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TICPAL16L8-55CJ

Texas Instruments

TICPAL16L8-55CJ by Texas Instruments

TICPAL16L8-55CJ by Texas Instruments is a CMOS PAL-TYPE PLD with 55 ns propagation delay, 16 inputs, and 64 product terms. It operates at 5V, has 8 outputs for combinatorial functions, and is used in commercial applications requiring a temperature range of 0-70°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,600 parts In-Stock

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Digiode

USA . 1,807 parts In-Stock

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1,807

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Distributors (Availability)

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One Stop Electronics

USA . 676 parts In-Stock

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$9.000

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676

$9.000

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AZTECH Wire

Italy . 393 parts In-Stock

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$19.141

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Parana Technologies

USA . 1,483 parts In-Stock

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$152.452

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DigiPath Technology Company

USA . 1,248 parts In-Stock

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$167.868

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$154.439

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ChromeModa Solutions

Germany . 4,579 parts In-Stock

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$171.294

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$140.461

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4,579

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IDEA Electronic Components Group

UK . 876 parts In-Stock

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$171.294

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$162.729

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$154.165

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876

$171.294

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Corphita

USA . 327 parts In-Stock

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Overview

Unlock a world of endless possibilities with the TICPAL16L8-55CJ by Texas Instruments. Crafted with precision and expertise, this superior quality Programmable Logic Device offers unparalleled performance in a variety of applications. From enhancing efficiency in industrial automation to optimizing control systems in aerospace, this PAL-type device is a game-changer. With a nominal supply voltage of 5V, 16 inputs, and 8 outputs, this through-hole package is designed for seamless integration. Experience reliability and innovation like never before with Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide good thermal conductivity and mechanical protection, making the device more reliable and durable.

Propagation Delay: 55 ns

Low propagation delay ensures fast operation and response times, making it suitable for high-speed applications.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, providing efficient performance.

No. of Inputs: 16

Having a higher number of inputs allows for more complex logic functions to be implemented.

Package Shape: RECTANGULAR

Rectangular shape offers easy integration and efficient use of space in electronic circuits.

Form Of Terminal: THROUGH-HOLE

Through-hole terminals make soldering and connection easier, enhancing the usability of the device.

Architecture: PAL-TYPE

PAL-type architecture provides flexibility and programmability to easily customize the logic functions of the device.

Nominal Supply Voltage (V): 5

Operating at a standard 5V supply voltage makes it compatible with a wide range of circuits and systems.

No. of Terminals: 20

Having more terminals allows for greater connectivity and versatility in circuit design.

Package Style (Meter): IN-LINE

In-line package style offers a compact form factor and easy integration into electronic assemblies.

Output Function: COMBINATORIAL

Combinatorial output function allows for a variety of logical operations to be performed, increasing functionality.

No. of Product Terms: 64

With 64 product terms, the device can support a wide range of logic functions and operations.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Pitch Of Terminal: 2.54 mm

Standard pitch size of 2.54mm enables easy PCB layout and component placement for efficient circuit design.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for operation in colder environments without performance degradation.

Position Of Terminal: DUAL

Dual-position terminals provide flexibility in circuit connection and layout options.

No. of Outputs: 8

Multiple outputs allow for the device to drive multiple components or circuits, expanding its utility.

Grading Of Temperature: COMMERCIAL

Commercial temperature grading ensures reliable operation in typical commercial applications.

Technical Specifications

Programmable Logic Devices (PLD) TICPAL16L8-55CJ attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

16

No. of Product Terms:

64

Propagation Delay:

55 ns

Technology:

CMOS

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-XDIP-T20

Qualified:

No

Trade Compliance

TICPAL16L8-55CJ Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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