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EPF10K200SRC240-3

Intel

EPF10K200SRC240-3 by Intel

Intel's EPF10K200SRC240-3 is a PLD with 9984 logic cells, 0.8 ns propagation delay, and 182 inputs/outputs. It operates at 2.5V with CMOS technology, suitable for applications requiring fast processing speeds and high I/O capabilities in commercial-grade environments.

Median Price

$561.490

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Arrow

USA . 916 parts In-Stock

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$561.490

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$299.460

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$224.600

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Verical

USA . 916 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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$235.640

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Digiode

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MARBEL Systems

Belgium . 40 parts In-Stock

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$28.504

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Kenton Components

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$34.598

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Aztec Data Supply Inc.

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Modulus Dynamics

Lithuania . 1,504 parts In-Stock

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Corohmni

South Africa . 534 parts In-Stock

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Texas Native Microelectronics

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$109.135

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Semicontronic

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$190.910

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Ampacity Inc.

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Netroflash

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Continental Prestige Electronics

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Microchip USA

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Component Stockers USA

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$347.900

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One Stop Electronics

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Corphita

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Argo Parts USA

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A-Z Elektronik GmbH

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Supply Digital

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Vigor

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Qasali Group International

UK . 400 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the EPF10K200SRC240-3 by Intel. Designed to deliver unmatched performance, this programmable logic device boasts 9984 logic cells and 182 inputs for seamless integration in a variety of applications. With a nominal supply voltage of 2.5V and a maximum operating temperature of 70°C, this versatile PLD offers reliability and efficiency like no other. Experience the superior quality and innovation that only Intel can provide, and take your projects to new heights with the EPF10K200SRC240-3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the internal components of the device.

Propagation Delay: 0.8 ns

Low propagation delay ensures fast processing speed and efficient operation of the device.

No. of Logic Cells: 9984

Large number of logic cells allow for complex logic functions to be programmed and executed effectively.

Surface Mount: YES

Surface mount capability makes it easy to integrate the device onto a printed circuit board, saving space and improving assembly efficiency.

Maximum Supply Voltage: 2.625 V

Suitable maximum supply voltage for stable and reliable operation of the device within specified limits.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the device energy-efficient and reliable.

No. of Inputs: 182

Multiple input options allow for versatile connectivity and input sources to drive the logic functions of the device.

Package Shape: SQUARE

Square package shape allows for efficient use of space and easy alignment during assembly.

Form Of Terminal: GULL WING

Gull wing terminals provide secure and reliable connections for the device, ensuring proper electrical contact.

Nominal Supply Voltage (V): 2.5

Stable nominal supply voltage for consistent performance and reliable operation of the device.

Power Supplies (V): 2.5,2.5/3.3

Support for multiple power supplies allows for flexible power options depending on the application requirements.

No. of Terminals: 240

Ample number of terminals provide extensive connectivity options for interfacing with external devices and circuits.

Programmable IC Type: LOADABLE PLD

Loadable PLD allows for easy reconfiguration of logic functions, enabling flexibility and adaptability in the device's use.

Package Style (Meter): FLATPACK, FINE PITCH

Flatpack style with fine pitch offers space-saving design and high-density packaging for efficient board layout.

Output Function: MIXED

Mixed output function allows for diverse output options such as digital signals, analog signals, or a combination of both.

Minimum Supply Voltage: 2.375 V

Sufficient minimum supply voltage for stable operation and preventing under-voltage conditions that can lead to malfunctions.

Maximum Operating Temperature: 70 °C

Wide operating temperature range ensures the device can perform reliably in various environmental conditions.

Pitch Of Terminal: 0.5 mm

Small terminal pitch enables high-density packaging and precise alignment for reliable connections.

Organization: 182 I/O

Well-organized input/output configuration allows for efficient signal routing and connectivity.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature threshold ensures the device can function in colder environments without issues.

Finishing Of Terminal Used: TIN LEAD

Tin lead terminal finishing provides good solderability and corrosion resistance for long-term reliability.

Position Of Terminal: QUAD

Quad terminal positioning allows for efficient routing of signals and connections on the device.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates the device can withstand moderate exposure to moisture during handling and assembly.

Maximum Seated Height: 4.1 mm

Low maximum seated height enables compact design and easy integration into tight spaces or stacked configurations.

Width: 32 mm

Compact width dimension allows for space-saving installation and efficient board layout.

No. of Outputs: 182

Multiple output options provide flexibility in driving external devices and achieving desired logic results.

Length: 32 mm

Balanced length dimension for square package shape ensures uniform size and consistent board layout design.

No. of I/O Lines: 182

Plenty of input/output lines offer versatile connectivity options for interfacing with external devices and systems.

Grading Of Temperature: COMMERCIAL

Commercial temperature grading ensures the device is suitable for standard operating conditions in commercial applications.

Technical Specifications

Programmable Logic Devices (PLD) EPF10K200SRC240-3 attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Intel

IC Features

Programmable IC Type:

Organization:

182 I/O

No. of Outputs:

182

Output Function:

Mixed

No. of Inputs:

182

No. of Logic Cells:

9984

No. of I/O Lines:

182

Propagation Delay:

0.8 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.375 V

Maximum Supply Voltage:

2.625 V

Power Supplies (V):

2.5,2.5/3.3 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Flatpack, Fine Pitch

Package Code:

Package Shape:

Package Equivalence Code:

QFP240,1.3SQ,20

Width:

32 mm

Length:

32 mm

Maximum Seated Height:

4.1 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

240

Terminal Pitch:

.5 mm

Terminal Finish:

Tin Lead

Standards

JESD-30 Code:

S-PQFP-G240

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

EPF10K200SRC240-3 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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