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TICPAL16R8-55CN

Texas Instruments

TICPAL16R8-55CN by Texas Instruments

TICPAL16R8-55CN by Texas Instruments is a PAL-TYPE PLD with 25ns propagation delay, 5.25V max supply voltage, and CMOS technology. Ideal for applications requiring 16MHz clock frequency, it features 64 product terms, 8 dedicated inputs/outputs in a rectangular package with through-hole terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,765 parts In-Stock

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Digiode

USA . 3,554 parts In-Stock

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3,554

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Distributors (Availability)

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AZTECH Wire

Italy . 322 parts In-Stock

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$13.182

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$13.182

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One Stop Electronics

USA . 1,221 parts In-Stock

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$33.000

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Parana Technologies

USA . 205 parts In-Stock

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$40.232

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DigiPath Technology Company

USA . 1,616 parts In-Stock

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$44.300

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$40.756

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ChromeModa Solutions

Germany . 4,400 parts In-Stock

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$45.204

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$37.067

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$45.204

$37.067

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IDEA Electronic Components Group

UK . 698 parts In-Stock

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$45.204

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$42.944

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$40.684

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698

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Corphita

USA . 2,224 parts In-Stock

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Overview

Enhance your electronic designs with the TICPAL16R8-55CN by Texas Instruments, a high-quality Programmable Logic Device that offers unparalleled reliability and performance. With Texas Instrument's reputation for excellence in manufacturing, you can trust that this PLD will meet your needs with ease. Perfect for a wide range of applications, from industrial automation to consumer electronics, this versatile device provides value and flexibility to customers looking to optimize their projects. Upgrade your designs today with the TICPAL16R8-55CN and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the device, ensuring reliability in various operating conditions.

Propagation Delay: 25 ns

The low propagation delay indicates fast processing speed, making this PLD suitable for applications requiring quick response times.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage tolerance allows for flexibility in power supply options and enhances compatibility with different systems.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making this PLD energy-efficient and reliable in noisy environments.

No. of Inputs: 16

The ample number of inputs enables the device to handle complex logic functions and support various input signals, enhancing its versatility.

Package Shape: RECTANGULAR

The rectangular package shape provides ease of handling and integration into electronic circuits, optimizing space utilization.

Form Of Terminal: THROUGH-HOLE

Through-hole terminals offer robust connections that are less prone to damage, ensuring secure installation and long-term performance stability.

Architecture: PAL-TYPE

The PAL-type architecture offers programmable logic functions with predictable output, facilitating customization and efficient logic implementation.

Nominal Supply Voltage (V): 5

The nominal supply voltage of 5V ensures compatibility with standard power sources, simplifying integration into existing electronic systems.

Power Supplies (V): 5

Consistent power supplies at 5V support stable operations and reliable functionality, reducing the risk of voltage-related issues.

No. of Terminals: 20

The adequate number of terminals enables easy connections and interfaces, facilitating effortless integration into various circuit layouts.

Programmable IC Type: OT PLD

Being an Output Registered Programmable Logic Device, this PLD offers enhanced output stability and control, ensuring precise logic operations.

Package Style (Meter): IN-LINE

The in-line package style allows for space-efficient placement on a circuit board, optimizing layout design and enhancing overall system compactness.

Output Function: REGISTERED

The registered output function ensures synchronized and stable output signals, reducing the likelihood of signal errors and improving system reliability.

No. of Product Terms: 64

The high number of product terms offers extensive logic expression possibilities, enabling complex logic functions to be implemented efficiently.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage requirement allows for operation in scenarios with slight voltage fluctuations, ensuring reliable performance under varying conditions.

Maximum Operating Temperature: 75 °C

With a high maximum operating temperature tolerance, this PLD can withstand elevated temperatures without compromising its functionality, suitable for demanding environments.

Pitch Of Terminal: 2.54 mm

The standard pitch of 2.54mm between terminals facilitates compatibility with common connectors and sockets, simplifying installation and connections.

Organization: 8 DEDICATED INPUTS, 0 I/O

The organization with dedicated inputs allows for focused input processing, enhancing logic implementation and reducing potential interference.

No. of Dedicated Inputs: 8

The dedicated inputs cater to specific input requirements, offering focused processing and enabling efficient logic operations in dedicated input scenarios.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature threshold ensures reliable performance even in cold environments, expanding the range of applications for this PLD.

Position Of Terminal: DUAL

The dual terminal configuration offers redundancy in connections, enhancing reliability and ensuring secure connections for uninterrupted operations.

Maximum Seated Height: 5.08 mm

With a low maximum seated height, this PLD can be accommodated in compact spaces or near other components, optimizing board layout design.

Width: 7.62 mm

The narrow width of 7.62mm provides space-saving advantages, allowing for efficient component placement and enhancing overall system compactness.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency of 16MHz enables rapid data processing and execution of logic functions, making this PLD suitable for high-speed applications.

No. of Outputs: 8

The eight outputs provide flexibility in routing and handling output signals, enabling versatile logic operations and diverse signal processing capabilities.

Length: 24.325 mm

The moderate length of 24.325mm offers a balance between compactness and connectivity, allowing for efficient placement and connection within circuit layouts.

Grading Of Temperature: COMMERCIAL EXTENDED

The commercial extended temperature grading ensures reliable performance across a broad temperature range, making this PLD suitable for commercial applications with varying temperature conditions.

Technical Specifications

Programmable Logic Devices (PLD) TICPAL16R8-55CN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

8 Dedicated Inputs, 0 I/O

No. of Outputs:

8

Output Function:

Registered

No. of Inputs:

16

No. of Product Terms:

64

No. of Dedicated Inputs:

8

No. of I/O Lines:

0

Maximum Clock Frequency:

16 MHz

Propagation Delay:

25 ns

Technology:

CMOS

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

Register Preload

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Width:

7.62 mm

Length:

24.325 mm

Maximum Seated Height:

5.08 mm

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-PDIP-T20

Qualified:

No

Trade Compliance

TICPAL16R8-55CN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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