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TICPAL16R6-55CJL

Texas Instruments

TICPAL16R6-55CJL by Texas Instruments

TICPAL16R6-55CJL by Texas Instruments is a UV PLD with 55ns propagation delay, 5.25V max supply voltage, and 16MHz clock frequency. Ideal for PAL-type applications requiring mixed output functions, it features 8 dedicated inputs and 2 I/O lines in a ceramic package with through-hole terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 5,433 parts In-Stock

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Digiode

USA . 1,676 parts In-Stock

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Mentor Electronics Marketing, LLC

USA . 38 parts In-Stock

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Prism Electronics

USA . 10 parts In-Stock

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ABC Electronics Ltd.

UK . 9 parts In-Stock

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Freelance Electronics

USA . 2 parts In-Stock

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AZTECH Wire

Italy . 337 parts In-Stock

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$8.276

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One Stop Electronics

USA . 623 parts In-Stock

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$25.000

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Parana Technologies

USA . 1,530 parts In-Stock

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$156.560

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DigiPath Technology Company

USA . 744 parts In-Stock

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$172.392

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$158.600

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ChromeModa Solutions

Germany . 4,809 parts In-Stock

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$175.910

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$144.246

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IDEA Electronic Components Group

UK . 1,047 parts In-Stock

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$175.910

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$167.114

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$158.319

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Corphita

USA . 2,656 parts In-Stock

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Overview

Elevate your electronic designs with the TICPAL16R6-55CJL programmable logic device by Texas Instruments. Crafted with precision and expertise, this PLD offers unrivaled performance and reliability in a wide range of applications. With its advanced technology and versatile architecture, this UV PLD provides customers with the flexibility and functionality needed to bring their projects to life. Experience the quality and innovation that Texas Instruments is known for and take your designs to the next level with the TICPAL16R6-55CJL.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring the product's reliability and longevity.

Propagation Delay: 55 ns

Fast propagation delay allows for quick processing of input signals and efficient operation.

Maximum Supply Voltage: 5.25 V

Can handle higher supply voltages, offering flexibility in power source options.

Technology Used: CMOS

CMOS technology ensures low power consumption and high speed performance.

No. of Inputs: 16

Ample number of inputs for versatile connectivity and programmability.

Nominal Supply Voltage (V): 5

Standard nominal supply voltage for compatibility with common power sources.

Maximum Clock Frequency: 16 MHz

High clock frequency enables rapid processing and execution of logic functions.

No. of Outputs: 6

Multiple output options for versatile application possibilities.

Grading Of Temperature: COMMERCIAL EXTENDED

Wide temperature range compatibility for reliable performance in various operating conditions.

Technical Specifications

Programmable Logic Devices (PLD) TICPAL16R6-55CJL attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

8 Dedicated Inputs, 2 I/O

No. of Outputs:

6

Output Function:

Mixed

No. of Inputs:

16

No. of Product Terms:

64

No. of Dedicated Inputs:

8

No. of I/O Lines:

2

Maximum Clock Frequency:

16 MHz

Propagation Delay:

55 ns

Technology:

CMOS

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

Register Preload

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-GDIP-T20

Qualified:

No

Trade Compliance

TICPAL16R6-55CJL Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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