 132 product terms. It operates at a max clock frequency of 31.2 MHz and has a propagation delay of 25 ns. Ideal for applications requiring programmable logic in commercial extended temperature environments.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 5,348 parts In-Stock

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Digiode

USA . 2,934 parts In-Stock

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Bristol Electronics

USA . 339 parts In-Stock

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AZTECH Wire

Italy . 694 parts In-Stock

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$9.835

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One Stop Electronics

USA . 1,522 parts In-Stock

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$22.000

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Component Stockers USA

USA . 608 parts In-Stock

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$99.990

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Parana Technologies

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DigiPath Technology Company

USA . 850 parts In-Stock

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$162.659

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$149.647

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ChromeModa Solutions

Germany . 3,405 parts In-Stock

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$165.979

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$136.103

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IDEA Electronic Components Group

UK . 575 parts In-Stock

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$157.680

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$149.381

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QUARKTWIN TECHNOLOGY LTD

USA . 10,362 parts In-Stock

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Corphita

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Microchip USA

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Perfect Parts

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Assy Fe

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Overview

Unlock the power of programmable logic devices with the TICPAL22V10Z-25CFN by Texas Instruments. Crafted with precision and quality by a renowned manufacturer, this PLD offers unparalleled flexibility and performance for a wide range of applications. From enhancing automation systems to optimizing data processing, this versatile device delivers exceptional value and benefits to customers. Experience seamless integration, reliable functionality, and impressive speed with the TICPAL22V10Z-25CFN, setting new standards in programmable logic technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable for easy handling and long-term use.

Propagation Delay: 25 ns

The low propagation delay ensures fast response times, making the product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage tolerance provides flexibility in power supply options and helps prevent damage due to voltage spikes.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

No. of Inputs: 22

With a high number of inputs, the product can accommodate complex logic functions and versatile input configurations.

Package Shape: SQUARE

The square package shape allows for efficient use of space on circuit boards, enabling compact and organized designs.

Form Of Terminal: J BEND

J bend terminals provide secure connections and ensure reliable contact with other components, enhancing overall system stability.

Architecture: PAL-TYPE

The PAL-type architecture offers flexibility in programming and customization, making the product suitable for a wide range of applications.

Nominal Supply Voltage (V): 5

The nominal supply voltage of 5V is a common standard in many electronic systems, ensuring compatibility and easy integration with existing setups.

Power Supplies (V): 5

Having multiple power supplies at 5V provides redundancy and backup in case of power failures, ensuring continuous operation.

No. of Terminals: 28

The high number of terminals allows for versatile connectivity options and interface capabilities, making the product adaptable to various circuit configurations.

Programmable IC Type: OT PLD

Being an OT PLD (Output Macrocell type Programmable Logic Device) enables the product to perform complex logic functions with ease and versatility.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers excellent thermal performance and easy installation, making it ideal for applications where heat dissipation is crucial.

Output Function: MACROCELL

The macrocell output function provides high logic density and flexibility in defining logic equations, making the product suitable for complex digital designs.

No. of Product Terms: 132

With a high number of product terms, the product can implement a wide range of logic functions and support complex programming requirements.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures compatibility with a variety of power sources and helps optimize power efficiency during operation.

Maximum Operating Temperature: 75 °C

The high maximum operating temperature tolerance allows the product to withstand harsh environmental conditions and ensures reliable performance in demanding applications.

Pitch Of Terminal: 1.27 mm

The optimal terminal pitch of 1.27mm offers easy soldering and connection with other components, ensuring reliable electrical connections in the circuit.

Organization: 11 DEDICATED INPUTS, 10 I/O

The dedicated inputs and I/O lines provide a structured organization for input/output operations, simplifying the design and programming process.

No. of Dedicated Inputs: 11

Having dedicated inputs allows for specific signal processing and customization, enhancing the product's flexibility and performance in specialized applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature tolerance ensures reliable operation even in cold environments, making the product suitable for a wide range of temperature conditions.

Finishing Of Terminal Used: MATTE TIN

The use of matte tin finish on the terminals offers excellent solderability and corrosion resistance, ensuring long-term reliability in various operating conditions.

Position Of Terminal: QUAD

The quad terminal positioning provides stable and secure connections with other components, preventing signal loss and ensuring consistent performance.

Maximum Seated Height: 4.57 mm

The low maximum seated height allows for compact and slim designs, making the product suitable for space-constrained applications.

Width: 11.5062 mm

The compact width dimension enables easy integration into tight spaces on circuit boards, contributing to efficient and optimized system designs.

Maximum Clock Frequency: 31.2 MHz

The high maximum clock frequency allows for fast data processing and high-speed operation, making the product suitable for time-critical applications.

No. of Outputs: 10

With a sufficient number of outputs, the product can drive multiple devices and handle complex output configurations, enhancing its utility in diverse applications.

Maximum Time At Peak Reflow Temperature (s): 20

The specific time limit for peak reflow temperature ensures proper soldering and reflow processes, contributing to reliable and consistent performance.

Peak Reflow Temperature °C: 220

The high peak reflow temperature tolerance allows for efficient soldering and ensures durability and stability of the product during assembly processes.

Length: 11.5062 mm

The compact length dimension helps in saving space on circuit boards and enables efficient and organized layouts for optimized system designs.

No. of I/O Lines: 10

With a sufficient number of I/O lines, the product can handle complex input/output configurations and support versatile interfacing requirements in various applications.

Grading Of Temperature: COMMERCIAL EXTENDED

The commercial extended temperature grading ensures reliable operation across a wide temperature range, making the product suitable for commercial and industrial applications.

Technical Specifications

Programmable Logic Devices (PLD) TICPAL22V10Z-25CFN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

11 Dedicated Inputs, 10 I/O

No. of Outputs:

10

Output Function:

Macrocell

No. of Inputs:

22

No. of Product Terms:

132

No. of Dedicated Inputs:

11

No. of I/O Lines:

10

Maximum Clock Frequency:

31.2 MHz

Propagation Delay:

25 ns

Technology:

CMOS

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Peak Reflow Temperature:

220 °C (428 °F)

Moisture Sensitivity Level (MSL):

1

Maximum Time At Peak Reflow Temperature:

20 s

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC28,.5SQ

Width:

11.5062 mm

Length:

11.5062 mm

Maximum Seated Height:

4.57 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

28

Terminal Pitch:

1.27 mm

Terminal Finish:

Matte Tin

Standards

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Qualified:

No

Trade Compliance

TICPAL22V10Z-25CFN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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