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EPM570GM100C5N

Intel

EPM570GM100C5N by Intel

EPM570GM100C5N by Intel is a FLASH PLD with 440 macro cells, 76 I/O lines, and 8.7 ns propagation delay. Ideal for applications requiring programmable logic devices with low power consumption and high-speed processing capabilities.

Median Price

$32.170

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Verical

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IBS Electronics

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Corohmni

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Corphita

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Overview

Unlock endless possibilities with Intel's EPM570GM100C5N, a top-of-the-line Programmable Logic Device designed to revolutionize your projects. Crafted with precision and expertise by Intel, this device boasts exceptional quality and reliability. Whether you're in the automotive, aerospace, or telecommunications industry, this versatile PLD offers unmatched performance and efficiency. With lightning-fast propagation delay and an array of input and output options, this device is a game-changer in the world of programmable ICs. Upgrade your systems today with Intel's EPM570GM100C5N and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the PLD, making it suitable for various environmental conditions.

Propagation Delay: 8.7 ns

Low propagation delay ensures quick response and high performance of the PLD in processing signals and data.

Surface Mount: YES

Surface mount capability makes it easy to integrate this PLD into a circuit board assembly, saving space and simplifying installation.

Maximum Supply Voltage: 1.89 V

Operates efficiently with a low maximum supply voltage, making it suitable for low power applications.

No. of Macro Cells: 440

Large number of macro cells allows for complex logic functions and flexibility in programming the PLD for diverse applications.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to the efficiency and reliability of the PLD.

No. of Inputs: 76

Provides ample input channels for data and signal processing, allowing for versatile utilization of the PLD in different systems.

Package Shape: SQUARE

Square package shape facilitates efficient placement on a circuit board and can help optimize space utilization in the overall design.

Nominal Supply Voltage (V): 1.8

Stable nominal supply voltage ensures consistent and reliable operation of the PLD within specified parameters.

Power Supplies (V): 1.5/3.3, 1.8

Support for multiple power supply voltages offers compatibility with a wide range of systems and integration options.

No. of Terminals: 100

A higher number of terminals enable connectivity with various external components and peripherals for enhanced functionality.

Programmable IC Type: FLASH PLD

Flash programmability allows for easy reconfiguration and updates to the PLD's logic functions, enhancing adaptability to changing requirements.

Package Style (Meter): GRID ARRAY

Grid array package style facilitates soldering and assembly processes, ensuring secure connections and reliable performance of the PLD.

In-System Programmable: YES

In-system programmability offers flexibility for on-the-fly reprogramming and updates, facilitating quick customization and optimization of the PLD.

Output Function: MACROCELL

Macrocell-based output function allows for efficient structuring of logic operations and output signals, enhancing performance and versatility of the PLD.

Minimum Supply Voltage: 1.71 V

Low minimum supply voltage ensures stable operation even under low power conditions, expanding the range of applications for the PLD.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliability and performance consistency across varying environmental conditions.

Pitch Of Terminal: 0.5 mm

Narrow terminal pitch allows for compact design and precise connections, contributing to overall efficiency and reliability of the PLD.

Organization: 0 DEDICATED INPUTS, 76 I/O

Specific organization of dedicated inputs and I/O lines provides a structured approach to data processing and integration, enhancing overall functionality.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature tolerance ensures reliable performance even in cold conditions, expanding the range of environmental suitability for the PLD.

Finishing Of Terminal Used: TIN SILVER COPPER

Combination of tin, silver, and copper finishing on terminals ensures enhanced conductivity, corrosion resistance, and durability for long-term performance.

Position Of Terminal: BOTTOM

Bottom terminal positioning offers easy accessibility for connections and installation, simplifying integration into circuit board assemblies.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates moderate sensitivity to moisture, requiring standard precautions during handling and storage to maintain performance.

Width: 6 mm

Compact width dimension enables space-efficient placement on circuit boards, contributing to optimized layout designs and overall system performance.

No. of Outputs: 76

Matching the number of outputs with inputs ensures balanced signal processing and logic operations, enhancing the overall efficiency and functionality of the PLD.

Length: 6 mm

Uniform length dimension simplifies alignment and installation of the PLD on circuit boards, streamlining assembly processes and ensuring consistent performance.

JTAG Boundary Scan Test: YES

JTAG boundary scan test support enables efficient testing and debugging of the PLD, ensuring quality assurance and reliability in operation.

No. of I/O Lines: 76

A balanced number of input and output lines enables versatile connectivity and data exchange, supporting a wide range of applications and system configurations.

Technical Specifications

Programmable Logic Devices (PLD) EPM570GM100C5N attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Intel

IC Features

Programmable IC Type:

In-System Programmable:

Yes

Organization:

0 Dedicated Inputs, 76 I/O

No. of Outputs:

76

Output Function:

Macrocell

No. of Inputs:

76

No. of Macro Cells:

440

No. of Dedicated Inputs:

0

No. of I/O Lines:

76

Propagation Delay:

8.7 ns

Technology:

CMOS

Sub-Category:

Programmable Logic Devices

Additional Features:

It can also operate at 3.3 V

Power Characteristics

Nominal Supply Voltage:

1.8

Minimum Supply Voltage:

1.71 V

Maximum Supply Voltage:

1.89 V

Power Supplies (V):

1.5/3.3,1.8 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

85 °C (185 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Grid Array

Package Code:

BGA

Package Shape:

Package Equivalence Code:

BGA100,11X11,20

Width:

6 mm

Length:

6 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Form:

No. of Terminals:

100

Terminal Pitch:

.5 mm

Terminal Finish:

Tin Silver Copper

Standards

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

JTAG Boundary Scan Test:

Yes

Qualified:

No

Trade Compliance

EPM570GM100C5N Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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