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EPM570F256I5N

Intel

EPM570F256I5N by Intel

The Intel EPM570F256I5N is a FLASH PLD with 440 macro cells, 160 I/O lines, and 8.7 ns propagation delay. It is ideal for applications requiring programmable logic devices with in-system programmability and JTAG boundary scan testing capabilities.

Median Price

$75.865

Lifecycle Status

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Arrow

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Verical

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Schukat

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DF Sales Co.

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Digiode

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Nova Conductors

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Holdelec - ElecDif-Pro

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Touchstone Systems

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LIBRA Elektronik GmbH

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Andel Nordic

Denmark . 575 parts In-Stock

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$9.069

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$8.706

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AZTECH Wire

Italy . 687 parts In-Stock

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$15.661

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Advanced Electronics

New Zealand . 650 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,416 parts In-Stock

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Vigor

Singapore . 833 parts In-Stock

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Modulus Dynamics

Lithuania . 1,455 parts In-Stock

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Corphita

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One Stop Electronics

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Ampacity Inc.

Singapore . 88 parts In-Stock

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Semicontronic

India . 41 parts In-Stock

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Component Stockers USA

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Continental Prestige Electronics

USA . 4,141 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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MARBEL Systems

Belgium . 58 parts In-Stock

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Texas Native Microelectronics

USA . 3,202 parts In-Stock

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Kenton Components

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Corohmni

South Africa . 1,015 parts In-Stock

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Microchip USA

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Lixinc

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Infinite Electronics LLP (Excess)

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Qasali Group International

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GreenTree Electronics

Israel . 440 parts In-Stock

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Futuretech Components

Singapore . 320 parts In-Stock

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A-Z Elektronik GmbH

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Argo Parts USA

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Speed Components Ltd (Excess)

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Overview

Unlock the full potential of your projects with the Intel EPM570F256I5N Programmable Logic Device. Manufactured by Intel, a leader in innovative technology, this device is designed to provide high-quality performance for a wide range of applications. With 440 macro cells and 160 inputs/outputs, this flash PLD offers flexibility and reliability. Perfect for in-system programming and featuring JTAG boundary scan test capabilities, the EPM570F256I5N ensures easy integration and efficient operation. Trust Intel to deliver cutting-edge solutions that elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective for packaging the device, making it a reliable choice.

Propagation Delay: 8.7 ns

Low propagation delay ensures fast signal processing, making the device suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 2.625 V

Operates within a safe voltage range, offering protection against voltage spikes and ensuring reliable performance.

No. of Macro Cells: 440

Large number of macro cells provide flexibility in designing complex logic circuits and functions.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the device.

No. of Inputs: 160

Abundance of input pins allows for versatile input configurations, accommodating a wide range of applications.

Package Shape: SQUARE

Square package shape facilitates uniform placement on circuit boards, aiding in optimal utilization of board space.

Form Of Terminal: BALL

Ball terminals provide reliable connections and easy soldering, ensuring stable electrical connections.

Nominal Supply Voltage (V): 2.5

Stable nominal supply voltage simplifies power management and ensures consistent operation of the device.

Power Supplies (V): 1.5/3.3,2.5/3.3

Multiple power supply options offer flexibility in voltage selection based on specific application requirements.

No. of Terminals: 256

Abundance of terminals allows for versatile connectivity options, enabling complex circuit designs.

Programmable IC Type: FLASH PLD

Flash programmability allows for easy and efficient reconfiguration of logic functions, enhancing design flexibility.

Package Style (Meter): GRID ARRAY

Grid array package style offers efficient thermal dissipation and good signal integrity, contributing to reliable performance.

In-System Programmable: YES

In-system programmability enables real-time configuration changes without the need for physical reprogramming, enhancing flexibility.

Output Function: MACROCELL

Macrocell output functionality offers customizable output configurations, facilitating diverse logic operations.

Minimum Supply Voltage: 2.375 V

Specified minimum supply voltage ensures reliable operation under varying voltage conditions, enhancing device robustness.

Maximum Operating Temperature: 100 °C

High operating temperature tolerance enables reliable performance in challenging environmental conditions, making the device versatile.

Pitch Of Terminal: 1 mm

Terminal pitch of 1 mm allows for compact design and efficient placement on circuit boards, optimizing space utilization.

Organization: 0 DEDICATED INPUTS, 160 I/O

Organized structure with dedicated inputs and abundant I/O lines simplifies circuit design and enhances flexibility in signal processing.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature ensures reliable performance in extreme cold conditions, making the device suitable for various environments.

Finishing Of Terminal Used: TIN SILVER COPPER

Use of tin, silver, and copper finishes on terminals ensures reliable connections and resistance to corrosion, maintaining long-term performance.

Position Of Terminal: BOTTOM

Bottom terminal positioning offers convenient access during assembly and maintenance, facilitating efficient circuit board integration.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling procedures to maintain the device's performance.

Maximum Seated Height: 2.2 mm

Compact seated height of 2.2 mm allows for low-profile design and efficient integration into space-constrained applications.

Width: 17 mm

Width of 17 mm enables compact form factor, ideal for applications where space efficiency is crucial.

No. of Outputs: 160

Abundance of output pins allows for diverse output configurations, supporting a wide range of logic functions and signal processing.

Length: 17 mm

Length of 17 mm complements the compact width, offering a balanced form factor for efficient board layout and integration.

JTAG Boundary Scan Test: YES

JTAG boundary scan test capability allows for easy debugging and testing of the device, ensuring reliable operation and quick troubleshooting.

No. of I/O Lines: 160

Abundance of I/O lines offers versatile connectivity options for input and output, accommodating diverse circuit configurations and signal processing requirements.

Technical Specifications

Programmable Logic Devices (PLD) EPM570F256I5N attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Intel

IC Features

Programmable IC Type:

In-System Programmable:

Yes

Organization:

0 Dedicated Inputs, 160 I/O

No. of Outputs:

160

Output Function:

Macrocell

No. of Inputs:

160

No. of Macro Cells:

440

No. of Dedicated Inputs:

0

No. of I/O Lines:

160

Propagation Delay:

8.7 ns

Technology:

CMOS

Sub-Category:

Programmable Logic Devices

Additional Features:

It can also operate at 3.3 V

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.375 V

Maximum Supply Voltage:

2.625 V

Power Supplies (V):

1.5/3.3,2.5/3.3 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

100 °C (212 °F)

Minimum Operating Temperature:

-40 °C (-40 °F)

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Grid Array

Package Code:

BGA

Package Shape:

Package Equivalence Code:

BGA256,16X16,40

Width:

17 mm

Length:

17 mm

Maximum Seated Height:

2.2 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Form:

No. of Terminals:

256

Terminal Pitch:

1 mm

Terminal Finish:

Tin Silver Copper

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

JTAG Boundary Scan Test:

Yes

Qualified:

No

Trade Compliance

EPM570F256I5N Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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