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TICPAL22V10CJL

Texas Instruments

TICPAL22V10CJL by Texas Instruments

TICPAL22V10CJL by Texas Instruments is a UV PLD with 132 product terms, 22 inputs, and 10 I/O lines. It operates at a voltage range of 4.75V to 5.25V and has an operating temperature range of 0°C to 75°C. Ideal for PAL-type applications requiring macrocell output functions in commercial extended environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,797 parts In-Stock

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3,797

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Digiode

USA . 3,371 parts In-Stock

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3,371

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 548 parts In-Stock

1+ parts

$19.269

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548

$19.269

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One Stop Electronics

USA . 1,625 parts In-Stock

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$21.000

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1,625

$21.000

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Parana Technologies

USA . 995 parts In-Stock

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$157.997

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995

$157.997

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DigiPath Technology Company

USA . 167 parts In-Stock

1+ parts

$173.974

100+ parts

$160.057

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167

$173.974

$160.057

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IDEA Electronic Components Group

UK . 2,016 parts In-Stock

1+ parts

$177.525

100+ parts

$168.649

1k+ parts

$159.772

10k+ parts

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2,016

$177.525

$168.649

$159.772

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ChromeModa Solutions

Germany . 940 parts In-Stock

1+ parts

$177.525

100+ parts

$145.570

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940

$177.525

$145.570

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Corphita

USA . 4,902 parts In-Stock

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4,902

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Overview

Unlock endless possibilities with the TICPAL22V10CJL by Texas Instruments, a top-tier manufacturer known for excellence in programmable logic devices. This cutting-edge technology offers unparalleled flexibility and efficiency for a wide range of applications. With its advanced architecture and high-quality materials, this UV PLD delivers reliable performance and optimal functionality. Experience seamless integration and enhanced productivity with the TICPAL22V10CJL, setting new standards in the world of programmable logic devices.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This durable and reliable material ensures the PLD protection against external environmental factors, making it a long-lasting choice.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage allows for flexibility in power supply options and can handle variations without risking damage.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the PLD efficient and reliable for various applications.

No. of Inputs: 22

With a high number of inputs, the PLD can handle complex logic functions and provide versatile programmable options.

Architecture: PAL-TYPE

PAL-type architecture offers programmable AND and OR arrays, providing flexibility in designing various logic functions.

No. of Outputs: 10

Having multiple outputs allows for the PLD to drive multiple components or signals, making it suitable for diverse applications.

Maximum Operating Temperature: 75 °C

With a high maximum operating temperature, the PLD can operate efficiently even in demanding environments without overheating issues.

Technical Specifications

Programmable Logic Devices (PLD) TICPAL22V10CJL attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

11 Dedicated Inputs, 10 I/O

No. of Outputs:

10

Output Function:

Macrocell

No. of Inputs:

22

No. of Product Terms:

132

No. of Dedicated Inputs:

11

No. of I/O Lines:

10

Technology:

CMOS

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

Shared Input/Clock

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP24(UNSPEC)

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

24

Standards

JESD-30 Code:

R-GDIP-T24

Qualified:

No

Trade Compliance

TICPAL22V10CJL Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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