Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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Intel's EPF10K200SRC240-3 is a PLD with 9984 logic cells, 0.8 ns propagation delay, and 182 inputs/outputs. It operates at 2.5V with CMOS technology, suitable for applications requiring fast processing speeds and high I/O capabilities in commercial-grade environments.
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PLASTIC/EPOXY material provides good durability and protection for the internal components of the device.
Low propagation delay ensures fast processing speed and efficient operation of the device.
Large number of logic cells allow for complex logic functions to be programmed and executed effectively.
Surface mount capability makes it easy to integrate the device onto a printed circuit board, saving space and improving assembly efficiency.
Suitable maximum supply voltage for stable and reliable operation of the device within specified limits.
CMOS technology offers low power consumption and high noise immunity, making the device energy-efficient and reliable.
Multiple input options allow for versatile connectivity and input sources to drive the logic functions of the device.
Square package shape allows for efficient use of space and easy alignment during assembly.
Gull wing terminals provide secure and reliable connections for the device, ensuring proper electrical contact.
Stable nominal supply voltage for consistent performance and reliable operation of the device.
Support for multiple power supplies allows for flexible power options depending on the application requirements.
Ample number of terminals provide extensive connectivity options for interfacing with external devices and circuits.
Loadable PLD allows for easy reconfiguration of logic functions, enabling flexibility and adaptability in the device's use.
Flatpack style with fine pitch offers space-saving design and high-density packaging for efficient board layout.
Mixed output function allows for diverse output options such as digital signals, analog signals, or a combination of both.
Sufficient minimum supply voltage for stable operation and preventing under-voltage conditions that can lead to malfunctions.
Wide operating temperature range ensures the device can perform reliably in various environmental conditions.
Small terminal pitch enables high-density packaging and precise alignment for reliable connections.
Well-organized input/output configuration allows for efficient signal routing and connectivity.
Low minimum operating temperature threshold ensures the device can function in colder environments without issues.
Tin lead terminal finishing provides good solderability and corrosion resistance for long-term reliability.
Quad terminal positioning allows for efficient routing of signals and connections on the device.
Moisture sensitivity level of 3 indicates the device can withstand moderate exposure to moisture during handling and assembly.
Low maximum seated height enables compact design and easy integration into tight spaces or stacked configurations.
Compact width dimension allows for space-saving installation and efficient board layout.
Multiple output options provide flexibility in driving external devices and achieving desired logic results.
Balanced length dimension for square package shape ensures uniform size and consistent board layout design.
Plenty of input/output lines offer versatile connectivity options for interfacing with external devices and systems.
Commercial temperature grading ensures the device is suitable for standard operating conditions in commercial applications.
Programmable Logic Devices (PLD) EPF10K200SRC240-3 attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Intel
Programmable IC Type:
Organization:
No. of Outputs:
Output Function:
No. of Inputs:
No. of Logic Cells:
No. of I/O Lines:
Propagation Delay:
Technology:
Sub-Category:
Nominal Supply Voltage:
Minimum Supply Voltage:
Maximum Supply Voltage:
Power Supplies (V):
Maximum Operating Temperature:
Minimum Operating Temperature:
Temprature Grade:
Moisture Sensitivity Level (MSL):
Package Body Material:
Package Style (Meter):
Package Code:
Package Shape:
Package Equivalence Code:
Width:
Length:
Maximum Seated Height:
Terminal Position:
Terminal Form:
No. of Terminals:
Terminal Pitch:
Terminal Finish:
JESD-30 Code:
JESD-609 Code:
Qualified:
EPF10K200SRC240-3 Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
BSS138W-7-F
Multicomp Pro
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Transistor Element Material: SILICON; No. of Elements: 1;
1N4148WT
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CM
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; Package Body Material: PLASTIC/EPOXY; JEDEC-95 Code: TO-236AB;
SMBJ18CA
Sangdest Microelectronics (Nanjing)
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MMBT3904LT1G
MMBT3904LT1G by Onsemi is a NPN BJT with max. collector-emitter voltage of 40V, hFE of 30, and fT of 300MHz. Ideal for small signal applications in electronics due to its compact size, high transition frequency, and low power dissipation capabilities.
2N2222A
Silicon Transistor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
NE555D
Fairchild Semiconductor
Central Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Transistor Application: SWITCHING; Transistor Element Material: SILICON;
LM107H
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
NE555/D
General Electric Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Technology: BIPOLAR; Package Equivalence Code: DIE OR CHIP; Qualification: Not Qualified;
LL4148
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
ROHM
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
IRLML6401TRPBF
Infineon Technologies
IRLML6401TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 12V DS Breakdown Voltage, 34A IDM, and 0.05ohm RDS(on). With a small outline package style, it operates in an ambient temperature range of -55 to 150 °C.
Silicon Standard
Micronas Semiconductor Holding Ag
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .2 A; Maximum Forward Voltage (VF): 1.2 V;
LM78L05ACMX/NOPB
Texas Instruments
LM78L05ACMX/NOPB by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 0.1A. It operates b/w 0-125°C, has a dropout voltage of 1.6V, and can handle input voltages up to 30V making it ideal for various electronic applications requiring stable power supply.
BAV99
Lite-on Technology
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 175 Cel; Maximum Output Current: .1 A; Maximum Reverse Recovery Time: .006 us;
NXP Semiconductors
SQUARE; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
0460-202-16141
TE Connectivity
TE Connectivity's 0460-202-16141 contact features a crimp terminal type, machined contact design, and rated AC voltage of 1500V. With a wire gauge range of 20-16 AWG, it is ideal for applications requiring a male round pin-socket contact style in assembly products.
M4A5-64/32-12VNI
Lattice Semiconductor
M4A5-64/32-12VNI by Lattice Semiconductor is a 5.5V PLD with 64 macro cells, 34 inputs, and 32 I/O lines. It features a propagation delay of 12ns, operates at up to 52.6MHz clock frequency, and is ideal for industrial applications requiring in-system programmability and PAL-type architecture.
GAL16V8D-15LPNI
GAL16V8D-15LPNI by Lattice Semiconductor is a 5.5V CMOS PLD with 15ns propagation delay, ideal for industrial applications. Featuring 18 inputs, 8 dedicated inputs, and 8 I/O lines, it offers a clock frequency of up to 45.5MHz in a rectangular package with through-hole terminals.
EPM1270T144C5N
Altera
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XC2C256-7VQ100I
Xilinx
XC2C256-7VQ100I by Xilinx is a 256 macrocell PLA-type FLASH PLD with 80 I/O lines, operating at max 108 MHz clock frequency. It features 7.5 ns propagation delay and can be in-system programmed. Ideal for industrial applications requiring high-speed processing and versatile I/O capabilities.
EPM1270T144I5N
Intel
The Intel EPM1270T144I5N is a FLASH PLD with 980 macro cells, 116 inputs/outputs, and 10ns propagation delay. Ideal for applications requiring in-system programmability, it operates at temperatures from -40 to 100°C and supports JTAG boundary scan testing.
ATF22V10CQZ-20SU
Atmel
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;
EPF10K100EQC240-3N
Intel's EPF10K100EQC240-3N is a PLD with 4992 logic cells, 0.7 ns propagation delay, and 189 I/O lines. It operates at max clock frequency of 140 MHz and is suitable for applications requiring high-speed data processing in commercial-grade environments. The device features a square package shape, GULL WING terminals, and matte tin finishing for enhanced performance.
LC4384V-10TN176I
LC4384V-10TN176I by Lattice Semiconductor is a 384 macrocell EE PLD with 132 inputs, 128 I/O lines, and 10 ns propagation delay. Ideal for applications requiring in-system programmability, it features a max clock frequency of 86 MHz and operates b/w -40 to 105°C.
XCR3032XL-7CSG48I
Xilinx XCR3032XL-7CSG48I is a 32 macrocell EE PLD with 7.5ns propagation delay, operating at max clock frequency of 119MHz. Ideal for industrial applications, it features in-system programmability and JTAG boundary scan test capability.
ATF22V10CQZ-20PI
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;
ATF22V10CQZ-20JC
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;
EPF6024AQC240-2N
Intel's EPF6024AQC240-2N is a PLD with 1960 logic cells, 199 inputs/outputs, and 153 MHz clock frequency. It operates at 3.3V, CMOS technology, suitable for applications requiring high-speed processing in compact designs like consumer electronics or industrial control systems.
XCR3128XL-10VQG100I
Xilinx XCR3128XL-10VQG100I is a 128 macrocell EE PLD with 84 I/O lines. It operates at max clock frequency of 95 MHz, with propagation delay of 10 ns. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing.
SLG46826G
Renesas Electronics
SLG46826G by Renesas Electronics is a 19 macrocell PLA-type OT PLD with 13 inputs and 15 outputs. It operates b/w -40 to 85 °C, has a supply voltage range of 2.3-5.5 V, and comes in a small outline package for applications requiring programmable logic solutions.
5M160ZT100C5N
The Altera 5M160ZT100C5N is a programmable logic device with 128 macro cells and a maximum clock frequency of 118.3 MHz. It has a propagation delay of 14 ns and operates at a nominal supply voltage of 1.8V. This device is surface mountable, in-system programmable, and features JTAG boundary scan test. It is commonly used for applications requiring high-speed and versatile programmable logic solutions.
XC2C64A-7CPG56I
XC2C64A-7CPG56I by Xilinx is a 64 macrocell FLASH PLD with 7.5 ns propagation delay, operating at 200 MHz clock frequency. Ideal for industrial applications, it features in-system programmability and JTAG boundary scan test capability, with a package style of grid array and low profile design.
EPM7128STC100-15N
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;
PEEL18CV8P-15
Ami Semiconductor
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
XC9572XL-10CSG48C
Xilinx XC9572XL-10CSG48C is a 3.6V PLD with 72 macro cells, 38 I/O lines, and 100MHz clock frequency. Ideal for applications requiring fast propagation delay of 10ns, such as flash PLD-based systems needing in-system programmability and JTAG boundary scan testing.
ATF1502ASV-15JU44
Microchip Technology
Microchip Technology's ATF1502ASV-15JU44 is a 32 macrocell EE PLD with 15 ns propagation delay and 100 MHz max clock frequency. Ideal for industrial applications, it features in-system programmability, JTAG boundary scan test, and operates b/w -40 to 85 °C.
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EPF10K10TI144-4N
The EPF10K10TI144-4N by Altera is a programmable logic device with 576 logic cells, propagation delay of 0.6 ns, and CMOS technology. It has 102 inputs and outputs, a maximum supply voltage of 5.25 V, and is surface mountable. This PLD is suitable for industrial applications.
EPF10K10TI144-4N by Intel is a PLD with 576 logic cells, 0.6 ns propagation delay, and 102 inputs. It is used in industrial applications requiring fast processing speeds and high I/O capabilities. The device features a low profile flatpack package with matte tin terminals for reliable performance in harsh environments.
EPF10K50RI240-4N
LOADABLE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: HFQFP; Package Shape: SQUARE;
EPF10K50RI240-4N by Intel is a PLD with 2880 logic cells, 0.6 ns propagation delay, and 189 inputs. Ideal for industrial applications, it operates at -40 to 85 °C with a clock frequency of 62.89 MHz. The package style includes flatpack and heat sink/slug options in a square shape with gull wing terminals.
EPF10K10QC208-4N
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
EPF10K10QC208-4N by Intel is a PLD with 576 logic cells, 0.6 ns propagation delay, and 134 inputs. Ideal for applications requiring high-speed processing and complex logic functions in commercial-grade environments. Features include 5.25 V max supply voltage, 67.11 MHz clock frequency, and flatpack fine pitch package style.
EPF10K10ATI144-3N
LOADABLE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
EPF10K50VRI240-4N
EPF10K100ARI240-3N
EPF10K10AQC208-3N
Intel's EPF10K10AQC208-3N is a PLD with 576 logic cells, 0.8 ns propagation delay, and 134 inputs/outputs. It operates at 80 MHz clock frequency, suitable for applications requiring high-speed processing in commercial environments. The device features a flatpack package style with gull wing terminals and matte tin finish.
EPF10K20TI144-4N
EPF10K50RC240-3N
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: HFQFP; Package Shape: SQUARE;
The EPF10K50RC240-3N by Altera is a programmable logic device with 2880 logic cells. It has a maximum supply voltage of 5.25V and operates at a maximum clock frequency of 66.67MHz. Its application includes use in loadable PLDs and registered output functions.
EPF10K50ETI144-2
EPF10K50ETI144-2 by Intel is a programmable logic device (PLD) with 2880 logic cells and a propagation delay of 0.6 ns. It is used in applications requiring high-speed processing, such as industrial automation and telecommunications.
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