Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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XC2C256-7FTG256C by Xilinx is a 256 macrocell FLASH PLD with 184 I/O lines, operating at max 108 MHz clock frequency. It features 7.5 ns propagation delay and is ideal for applications requiring in-system programmability and JTAG boundary scan testing in commercial-grade environments.
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Futuretech Components
ChipstoGo Electronic ltd
This material is commonly used for electronic components as it provides good thermal and mechanical properties, making the product durable and reliable.
Low propagation delay ensures fast signal processing, making this product suitable for high-speed applications.
Surface mount technology allows for easy and secure installation on PCBs, saving space and facilitating automated assembly.
Low supply voltage makes the product energy-efficient and suitable for applications where power consumption is a concern.
Having a large number of macro cells allows for complex programmable logic designs, making the product versatile and adaptable to different tasks.
CMOS technology offers low power consumption and high noise immunity, making the product reliable and efficient in various operating conditions.
A high number of inputs provide flexibility in designing complex logic circuits, making the product suitable for advanced applications.
Square package shape is space-efficient and allows for easy placement on the PCB, optimizing the use of board space.
Ball terminal design simplifies soldering and ensures a reliable connection, making the product easy to integrate into electronic assemblies.
PLA-type architecture enables flexible logic configurations, allowing for customized designs tailored to specific requirements.
Stable nominal supply voltage ensures consistent performance and reliable operation of the product.
Multiple power supply options provide compatibility with different system requirements, enhancing the product's versatility.
Having a high number of terminals enables the product to interface with a wide range of external devices and components.
Flash programmability allows for easy reconfiguration of logic functions, making the product adaptable to changing design requirements.
Grid array package style provides good thermal performance and high pin density, while the low profile design saves space on the PCB.
In-system programmability allows for on-the-fly configuration updates, increasing flexibility and reducing downtime for reprogramming.
Macrocell output function simplifies complex logic operations, making the product easy to integrate into larger systems.
Having a low minimum supply voltage ensures the product can operate in a wide range of power conditions, enhancing its versatility.
High maximum operating temperature allows for reliable performance in harsh environmental conditions, increasing the product's durability.
Having a standard terminal pitch simplifies PCB layout and assembly, ensuring compatibility with common manufacturing processes.
Dedicated inputs and a high number of I/O lines provide flexibility in logic design and communication with external devices, making the product versatile.
Low minimum operating temperature ensures the product can function in cold environments, increasing its usability in a wide range of conditions.
Using multiple metals for terminal finishing ensures good conductivity and corrosion resistance, improving the product's reliability and longevity.
Bottom terminal positioning simplifies PCB layout and assembly, making the product easy to integrate into electronic systems.
MSL 3 rating indicates the product is resistant to moisture-induced damage during storage and assembly, increasing its reliability.
Low seated height saves space on the PCB and allows for compact system designs, making the product suitable for applications with tight layout constraints.
Compact width enables the product to fit into narrow spaces, while providing a high number of I/O lines for connectivity.
High clock frequency capability allows for fast signal processing and operation, making the product suitable for high-speed applications.
A high number of outputs enables the product to drive multiple external devices, facilitating complex logic operations and communication.
Long time at peak reflow temperature ensures reliable soldering and component attachment during assembly, ensuring long-term product reliability.
High peak reflow temperature ensures proper solder joint formation, making the product suitable for lead-free assembly processes.
Compact length design allows for space-saving integration into electronic systems, while providing a high number of I/O lines for connectivity.
JTAG boundary scan test capability allows for easy testing and debugging of the product during manufacturing and operation, ensuring quality and reliability.
Having a large number of I/O lines enables the product to interface with a wide range of external devices, enhancing its versatility and usability.
Commercial temperature grading ensures the product can operate reliably in typical office and indoor environments, making it suitable for a wide range of applications.
Programmable Logic Devices (PLD) XC2C256-7FTG256C attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Xilinx
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XC2C256-7FTG256C Programmable ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - Mult DEV EOL 01/Jan/2024
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
1N4148
ROHM
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SS14
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
4554
Jw Miller Magnetics
Other Semiconductors;
MMBT2222ALT1G
Rochester Electronics
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .3 W; Maximum Collector Current (IC): .6 A;
1552200168
Molex
WIRE AND CABLE;
2N7002
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
C0603C104K5RACAUTO
KEMET Corporation
KEMET C0603C104K5RACAUTO is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for automotive applications meeting AEC-Q200 standard, it comes in SMT package with matte tin finish and wraparound terminals.
2N2222A
Central Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Transistor Application: SWITCHING; Transistor Element Material: SILICON;
Diotec Electronics
CSNF651
Honeywell Sensing And Control
CSNF651 by Honeywell Sensing And Control is an industrial-grade analog circuit with 3 terminals. It operates b/w -40 to 85°C, supporting supply voltages from -15V to 15V. Ideal for applications requiring a special shape rectangular package style and through-hole terminal form.
SMBJ18CA
STMicroelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Sensitron Semiconductor
LM555CN
Texas Instruments
LM555CN by Texas Instruments is an Analog Waveform Generation IC with a supply voltage range of 4.5V to 16V. It operates b/w 0°C to 70°C, making it suitable for commercial applications. This rectangular package IC has dual terminals and uses bipolar technology for pulse generation in various electronic circuits.
LM358N
Kec
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Secos
Micropac Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM107H/883
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
5M2210ZF256C4N
Intel
Intel's 5M2210ZF256C4N is a FLASH PLD with 1700 macro cells, 203 I/O lines, and 247.5 MHz clock frequency. Ideal for applications requiring high-speed processing and extensive input/output capabilities in programmable logic devices.
ATF16V8CZ-15JU
Microchip Technology
ATF16V8CZ-15JU by Microchip Technology is a 5.5V PLD with 15ns propagation delay, suitable for industrial applications. Featuring 64 product terms and 8 I/O lines, it operates at up to 45MHz clock frequency in temperatures ranging from -40°C to 85°C. This flash PLD in square chip carrier package offers versatile programmable logic solutions.
EPM3064ATI100-10N
Altera
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;
EPM240T100C3N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
ATF1502ASL-25AU44
Microchip Technology's ATF1502ASL-25AU44 is a 5.5V PLD with 25ns propagation delay, featuring 32 macro cells and 36 inputs. Ideal for PAL-type applications, this EE PLD offers in-system programmability, 30.3MHz clock frequency, and JTAG boundary scan testing capabilities.
M4A5-64/32-10JNC
Lattice Semiconductor
M4A5-64/32-10JNC by Lattice Semiconductor is a 64 macrocell EE PLD with 32 I/O lines, operating at up to 62.5 MHz. It features a propagation delay of 10 ns and can be in-system programmable. Ideal for applications requiring fast processing speeds and versatile I/O configurations in commercial-grade environments.
XC2C128-7VQ100C
Xilinx
XC2C128-7VQ100C by Xilinx is a 128 macrocell FLASH PLD with 80 I/O lines, 7.5 ns propagation delay, and 119 MHz max clock frequency. Ideal for applications requiring in-system programmability and PLA-type architecture in commercial-grade environments.
SLG46538V
Dialog Semiconductor
OT PLD; Form Of Terminal: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: RECTANGULAR; Minimum Supply Voltage: 1.71 V;
EPM240F100I5N
Intel's EPM240F100I5N is a FLASH PLD with 192 macro cells, 80 inputs/outputs, and 7.5ns propagation delay. Ideal for applications requiring in-system programmability, it operates b/w -40 to 100°C and has a low profile grid array package style.
XCR3128XL-10VQG100I
Xilinx XCR3128XL-10VQG100I is a 128 macrocell EE PLD with 84 I/O lines. It operates at max clock frequency of 95 MHz, with propagation delay of 10 ns. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing.
EPM3256AQC208-10N
The Altera EPM3256AQC208-10N is a programmable logic device with 256 macro cells. It has a maximum supply voltage of 3.6V and a propagation delay of 10ns. This CMOS technology-based device is in a square package shape with gull-wing terminals. It is in-system programmable and has an output function of macrocell. The device operates at temperatures between 0°C to 70°C and has a maximum clock frequency of 95.2MHz.
EPM7128SQC100-7N
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: RECTANGULAR;
ATF1504ASVL-20AC100
Atmel
Atmel ATF1504ASVL-20AC100 is a 64-macrocell EE PLD with 20ns propagation delay, operating at 3.3V. Ideal for applications requiring in-system programmability and JTAG boundary scan testing, it features a max clock frequency of 83.3MHz and operates within a temperature range of 0-70°C.
M4A5-64/32-12VI48
Vantis
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 48; Package Code: QFP; Package Shape: SQUARE;
5M2210ZF256I5N
Intel's 5M2210ZF256I5N is a FLASH PLD with 1700 macro cells, 203 I/O lines, and 201.1 MHz clock frequency. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing capabilities.
EPM1270GT144C4N
Intel EPM1270GT144C4N is a PLD with 980 macro cells, 116 inputs/outputs, and 8.1 ns propagation delay. Ideal for applications requiring in-system programmability, such as digital signal processing and telecommunications systems.
5M80ZM68C5N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 68; Package Code: TFBGA; Package Shape: SQUARE;
ATF750CL-15JU
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;
5M570ZT100I5
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
EPF10K20RC240-4
Intel's EPF10K20RC240-4 is a PLD with 1152 logic cells, 0.6 ns propagation delay, and 67.11 MHz max clock frequency. Ideal for applications requiring high-speed processing and complex logic functions in commercial temperature environments. Features include 189 I/O lines, 4 dedicated inputs, and a flatpack package style with gull wing terminals.
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XC2C128-6VQG100C
XC2C128-6VQG100C by Xilinx is a 128 macrocell FLASH PLD with 80 I/O lines, operating at 152 MHz. It features a propagation delay of 6 ns and can be used in applications requiring programmable logic devices with in-system programmability and JTAG boundary scan testing capabilities.
XC2C64A-7VQG44C
XC2C64A-7VQG44C by Xilinx is a programmable logic device (PLD) with 64 macro cells. It uses CMOS technology and has a max clock frequency of 200 MHz. This PLD is commonly used for in-system programmable applications requiring high-speed processing.
XC2C128-7VQG100C
XC2C128-7VQG100C by Xilinx is a 128 macrocell FLASH PLD with 80 I/O lines, 7.5 ns propagation delay, and 119 MHz clock frequency. Ideal for applications requiring in-system programmability, it features a CMOS technology and operates b/w -40 to +70 °C.
XC2C256-7VQG100C
XC2C256-7VQG100C by Xilinx is a 256 macrocell CMOS PLD with 80 inputs/outputs, 108 MHz clock frequency, and 7.5 ns propagation delay. Ideal for applications requiring in-system programmability, such as digital signal processing and telecommunications systems.
XC2C384-10TQG144C
FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XC2C64A-7VQG44I
XC2C64A-7VQG44I by Xilinx is a 64 macrocell FLASH PLD with 7.5 ns propagation delay, operating at 200 MHz. Ideal for industrial applications, it features in-system programmability, 33 I/O lines, and JTAG boundary scan test capability.
XC2C64A-7QFG48I
XC2C64A-7QFG48I by Xilinx is a 64 macrocell FLASH PLD with 7.5 ns propagation delay, operating at up to 200 MHz. Ideal for industrial applications, it features in-system programmability and 37 I/O lines, packaged in a square chip carrier with a very thin profile.
XC2C256-7TQG144C
XC2C256-7TQG144C by Xilinx is a 256 macrocell FLASH PLD with 118 I/O lines, operating at 108 MHz. It features a propagation delay of 7.5 ns and can be used in applications requiring fast processing speeds and high I/O capabilities, such as digital signal processing and telecommunications systems.
XC2C128-7VQG100I
XC2C128-7VQG100I by Xilinx is a 128 macrocell FLASH PLD with 80 I/O lines, 7.5 ns propagation delay, and 119 MHz max clock frequency. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing in a compact square package with gull wing terminals.
XC2C256-7VQG100I
The Xilinx XC2C256-7VQG100I is a 256 macrocell programmable logic device with 80 inputs/outputs, operating at a max clock frequency of 108 MHz. It features a propagation delay of 7.5 ns and is suitable for applications requiring in-system programmability and JTAG boundary scan testing in industrial environments.
XC2C64A-7QFG48C
XC2C64A-7QFG48C by Xilinx is a 64-macrocell FLASH PLD with 7.5 ns propagation delay, operating at up to 200 MHz. It features in-system programmability and offers 37 I/O lines for various applications requiring fast processing speeds and low power consumption. Ideal for commercial use, this PLD has a compact square chip carrier package with a very thin profile, making it suitable for space-constrained designs.
XC2C64A-5VQG44C
XC2C64A-5VQG44C by Xilinx is a 64 macrocell FLASH PLD with 5 ns propagation delay, operating at up to 333 MHz. Ideal for applications requiring in-system programmability and JTAG boundary scan testing, it features a max supply voltage of 1.9 V and operates within a temperature range of 0-70°C.
XC2C384-10TQG144I
Xilinx XC2C384-10TQG144I is a 384 macrocell FLASH PLD with 118 I/O lines, 10 ns propagation delay, and 83 MHz clock frequency. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing in a compact square package.
XC2C256-7TQG144I
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XC2C64A-7VQ100I
XC2C64A-7VQ100I by Xilinx is a 64 macrocell FLASH PLD with 7.5 ns propagation delay, operating at up to 200 MHz. Ideal for industrial applications, it features in-system programmability and 64 I/O lines, packaged in a thin profile square shape with gull wing terminals.
XC2C64A-7VQG100I
XC2C64A-7VQG100C
The Xilinx XC2C64A-7VQG100C is a 64 macrocell FLASH PLD with 7.5 ns propagation delay, operating at up to 200 MHz. Ideal for applications requiring in-system programmability and JTAG boundary scan testing, it features a max supply voltage of 1.9 V and operates within a temperature range of 0°C to 70°C.
XC2C32A-6QFG32I
Xilinx XC2C32A-6QFG32I is a 32 macrocell FLASH PLD with 6 ns propagation delay and 300 MHz max clock frequency. Ideal for industrial applications, it operates at -40 to 85 °C, has 21 I/O lines, and supports JTAG boundary scan testing.
XC2C32A-6VQG44I
XC2C32A-6VQG44I by Xilinx is a programmable logic device (PLD) with 32 macro cells. It uses CMOS technology and has a max clock frequency of 300 MHz. This PLD is commonly used in industrial applications for its high performance and in-system programmability.
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