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TICPAL16R8-55CJL

Texas Instruments

TICPAL16R8-55CJL by Texas Instruments

TICPAL16R8-55CJL by Texas Instruments is a UV PLD with 25ns propagation delay, 5.25V max supply voltage, and 16MHz clock frequency. Ideal for PAL-type applications requiring registered output function, it features 8 dedicated inputs and 8 outputs in a ceramic package with through-hole terminals.

Median Price

$8.115

Lifecycle Status

Suppliers In-Stock

8

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1k+

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Freelance Electronics

USA . 2 parts In-Stock

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ComSIT Distribution GmbH

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AZTECH Wire

Italy . 389 parts In-Stock

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One Stop Electronics

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Parana Technologies

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DigiPath Technology Company

USA . 1,021 parts In-Stock

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ChromeModa Solutions

Germany . 5,456 parts In-Stock

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IDEA Electronic Components Group

UK . 20 parts In-Stock

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Overview

Elevate your electronic projects with the TICPAL16R8-55CJL by Texas Instruments. Crafted with precision and expertise, this Programmable Logic Device offers unparalleled performance and reliability. Ideal for a wide range of applications, this PAL-TYPE PLD boasts a swift propagation delay of 25ns and a maximum clock frequency of 16MHz. With 64 product terms and 8 dedicated inputs, this UV PLD is designed to optimize efficiency and streamline your operations. Trust in Texas Instruments to deliver exceptional quality and innovation with every product, providing you with the tools you need to succeed in today's fast-paced technological landscape.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Ceramic and glass-sealed packaging provides durability and protection for the PLD, making it suitable for a wide range of applications in harsh environments.

Propagation Delay: 25 ns

Fast propagation delay ensures quick response time and efficient operation of the PLD, making it ideal for time-sensitive applications.

Maximum Supply Voltage: 5.25 V

High maximum supply voltage allows for flexibility in power supply options, ensuring compatibility with various systems and configurations.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and reliable performance of the PLD.

No. of Inputs: 16

Having 16 inputs provides the PLD with versatility in handling input signals, making it suitable for complex logic functions and signal processing tasks.

Package Shape: RECTANGULAR

Rectangular package shape enables easy integration and mounting of the PLD onto circuit boards and systems, facilitating installation and space efficiency.

Form Of Terminal: THROUGH-HOLE

Through-hole terminals offer secure and reliable connections, ensuring stability and durability of the PLD in various operating conditions.

Architecture: PAL-TYPE

PAL-type architecture provides flexibility and programmability, allowing for custom configuration and reconfiguration of the PLD to meet specific application requirements.

Nominal Supply Voltage (V): 5

Stable nominal supply voltage of 5V ensures consistent and reliable operation of the PLD, minimizing the risk of voltage fluctuations and errors.

Power Supplies (V): 5

Multiple power supplies at 5V offer redundancy and backup power options, enhancing the reliability and fault tolerance of the PLD in critical systems.

No. of Terminals: 20

With 20 terminals, the PLD provides sufficient connectivity options for interfacing with other components and devices, enabling versatile and versatile application configurations.

Programmable IC Type: UV PLD

UV programmability allows for easy and quick programming of the PLD, enabling rapid development and prototyping of custom logic functions and circuits.

Package Style (Meter): IN-LINE

In-line package style facilitates easy integration of the PLD into existing circuits and systems, reducing installation time and complexity.

Output Function: REGISTERED

Registered output function provides enhanced signal stability and integrity, reducing signal noise and errors in data processing and communication applications.

No. of Product Terms: 64

Having 64 product terms allows for complex logic operations and functions to be implemented in the PLD, making it suitable for advanced digital design applications.

Minimum Supply Voltage: 4.75 V

Low minimum supply voltage of 4.75V ensures compatibility with low-power systems and energy-efficient operation, reducing power consumption and heat generation.

Maximum Operating Temperature: 75 °C

High maximum operating temperature of 75°C allows the PLD to withstand elevated temperature conditions, ensuring reliability and performance in demanding environments.

Pitch Of Terminal: 2.54 mm

Narrow pitch of 2.54mm between terminals enables compact and dense mounting of the PLD onto circuit boards, maximizing space utilization and layout efficiency.

Organization: 8 DEDICATED INPUTS, 0 I/O

Organization with 8 dedicated inputs and no I/O provides specialized input processing capabilities, making the PLD suitable for applications requiring input signal manipulation and analysis.

No. of Dedicated Inputs: 8

Having 8 dedicated inputs allows the PLD to focus on specific input signals or data streams, optimizing performance and resource allocation for dedicated functions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature of 0°C ensures the PLD can function reliably in cold environments, offering versatility and operational flexibility in variable temperature conditions.

Position Of Terminal: DUAL

Dual position of terminals provides redundancy and flexibility in connecting the PLD to external devices and components, offering multiple connectivity options and configurations.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency of 16MHz enables fast data processing and signal transmission, making the PLD suitable for high-speed and real-time applications requiring rapid response and performance.

No. of Outputs: 8

Having 8 outputs allows the PLD to deliver processed signals and data to external devices and circuits, enabling data communication and interaction with other components effectively.

Grading Of Temperature: COMMERCIAL EXTENDED

Commercial extended temperature grading ensures the PLD can operate reliably in a wide range of temperature conditions, making it suitable for commercial and industrial applications with varying temperature requirements.

Technical Specifications

Programmable Logic Devices (PLD) TICPAL16R8-55CJL attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

8 Dedicated Inputs, 0 I/O

No. of Outputs:

8

Output Function:

Registered

No. of Inputs:

16

No. of Product Terms:

64

No. of Dedicated Inputs:

8

No. of I/O Lines:

0

Maximum Clock Frequency:

16 MHz

Propagation Delay:

25 ns

Technology:

CMOS

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

Register Preload

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-GDIP-T20

Qualified:

No

Trade Compliance

TICPAL16R8-55CJL Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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