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TICPAL16L8-55CN

Texas Instruments

TICPAL16L8-55CN by Texas Instruments

TICPAL16L8-55CN by Texas Instruments is a CMOS PAL-TYPE PLD with 55 ns propagation delay and 5.25 V max supply voltage. It has 16 inputs, 8 outputs, and 6 I/O lines suitable for combinatorial output functions in commercial extended temperature applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,353 parts In-Stock

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Digiode

USA . 3,691 parts In-Stock

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3,691

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Distributors (Availability)

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AZTECH Wire

Italy . 881 parts In-Stock

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$6.139

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One Stop Electronics

USA . 617 parts In-Stock

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$20.000

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Parana Technologies

USA . 652 parts In-Stock

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$115.888

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DigiPath Technology Company

USA . 78 parts In-Stock

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$127.607

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$117.398

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78

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ChromeModa Solutions

Germany . 4,841 parts In-Stock

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$130.211

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$106.773

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IDEA Electronic Components Group

UK . 2,304 parts In-Stock

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$130.211

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$123.700

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$117.190

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Corphita

USA . 2,794 parts In-Stock

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Overview

Transform your electronic designs with the TICPAL16L8-55CN from Texas Instruments, a leading manufacturer in the industry. This versatile Programmable Logic Device offers unparalleled performance and reliability for a wide range of applications. With its advanced technology and high-quality construction, this PLD delivers fast propagation delay and low power consumption, making it ideal for intricate circuit designs. Unlock endless possibilities and streamline your projects with the TICPAL16L8-55CN, setting new standards in innovation and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the device lightweight and durable, ideal for easy handling and long-lasting use.

Propagation Delay: 55 ns

The low propagation delay of 55 ns ensures quick response times, making the device suitable for high-speed applications.

Maximum Supply Voltage: 5.25 V

With a maximum supply voltage of 5.25 V, the device can withstand fluctuations in the power supply without getting damaged.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the device energy-efficient and reliable.

No. of Inputs: 16

Having 16 inputs allows for a wide range of external signals to be processed, enhancing the flexibility and functionality of the device.

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to integrate the device into various circuit designs efficiently.

Form Of Terminal: THROUGH-HOLE

The through-hole terminal design provides secure and stable connections, reducing the risk of signal loss or disconnection.

Architecture: PAL-TYPE

The PAL-type architecture offers flexibility in programming and customization, allowing users to tailor the device to their specific application requirements.

Nominal Supply Voltage (V): 5

The nominal supply voltage of 5 V ensures compatibility with standard power sources, making the device easy to integrate into existing systems.

Power Supplies (V): 5

Having dedicated power supplies of 5 V ensures stable and consistent power delivery, optimizing the performance and reliability of the device.

No. of Terminals: 20

The 20 terminals provide ample connection points for input, output, and power, allowing for versatile connectivity options in different circuit configurations.

Programmable IC Type: OT PLD

The OT PLD type allows for reprogramming and reconfiguring the device as needed, enabling adaptability to changing project requirements or design modifications.

Package Style (Meter): IN-LINE

The in-line package style offers a compact and space-saving design, making it suitable for applications with limited PCB real estate.

Output Function: COMBINATORIAL

The combinatorial output function enables the device to generate logic outputs based on input combinations, providing versatile logic operations for various applications.

No. of Product Terms: 64

With 64 product terms, the device can handle complex logic operations efficiently, making it suitable for advanced and multifunctional circuit designs.

Minimum Supply Voltage: 4.75 V

The minimum supply voltage of 4.75 V ensures reliable operation even under low voltage conditions, enhancing the device's stability and performance.

Maximum Operating Temperature: 75 °C

The high maximum operating temperature of 75°C allows the device to operate in harsh environmental conditions without compromising performance or reliability.

Pitch Of Terminal: 2.54 mm

The 2.54 mm terminal pitch provides compatibility with standard PCB layouts and components, simplifying integration and assembly processes.

Organization: 10 DEDICATED INPUTS, 6 I/O

The dedicated inputs and I/O lines organization offers clear signal routing and management, optimizing the device's functionality and efficiency in data processing.

No. of Dedicated Inputs: 10

Having 10 dedicated inputs allows for specific signal processing and routing, enhancing the device's versatility in handling different input sources.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures the device can function in cold environments or during startup conditions, expanding its operational range.

Position Of Terminal: DUAL

The dual terminal position provides redundancy and flexibility in connecting external components, reducing the risk of signal loss or connectivity issues.

Maximum Seated Height: 5.08 mm

The low maximum seated height of 5.08 mm allows for compact and space-efficient PCB designs, ideal for applications with size constraints.

Width: 7.62 mm

The width of 7.62 mm offers a compact form factor, making the device suitable for installations where space is limited or where multiple components need to be accommodated.

No. of Outputs: 8

Having 8 outputs enables the device to drive multiple external components or circuits, enhancing its functionality and versatility in controlling various system elements.

Length: 24.325 mm

The length of 24.325 mm provides a balance between compactness and connectivity, allowing for efficient placement within circuit layouts without compromising on signal routing.

No. of I/O Lines: 6

With 6 I/O lines, the device can facilitate bi-directional data transfer and communication with external devices, expanding its utility in interfacing with different systems.

Grading Of Temperature: COMMERCIAL EXTENDED

The commercial extended temperature grading ensures the device can operate reliably in a wide range of temperature conditions, making it suitable for commercial and industrial applications.

Technical Specifications

Programmable Logic Devices (PLD) TICPAL16L8-55CN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

10 Dedicated Inputs, 6 I/O

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

16

No. of Product Terms:

64

No. of Dedicated Inputs:

10

No. of I/O Lines:

6

Propagation Delay:

55 ns

Technology:

CMOS

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Width:

7.62 mm

Length:

24.325 mm

Maximum Seated Height:

5.08 mm

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-PDIP-T20

Qualified:

No

Trade Compliance

TICPAL16L8-55CN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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