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TICPAL22V10Z-25CJTL

Texas Instruments

TICPAL22V10Z-25CJTL by Texas Instruments

TICPAL22V10Z-25CJTL by Texas Instruments is a UV PLD with 132 product terms, 25 ns propagation delay, and 31.2 MHz clock frequency. Ideal for PAL-TYPE applications requiring 11 dedicated inputs and 10 I/O lines in commercial extended temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,921 parts In-Stock

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Digiode

USA . 1,443 parts In-Stock

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AZTECH Wire

Italy . 521 parts In-Stock

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$5.629

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$5.629

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One Stop Electronics

USA . 594 parts In-Stock

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$11.000

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Parana Technologies

USA . 503 parts In-Stock

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$63.502

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DigiPath Technology Company

USA . 1,257 parts In-Stock

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$69.923

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$64.329

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$69.923

$64.329

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ChromeModa Solutions

Germany . 5,517 parts In-Stock

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$71.350

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$58.507

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$71.350

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IDEA Electronic Components Group

UK . 1,049 parts In-Stock

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$71.350

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$67.782

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$64.215

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1,049

$71.350

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Corphita

USA . 4,029 parts In-Stock

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Assy Fe

Spain . 6 parts In-Stock

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Overview

Unlock the power of advanced technology with the TICPAL22V10Z-25CJTL from Texas Instruments. As a leader in programmable logic devices, Texas Instruments delivers unparalleled quality and reliability. Ideal for a wide range of applications, this UV PLD offers 132 product terms and 10 I/O lines, making it a versatile solution for your project needs. With a maximum clock frequency of 31.2 MHz and a propagation delay of just 25 ns, this PAL-type device provides fast and efficient performance. Trust Texas Instruments to provide innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides good thermal conductivity and protection against moisture and contaminants, ensuring the durability and reliability of the product.

Propagation Delay: 25 ns

The low propagation delay allows for fast signal processing, making this product suitable for applications requiring quick response times.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this product can handle various power requirements, making it versatile for different applications.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy environments.

No. of Inputs: 22

Having a high number of inputs provides flexibility in designing complex logic circuits, making this product suitable for applications that require multiple input signals.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into circuit boards, optimizing space and efficiency in the overall system design.

Form Of Terminal: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, making this product reliable in harsh operating conditions where vibration or mechanical stress may be present.

No. of Outputs: 10

The high number of outputs allows for versatile output configurations, making this product suitable for a wide range of applications requiring multiple output signals.

Technical Specifications

Programmable Logic Devices (PLD) TICPAL22V10Z-25CJTL attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

11 Dedicated Inputs, 10 I/O

No. of Outputs:

10

Output Function:

Macrocell

No. of Inputs:

22

No. of Product Terms:

132

No. of Dedicated Inputs:

11

No. of I/O Lines:

10

Maximum Clock Frequency:

31.2 MHz

Propagation Delay:

25 ns

Technology:

CMOS

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP24,.3

Width:

7.62 mm

Length:

32.005 mm

Maximum Seated Height:

5.08 mm

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

24

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-GDIP-T24

Qualified:

No

Trade Compliance

TICPAL22V10Z-25CJTL Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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