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TICPAL18V8-30MJL

Texas Instruments

TICPAL18V8-30MJL by Texas Instruments

TICPAL18V8-30MJL by Texas Instruments is a CMOS UV PLD with 30ns propagation delay, 5.5V max supply voltage, and 35MHz clock frequency. Ideal for military applications due to MIL grading, it features 9 dedicated inputs, 8 I/O lines, and a total of 20 terminals in a rectangular package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,933 parts In-Stock

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Digiode

USA . 1,362 parts In-Stock

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AZTECH Wire

Italy . 471 parts In-Stock

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$15.659

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One Stop Electronics

USA . 1,332 parts In-Stock

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$21.000

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Parana Technologies

USA . 2,154 parts In-Stock

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DigiPath Technology Company

USA . 1,569 parts In-Stock

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$146.465

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$134.748

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ChromeModa Solutions

Germany . 6,290 parts In-Stock

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$149.454

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$122.552

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IDEA Electronic Components Group

UK . 66 parts In-Stock

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$149.454

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$141.981

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$134.509

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66

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Corphita

USA . 993 parts In-Stock

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Overview

Unlock the power of innovative technology with the TICPAL18V8-30MJL by Texas Instruments. This top-tier Programmable Logic Device offers unmatched quality and reliability, making it a standout choice in the industry. Ideal for a wide range of applications, this PLD boasts an impressive array of features without compromising on performance. Experience seamless functionality, enhanced efficiency, and superior results with this cutting-edge product. Elevate your projects with the TICPAL18V8-30MJL and discover the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring a longer lifespan.

Propagation Delay: 30 ns

Fast propagation delay allows for quick processing of signals in the device.

Maximum Supply Voltage: 5.5 V

High maximum supply voltage ensures compatibility with a wide range of circuit configurations.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity.

No. of Inputs: 18

Ample number of inputs for versatile connectivity options in the device.

Package Shape: RECTANGULAR

Compact rectangular shape for efficient PCB layout and space-saving design.

Form Of Terminal: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections on the PCB.

Nominal Supply Voltage (V): 5

Stable nominal supply voltage for consistent performance of the device.

Power Supplies (V): 5

Consistent power supply for reliable operation.

No. of Terminals: 20

Adequate number of terminals for various connectivity requirements.

Programmable IC Type: UV PLD

Programmable device allows for flexible customization of logic functions.

Package Style (Meter): IN-LINE

Inline package style for easy integration into circuit layouts.

Output Function: MACROCELL

Macrocell output function for versatile signal processing capabilities.

No. of Product Terms: 74

Large number of product terms for complex logic operations.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage for efficient power utilization.

Maximum Operating Temperature: 125 °C

High maximum operating temperature for reliable performance in challenging environments.

Pitch Of Terminal: 2.54 mm

Standard terminal pitch for easy PCB assembly.

Organization: 9 DEDICATED INPUTS, 8 I/O

Well-organized input and output structure for clear signal routing.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature for use in extreme cold conditions.

Position Of Terminal: DUAL

Dual position terminals for added flexibility in connection options.

Maximum Clock Frequency: 35 MHz

High maximum clock frequency for fast processing of logic operations.

No. of Outputs: 8

Sufficient number of outputs for diverse signal routing requirements.

No. of I/O Lines: 8

Adequate I/O lines for bidirectional communication between the device and external components.

Grading Of Temperature: MILITARY

Military-grade temperature grading for robust performance in harsh conditions.

Technical Specifications

Programmable Logic Devices (PLD) TICPAL18V8-30MJL attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

9 Dedicated Inputs, 8 I/O

No. of Outputs:

8

Output Function:

Macrocell

No. of Inputs:

18

No. of Product Terms:

74

No. of Dedicated Inputs:

9

No. of I/O Lines:

8

Maximum Clock Frequency:

35 MHz

Propagation Delay:

30 ns

Technology:

CMOS

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

PAL with Macrocells; 8 Macrocells; 1 External Clock; Shared Input/Clock

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-GDIP-T20

Qualified:

No

Trade Compliance

TICPAL18V8-30MJL Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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