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XC2C256-7FTG256C

Xilinx

XC2C256-7FTG256C by Xilinx

XC2C256-7FTG256C by Xilinx is a 256 macrocell FLASH PLD with 184 I/O lines, operating at max 108 MHz clock frequency. It features 7.5 ns propagation delay and is ideal for applications requiring in-system programmability and JTAG boundary scan testing in commercial-grade environments.

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$61.385

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Overview

Unlock the power of innovation with the Xilinx XC2C256-7FTG256C Programmable Logic Device. Manufactured by industry leader Xilinx, this device offers unparalleled quality and reliability. Ideal for a wide range of applications, this PLD boasts cutting-edge technology and a plethora of features to meet your project needs. With lightning-fast propagation delay and in-system programmability, the XC2C256-7FTG256C provides exceptional value and performance. Enhance your designs and stay ahead of the competition with this top-of-the-line product from Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components as it provides good thermal and mechanical properties, making the product durable and reliable.

Propagation Delay: 7.5 ns

Low propagation delay ensures fast signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy and secure installation on PCBs, saving space and facilitating automated assembly.

Maximum Supply Voltage: 1.9 V

Low supply voltage makes the product energy-efficient and suitable for applications where power consumption is a concern.

No. of Macro Cells: 256

Having a large number of macro cells allows for complex programmable logic designs, making the product versatile and adaptable to different tasks.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product reliable and efficient in various operating conditions.

No. of Inputs: 184

A high number of inputs provide flexibility in designing complex logic circuits, making the product suitable for advanced applications.

Package Shape: SQUARE

Square package shape is space-efficient and allows for easy placement on the PCB, optimizing the use of board space.

Form Of Terminal: BALL

Ball terminal design simplifies soldering and ensures a reliable connection, making the product easy to integrate into electronic assemblies.

Architecture: PLA-TYPE

PLA-type architecture enables flexible logic configurations, allowing for customized designs tailored to specific requirements.

Nominal Supply Voltage (V): 1.8

Stable nominal supply voltage ensures consistent performance and reliable operation of the product.

Power Supplies (V): 1.5/3.3,1.8

Multiple power supply options provide compatibility with different system requirements, enhancing the product's versatility.

No. of Terminals: 256

Having a high number of terminals enables the product to interface with a wide range of external devices and components.

Programmable IC Type: FLASH PLD

Flash programmability allows for easy reconfiguration of logic functions, making the product adaptable to changing design requirements.

Package Style (Meter): GRID ARRAY, LOW PROFILE

Grid array package style provides good thermal performance and high pin density, while the low profile design saves space on the PCB.

In-System Programmable: YES

In-system programmability allows for on-the-fly configuration updates, increasing flexibility and reducing downtime for reprogramming.

Output Function: MACROCELL

Macrocell output function simplifies complex logic operations, making the product easy to integrate into larger systems.

Minimum Supply Voltage: 1.7 V

Having a low minimum supply voltage ensures the product can operate in a wide range of power conditions, enhancing its versatility.

Maximum Operating Temperature: 70 °C

High maximum operating temperature allows for reliable performance in harsh environmental conditions, increasing the product's durability.

Pitch Of Terminal: 1 mm

Having a standard terminal pitch simplifies PCB layout and assembly, ensuring compatibility with common manufacturing processes.

Organization: 0 DEDICATED INPUTS, 184 I/O

Dedicated inputs and a high number of I/O lines provide flexibility in logic design and communication with external devices, making the product versatile.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the product can function in cold environments, increasing its usability in a wide range of conditions.

Finishing Of Terminal Used: TIN SILVER COPPER

Using multiple metals for terminal finishing ensures good conductivity and corrosion resistance, improving the product's reliability and longevity.

Position Of Terminal: BOTTOM

Bottom terminal positioning simplifies PCB layout and assembly, making the product easy to integrate into electronic systems.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates the product is resistant to moisture-induced damage during storage and assembly, increasing its reliability.

Maximum Seated Height: 1.55 mm

Low seated height saves space on the PCB and allows for compact system designs, making the product suitable for applications with tight layout constraints.

Width: 17 mm

Compact width enables the product to fit into narrow spaces, while providing a high number of I/O lines for connectivity.

Maximum Clock Frequency: 108 MHz

High clock frequency capability allows for fast signal processing and operation, making the product suitable for high-speed applications.

No. of Outputs: 184

A high number of outputs enables the product to drive multiple external devices, facilitating complex logic operations and communication.

Maximum Time At Peak Reflow Temperature (s): 30

Long time at peak reflow temperature ensures reliable soldering and component attachment during assembly, ensuring long-term product reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper solder joint formation, making the product suitable for lead-free assembly processes.

Length: 17 mm

Compact length design allows for space-saving integration into electronic systems, while providing a high number of I/O lines for connectivity.

JTAG Boundary Scan Test: YES

JTAG boundary scan test capability allows for easy testing and debugging of the product during manufacturing and operation, ensuring quality and reliability.

No. of I/O Lines: 184

Having a large number of I/O lines enables the product to interface with a wide range of external devices, enhancing its versatility and usability.

Grading Of Temperature: COMMERCIAL

Commercial temperature grading ensures the product can operate reliably in typical office and indoor environments, making it suitable for a wide range of applications.

Technical Specifications

Programmable Logic Devices (PLD) XC2C256-7FTG256C attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Xilinx

IC Features

Programmable IC Type:

In-System Programmable:

Yes

Organization:

0 Dedicated Inputs, 184 I/O

No. of Outputs:

184

Output Function:

Macrocell

No. of Inputs:

184

No. of Macro Cells:

256

No. of Dedicated Inputs:

0

No. of I/O Lines:

184

Maximum Clock Frequency:

108 MHz

Propagation Delay:

7.5 ns

Technology:

CMOS

Architecture:

PLA-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

Real Digital Design Technology

Power Characteristics

Nominal Supply Voltage:

1.8

Minimum Supply Voltage:

1.7 V

Maximum Supply Voltage:

1.9 V

Power Supplies (V):

1.5/3.3,1.8 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

3

Maximum Time At Peak Reflow Temperature:

30 s

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Grid Array, Low Profile

Package Code:

Package Shape:

Package Equivalence Code:

BGA256,16X16,40

Width:

17 mm

Length:

17 mm

Maximum Seated Height:

1.55 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Form:

No. of Terminals:

256

Terminal Pitch:

1 mm

Terminal Finish:

Tin Silver Copper

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

JTAG Boundary Scan Test:

Yes

Qualified:

No

Trade Compliance

XC2C256-7FTG256C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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