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TICPAL22V10MJL

Texas Instruments

TICPAL22V10MJL by Texas Instruments

TICPAL22V10MJL by Texas Instruments is a UV PLD with 132 product terms, 22 inputs, and 10 I/O lines. It operates at a voltage range of 4.5V to 5.5V and has a max temperature rating of 125°C, making it suitable for military-grade applications requiring PAL-type architecture in ceramic package with through-hole terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,190 parts In-Stock

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3,190

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Digiode

USA . 854 parts In-Stock

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854

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 595 parts In-Stock

1+ parts

$12.921

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595

$12.921

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Parana Technologies

USA . 1,330 parts In-Stock

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$26.175

100+ parts

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$26.765

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1,330

$26.175

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$26.765

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DigiPath Technology Company

USA . 938 parts In-Stock

1+ parts

$28.822

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$26.516

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938

$28.822

$26.516

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ChromeModa Solutions

Germany . 3,073 parts In-Stock

1+ parts

$29.410

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$24.116

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3,073

$29.410

$24.116

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IDEA Electronic Components Group

UK . 1,594 parts In-Stock

1+ parts

$29.410

100+ parts

$27.940

1k+ parts

$26.469

10k+ parts

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1,594

$29.410

$27.940

$26.469

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One Stop Electronics

USA . 474 parts In-Stock

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$31.000

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474

$31.000

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Corphita

USA . 2,190 parts In-Stock

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2,190

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Overview

Unlock endless possibilities with the TICPAL22V10MJL by Texas Instruments, a top-tier manufacturer known for their cutting-edge technology. This programmable logic device belongs to the versatile category of PLDs and offers a seamless blend of quality and innovation. Ideal for a wide range of applications, this product delivers unmatched value with its reliability, flexibility, and superior performance. Elevate your projects with the TICPAL22V10MJL and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection to the internal components of the device, making it suitable for harsh environments or industrial applications.

Maximum Supply Voltage: 5.5 V

Allows for a higher supply voltage, providing flexibility in power requirements and potentially supporting a wider range of applications.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, resulting in efficient and reliable operation.

No. of Inputs: 22

Having a large number of inputs allows for versatile and complex logic operations to be implemented using the device.

Nominal Supply Voltage (V): 5

Standard supply voltage facilitates easy integration with existing systems and components that operate at 5V.

Output Function: MACROCELL

Macrocell architecture allows for customizable logic functions and flexibility in design, catering to specific project requirements.

No. of Product Terms: 132

Having a high number of product terms provides the device with the ability to perform complex logic operations, making it suitable for advanced applications.

Minimum Operating Temperature: -55 °C

Wide operating temperature range ensures that the device can function reliably in extreme cold environments, increasing its versatility.

Grading Of Temperature: MILITARY

Military-grade temperature grading signifies high reliability and robustness, making this product suitable for demanding and critical military applications.

Technical Specifications

Programmable Logic Devices (PLD) TICPAL22V10MJL attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

11 Dedicated Inputs, 10 I/O

No. of Outputs:

10

Output Function:

Macrocell

No. of Inputs:

22

No. of Product Terms:

132

No. of Dedicated Inputs:

11

No. of I/O Lines:

10

Technology:

CMOS

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

Shared Input/Clock

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP24(UNSPEC)

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

24

Standards

JESD-30 Code:

R-GDIP-T24

Qualified:

No

Trade Compliance

TICPAL22V10MJL Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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