Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
XC2C128-7VQG100I by Xilinx is a 128 macrocell FLASH PLD with 80 I/O lines, 7.5 ns propagation delay, and 119 MHz max clock frequency. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing in a compact square package with gull wing terminals.
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Touchstone Systems
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Vigor
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Microchip USA
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Corphita
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Modulus Dynamics
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QUARKTWIN TECHNOLOGY LTD
Lixinc
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Provides durability and protection for the internal components, making the product suitable for various environments.
Fast propagation delay ensures efficient operation and quick response times in applications.
Allows for easy integration onto PCBs, saving space and simplifying the assembly process.
Low power supply voltage requirement helps in reducing power consumption and heat generation.
Having a large number of macro cells allows for complex logic functions to be implemented in the device.
CMOS technology offers low power consumption and high noise immunity, enhancing the reliability and efficiency of the device.
Sufficient number of inputs for accommodating various logic inputs and signals in the application.
Square package shape facilitates easier placement and orientation on the PCB.
Gull wing terminals provide strong mechanical connections and ease of soldering during assembly.
PLA-type architecture offers flexibility in programming the logic functions according to the application requirements.
Stable nominal supply voltage ensures consistent performance of the device.
Support for multiple power supply voltages enables compatibility with different system configurations.
Sufficient number of terminals for connecting external components and interfacing with the system.
Flash PLD technology allows for reprogramming of logic functions, enabling flexibility in design changes and updates.
Compact and thin package styles with fine pitch terminals offer space-saving and high-density integration on the PCB.
In-system programmability allows for on-the-fly updates and changes to the logic functions without requiring device removal.
Macrocell-based output function provides configurable outputs for implementing diverse logic operations.
Low minimum supply voltage ensures compatibility with various power sources and energy-efficient operation.
Wide operating temperature range allows for reliable performance in harsh environmental conditions.
Fine pitch terminals enable high-density mounting and compact design layout on the PCB.
Dedicated inputs and versatile I/O configurations offer flexibility in implementing diverse logic functions in the application.
Extended minimum operating temperature range ensures device functionality in extreme cold environments.
Matte tin finishing provides corrosion resistance and good solderability, ensuring long-term reliability of connections.
Quad position of terminals simplifies PCB layout and enables efficient routing of connections.
MSL level 3 indicates that the device is moisture-resistant, suitable for various operating environments.
Low seated height allows for compact design integration and minimizes PCB space requirements.
Compact width dimension enables space-saving integration on the PCB and simplifies layout design.
High maximum clock frequency supports fast operation and real-time processing of logic functions.
Sufficient number of outputs for driving external devices and providing desired logic outputs in the application.
Allows for efficient soldering process during assembly without compromising device integrity.
High peak reflow temperature tolerance ensures reliable soldering connections and longevity of the device.
Compact length dimension facilitates space-saving integration on the PCB and simplifies layout design.
JTAG boundary scan test support enables easy debugging and testing of the device for improved reliability and maintenance.
Abundant I/O lines for interfacing with external components and devices in the application.
Industrial-grade temperature tolerance ensures reliable operation in demanding industrial environments.
Programmable Logic Devices (PLD) XC2C128-7VQG100I attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Xilinx
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XC2C128-7VQG100I Programmable ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Assembly/Origin - Mult Dev LeadFrame Chg 29/Oct/2018
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
BAV99
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148-GS08
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LL4148
Kec
2N7002
Central Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .115 A; Maximum Drain Current (Abs) (ID): .115 A;
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Operating Mode: ENHANCEMENT MODE; Maximum Drain Current (ID): .115 A;
2N2222A
General Transistor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM107H/883C
National Semiconductor
LM107H/883C by National Semiconductor is a MILITARY-grade Operational Amplifier with +-5/+-15V supplies. Featuring 2000uV max input offset voltage, it operates from -55 to 125 °C. Ideal for applications requiring VOLTAGE-FEEDBACK architecture and frequency compensation.
BSS123-7-F
Diodes Incorporated
BSS123-7-F by Diodes Inc. is a N-channel FET with 100V DS breakdown voltage and 0.17A drain current. Ideal for switching applications, it features a single configuration with built-in diode, operates in enhancement mode, and has a max power dissipation of 0.3W.
Zetex Plc
STM32H753ZIT6
STMicroelectronics
STM32H753ZIT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, offering 20-Ch 16-Bit ADC and 2-Ch 12-Bit DAC channels. With a clock frequency of up to 48 MHz, it is ideal for industrial applications requiring CAN, Ethernet, and USB connectivity. This microcontroller operates b/w -40°C to +85°C temperature range.
1N4148WS
Sinyork
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; No. of Elements: 1; Maximum Output Current: .2 A; Config: SINGLE;
LM358AN
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148
Itt Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
M85049/85-08W02
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MMSZ5245BT1G
MMSZ5245BT1G by Onsemi is a Zener diode with 15V nominal reference voltage, 8.5mA test current, and 16 ohm dynamic impedance. It is used in applications requiring precise voltage regulation in a compact SMD package for temperatures ranging from -55 to 150°C.
M39029/58-360
Carlisle Interconnect Technologies
GENERAL CONN ACCESSORY; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; Maximum Operating Temperature: 200 Cel; MIL-Connector Accessory: CONTACT; Terminal Type: CRIMP; MIL Conformity: YES;
Hy Electronic
Philips Semiconductors
EPF10K10QC208-4N
Intel
EPF10K10QC208-4N by Intel is a PLD with 576 logic cells, 0.6 ns propagation delay, and 134 inputs. Ideal for applications requiring high-speed processing and complex logic functions in commercial-grade environments. Features include 5.25 V max supply voltage, 67.11 MHz clock frequency, and flatpack fine pitch package style.
PEEL18CV8P-15
Ami Semiconductor
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
EPM2210F324C5N
The Intel EPM2210F324C5N is a FLASH PLD with 1700 macro cells, 272 inputs/outputs, and 11.2 ns propagation delay. It is used in applications requiring programmable logic devices with fast response times and high I/O capabilities. The device features a grid array package style and JTAG boundary scan test for efficient testing and integration into electronic systems.
EPM240F100I5N
Altera
FLASH PLD; Form Of Terminal: BALL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 2.5;
LC4256V-5TN144C
Lattice Semiconductor
LC4256V-5TN144C by Lattice Semiconductor is a 256 macrocell EE PLD with 110 inputs and 96 I/O lines. It operates at a max clock frequency of 156 MHz, with a propagation delay of 5 ns. Ideal for applications requiring programmable logic devices in surface-mount packages.
ATF1504ASVL-20AC100
Atmel
Atmel ATF1504ASVL-20AC100 is a 64-macrocell EE PLD with 20ns propagation delay, operating at 3.3V. Ideal for applications requiring in-system programmability and JTAG boundary scan testing, it features a max clock frequency of 83.3MHz and operates within a temperature range of 0-70°C.
EP1K50QC208-3
EP1K50QC208-3 by Intel is a PLD with 2880 logic cells, 0.5 ns propagation delay, and 147 inputs. It is used in applications requiring fast processing speeds and high input/output capabilities due to its CMOS technology and loadable PLD type. The device features a square package shape, gull wing terminals, and operates within a temperature range of 0 to 70 °C.
LC4256V-5TN144I
LC4256V-5TN144I by Lattice Semiconductor is a 256 macrocell EE PLD with 110 inputs and 96 I/O lines. With a propagation delay of 5 ns and max clock frequency of 156 MHz, it's ideal for applications requiring fast processing speeds. Its compact square package shape and in-system programmability make it suitable for space-constrained designs.
EPF10K20RC240-4N
Intel's EPF10K20RC240-4N is a PLD with 1152 logic cells, 0.6 ns propagation delay, and 67.11 MHz max clock frequency. Ideal for applications requiring high-speed processing and complex logic functions in commercial-grade environments.
EPF8452ALI84-4
LOADABLE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: J BEND; No. of Terminals: 84; Package Code: QCCJ; Package Shape: SQUARE;
XC2C128-7VQ100C
Xilinx
XC2C128-7VQ100C by Xilinx is a 128 macrocell FLASH PLD with 80 I/O lines, 7.5 ns propagation delay, and 119 MHz max clock frequency. Ideal for applications requiring in-system programmability and PLA-type architecture in commercial-grade environments.
EPM3032ALC44-10N
EPM3032ALC44-10N by Intel is a 32 macrocell EE PLD with 10 ns propagation delay, operating at up to 103.1 MHz clock frequency. It features in-system programmability, 34 I/O lines, and JTAG boundary scan test capability. Ideal for applications requiring fast logic processing and versatile I/O configurations in commercial-grade environments.
EPM7064LI44-15
EPM7064LI44-15 by Intel is a 64 macrocell EE PLD with 36 I/O lines, operating at up to 100 MHz. It features a propagation delay of 15 ns and can handle supply voltages from 4.5V to 5.5V. This programmable logic device is commonly used in industrial applications requiring high-speed data processing and control functions.
EPM2210F256C4N
Intel's EPM2210F256C4N is a PLD with 1700 macro cells, 204 inputs/outputs, and 9.1ns propagation delay. Ideal for applications requiring in-system programmability, such as digital signal processing and control systems due to its FLASH PLD technology and JTAG boundary scan test capability.
5M160ZE64C5
Intel's 5M160ZE64C5 is a FLASH PLD with 54 I/O lines, 118.3 MHz clock frequency, and 14 ns propagation delay. Ideal for applications requiring fast processing speeds and versatile input/output configurations in programmable logic devices.
XC9572XL-10VQG44I
Xilinx XC9572XL-10VQG44I is a 3.3V CMOS PLD with 72 macro cells, 34 I/O lines, and 100MHz clock frequency. Ideal for industrial applications, it offers in-system programmability, JTAG boundary scan test support, and propagation delay of 10ns.
ATF22V10C-10JU
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;
EPM3064ATI100-10N
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;
ATF22V10C-10NM/883
Teledyne E2v (Uk)
EE PLD; Grading Of Temperature: MILITARY; Form Of Terminal: NO LEAD; No. of Terminals: 28; Package Code: QCCN; Package Shape: SQUARE;
EP20K160ETC144-2X
EP20K160ETC144-2X by Intel is a PLD with 6400 logic cells, 1.93 ns propagation delay, and 160 MHz max clock frequency. Ideal for applications requiring high-speed processing and complex logic functions in a compact form factor.
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XC2C128-6VQG100C
XC2C128-6VQG100C by Xilinx is a 128 macrocell FLASH PLD with 80 I/O lines, operating at 152 MHz. It features a propagation delay of 6 ns and can be used in applications requiring programmable logic devices with in-system programmability and JTAG boundary scan testing capabilities.
XC2C64A-7VQG44C
XC2C64A-7VQG44C by Xilinx is a programmable logic device (PLD) with 64 macro cells. It uses CMOS technology and has a max clock frequency of 200 MHz. This PLD is commonly used for in-system programmable applications requiring high-speed processing.
XC2C128-7VQG100C
XC2C128-7VQG100C by Xilinx is a 128 macrocell FLASH PLD with 80 I/O lines, 7.5 ns propagation delay, and 119 MHz clock frequency. Ideal for applications requiring in-system programmability, it features a CMOS technology and operates b/w -40 to +70 °C.
XC2C256-7VQG100C
XC2C256-7VQG100C by Xilinx is a 256 macrocell CMOS PLD with 80 inputs/outputs, 108 MHz clock frequency, and 7.5 ns propagation delay. Ideal for applications requiring in-system programmability, such as digital signal processing and telecommunications systems.
XC2C384-10TQG144C
FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XC2C64A-7VQG44I
XC2C64A-7VQG44I by Xilinx is a 64 macrocell FLASH PLD with 7.5 ns propagation delay, operating at 200 MHz. Ideal for industrial applications, it features in-system programmability, 33 I/O lines, and JTAG boundary scan test capability.
XC2C64A-7QFG48I
XC2C64A-7QFG48I by Xilinx is a 64 macrocell FLASH PLD with 7.5 ns propagation delay, operating at up to 200 MHz. Ideal for industrial applications, it features in-system programmability and 37 I/O lines, packaged in a square chip carrier with a very thin profile.
XC2C256-7TQG144C
XC2C256-7TQG144C by Xilinx is a 256 macrocell FLASH PLD with 118 I/O lines, operating at 108 MHz. It features a propagation delay of 7.5 ns and can be used in applications requiring fast processing speeds and high I/O capabilities, such as digital signal processing and telecommunications systems.
XC2C256-7VQG100I
The Xilinx XC2C256-7VQG100I is a 256 macrocell programmable logic device with 80 inputs/outputs, operating at a max clock frequency of 108 MHz. It features a propagation delay of 7.5 ns and is suitable for applications requiring in-system programmability and JTAG boundary scan testing in industrial environments.
XC2C64A-7QFG48C
XC2C64A-7QFG48C by Xilinx is a 64-macrocell FLASH PLD with 7.5 ns propagation delay, operating at up to 200 MHz. It features in-system programmability and offers 37 I/O lines for various applications requiring fast processing speeds and low power consumption. Ideal for commercial use, this PLD has a compact square chip carrier package with a very thin profile, making it suitable for space-constrained designs.
XC2C64A-5VQG44C
XC2C64A-5VQG44C by Xilinx is a 64 macrocell FLASH PLD with 5 ns propagation delay, operating at up to 333 MHz. Ideal for applications requiring in-system programmability and JTAG boundary scan testing, it features a max supply voltage of 1.9 V and operates within a temperature range of 0-70°C.
XC2C384-10TQG144I
Xilinx XC2C384-10TQG144I is a 384 macrocell FLASH PLD with 118 I/O lines, 10 ns propagation delay, and 83 MHz clock frequency. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing in a compact square package.
XC2C256-7TQG144I
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XC2C64A-7VQ100I
XC2C64A-7VQ100I by Xilinx is a 64 macrocell FLASH PLD with 7.5 ns propagation delay, operating at up to 200 MHz. Ideal for industrial applications, it features in-system programmability and 64 I/O lines, packaged in a thin profile square shape with gull wing terminals.
XC2C64A-7VQG100I
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
XC2C64A-7VQG100C
The Xilinx XC2C64A-7VQG100C is a 64 macrocell FLASH PLD with 7.5 ns propagation delay, operating at up to 200 MHz. Ideal for applications requiring in-system programmability and JTAG boundary scan testing, it features a max supply voltage of 1.9 V and operates within a temperature range of 0°C to 70°C.
XC2C32A-6QFG32I
Xilinx XC2C32A-6QFG32I is a 32 macrocell FLASH PLD with 6 ns propagation delay and 300 MHz max clock frequency. Ideal for industrial applications, it operates at -40 to 85 °C, has 21 I/O lines, and supports JTAG boundary scan testing.
XC2C256-7FTG256C
XC2C256-7FTG256C by Xilinx is a 256 macrocell FLASH PLD with 184 I/O lines, operating at max 108 MHz clock frequency. It features 7.5 ns propagation delay and is ideal for applications requiring in-system programmability and JTAG boundary scan testing in commercial-grade environments.
XC2C32A-6VQG44I
XC2C32A-6VQG44I by Xilinx is a programmable logic device (PLD) with 32 macro cells. It uses CMOS technology and has a max clock frequency of 300 MHz. This PLD is commonly used in industrial applications for its high performance and in-system programmability.
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