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TICPAL18V8-25CJL

Texas Instruments

TICPAL18V8-25CJL by Texas Instruments

TICPAL18V8-25CJL by Texas Instruments is a UV PLD with 25 ns propagation delay, 5.25 V max supply voltage, and 35 MHz clock frequency. Ideal for PAL-type applications requiring 9 dedicated inputs, 8 I/O lines, and a total of 20 terminals in commercial extended temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,078 parts In-Stock

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Vyrian

USA . 3,051 parts In-Stock

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3,051

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Distributors (Availability)

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AZTECH Wire

Italy . 565 parts In-Stock

1+ parts

$9.829

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$9.829

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One Stop Electronics

USA . 543 parts In-Stock

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$20.000

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543

$20.000

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Parana Technologies

USA . 1,831 parts In-Stock

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$26.226

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$26.821

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1,831

$26.226

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$26.821

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DigiPath Technology Company

USA . 799 parts In-Stock

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$28.878

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$26.567

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799

$28.878

$26.567

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IDEA Electronic Components Group

UK . 1,209 parts In-Stock

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$29.467

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$27.994

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$26.520

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$29.467

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$26.520

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ChromeModa Solutions

Germany . 91 parts In-Stock

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$29.467

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$24.163

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Corphita

USA . 1,031 parts In-Stock

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Overview

Unlock the power of programmable logic with the TICPAL18V8-25CJL by Texas Instruments. Crafted with precision and expertise, this PAL-type PLD offers lightning-fast 25ns propagation delay and versatile applications in various industries. With 18 inputs, 8 I/O lines, and a maximum clock frequency of 35MHz, this UV PLD delivers unmatched performance and flexibility. Whether you're designing consumer electronics or industrial automation systems, the TICPAL18V8-25CJL provides the reliability and efficiency you need to bring your projects to life. Trust in Texas Instruments for quality, innovation, and excellence.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides high durability and reliability to the device, making it suitable for harsh environments.

Propagation Delay: 25 ns

Offers fast signal processing, ensuring quick response times in applications.

Maximum Supply Voltage: 5.25 V

Allows for a wider operating voltage range, providing flexibility in power supply options.

Technology Used: CMOS

Utilizes low power consumption and high noise immunity characteristics, enhancing overall efficiency.

No. of Inputs: 18

Provides ample input options for complex logic functions and versatile programming capabilities.

Architecture: PAL-TYPE

Utilizes programmable AND/OR arrays for customizable logic implementation, offering versatility in design.

Output Function: MACROCELL

Features individual programmable output cells, allowing for diverse output configurations and functions.

Maximum Clock Frequency: 35 MHz

Supports high-speed operation, enabling rapid data processing and system performance.

No. of Outputs: 8

Provides multiple output channels for various control and signal routing requirements.

Technical Specifications

Programmable Logic Devices (PLD) TICPAL18V8-25CJL attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

9 Dedicated Inputs, 8 I/O

No. of Outputs:

8

Output Function:

Macrocell

No. of Inputs:

18

No. of Product Terms:

74

No. of Dedicated Inputs:

9

No. of I/O Lines:

8

Maximum Clock Frequency:

35 MHz

Propagation Delay:

25 ns

Technology:

CMOS

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

PAL with Macrocells; 8 Macrocells; 1 External Clock; Shared Input/Clock

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-GDIP-T20

Qualified:

No

Trade Compliance

TICPAL18V8-25CJL Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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