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TICPAL16R4-55CJ

Texas Instruments

TICPAL16R4-55CJ by Texas Instruments

TICPAL16R4-55CJ by Texas Instruments is a PAL-type PLD with 55ns propagation delay, CMOS technology, and 16 inputs. It operates at 5V, has 64 product terms, and supports a max clock frequency of 16MHz. Ideal for applications requiring registered output functions in commercial temperature environments.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 6,621 parts In-Stock

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Digiode

USA . 2,443 parts In-Stock

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AZTECH Wire

Italy . 196 parts In-Stock

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$12.404

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One Stop Electronics

USA . 1,470 parts In-Stock

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Parana Technologies

USA . 335 parts In-Stock

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$157.521

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$14,628.224

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$141.769

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335

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$141.769

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DigiPath Technology Company

USA . 2,123 parts In-Stock

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$173.450

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ChromeModa Solutions

Germany . 2,169 parts In-Stock

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$145.132

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IDEA Electronic Components Group

UK . 495 parts In-Stock

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$176.990

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$168.140

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$159.291

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Corphita

USA . 1,314 parts In-Stock

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Overview

Unlock the potential of your electronic projects with the TICPAL16R4-55CJ from Texas Instruments. As a leader in manufacturing high-quality Programmable Logic Devices (PLD), Texas Instruments delivers cutting-edge technology with a CMOS architecture and 55 ns propagation delay. With 16 inputs, 4 outputs, and 64 product terms, this device offers unparalleled versatility for a wide range of applications. Whether you're designing consumer electronics, industrial automation systems, or telecommunications equipment, the TICPAL16R4-55CJ provides reliable performance and flexibility to bring your ideas to life. Trust Texas Instruments for top-notch quality and innovation in every project.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body material provides excellent thermal conductivity and mechanical strength, ensuring durability and reliability for the PLD.

Propagation Delay: 55 ns

Low propagation delay of 55 ns allows for fast signal processing and response times in the PLD.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the PLD energy-efficient and reliable.

No. of Inputs: 16

Having 16 inputs allows for flexibility in connecting various input signals, enhancing the versatility of the PLD.

Package Shape: RECTANGULAR

Rectangular package shape provides a compact and space-saving design for easy integration into electronic systems.

Form Of Terminal: THROUGH-HOLE

Through-hole terminals offer strong mechanical connections, enhancing the durability and reliability of the PLD in different applications.

Architecture: PAL-TYPE

PAL-type architecture provides programmable array logic, allowing for versatile customization of logic functions in the PLD.

Nominal Supply Voltage (V): 5

Operating at a nominal supply voltage of 5V is standard and widely compatible with many electronic systems, making integration easier.

Power Supplies (V): 5

Having a power supply of 5V ensures consistent and reliable performance of the PLD in various operating conditions.

No. of Terminals: 20

With 20 terminals, the PLD offers ample connectivity options for input and output devices, enabling versatile functionality.

Package Style (Meter): IN-LINE

In-line package style enables easy installation and maintenance of the PLD in electronic systems for efficient operation.

Output Function: REGISTERED

Registered output function ensures data stability and integrity, making the PLD suitable for applications requiring reliable data processing.

No. of Product Terms: 64

Having 64 product terms allows for complex logic functions and operations to be programmed, expanding the capabilities of the PLD.

Maximum Operating Temperature: 70 °C

Operating at a maximum temperature of 70°C ensures reliable performance in varying environmental conditions without overheating.

Pitch Of Terminal: 2.54 mm

Having a terminal pitch of 2.54 mm allows for easy connections and compatibility with standard electronic components, facilitating integration.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0°C ensures reliable functionality even in cold environments without risking performance issues.

Position Of Terminal: DUAL

Dual terminal positioning provides redundancy and improved connectivity options, enhancing the overall reliability of the PLD.

Maximum Clock Frequency: 16 MHz

With a maximum clock frequency of 16 MHz, the PLD can process signals and data at high speeds, suitable for time-sensitive applications.

No. of Outputs: 4

Having 4 outputs allows for multiple data streams or control signals to be generated, increasing the versatility and functionality of the PLD.

Grading Of Temperature: COMMERCIAL

Commercial temperature grading ensures that the PLD is suitable for a wide range of commercial electronic applications, providing reliability and performance.

Technical Specifications

Programmable Logic Devices (PLD) TICPAL16R4-55CJ attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

No. of Outputs:

4

Output Function:

Registered

No. of Inputs:

16

No. of Product Terms:

64

Maximum Clock Frequency:

16 MHz

Propagation Delay:

55 ns

Technology:

CMOS

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-XDIP-T20

Qualified:

No

Trade Compliance

TICPAL16R4-55CJ Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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